Abstract
Beyond the conventional hot-wire sensor, a new thermoelectric sensor with ultra-low power consumption without heating is proposed. Using the TSMC 0.35 um CMOS-MEMS process, the thermoelectric sensor is fabricated with 32 pair of central-symmetrical thermocouples positioned. When the fluid passes through the thermopile, the fluid will take away the heat, so that a temperature difference is generated between the cold end and hot end of the thermocouples. The temperature sensor is calibrated and senses the drop of temperature at the center of membrane during the measurement. For different flow velocities, it is interesting to find that the drop of temperature is verified by the output voltage of sensing circuit from thermopile and the same for temperature sensor which behaves as a function of flow velocity. The new approach for the anemometer of sensing flow velocity is realized by our proposed thermopile which is proved to be a practical technique with ultra-low power consumption.
| Original language | English |
|---|---|
| Article number | 012021 |
| Journal | IOP Conference Series: Materials Science and Engineering |
| Volume | 383 |
| Issue number | 1 |
| DOIs | |
| Publication status | Published - 2018 Jul 4 |
| Event | 2018 International Joint Conference on Materials Science and Mechanical Engineering, CMSME 2018 - Bangkok, Thailand Duration: 2018 Feb 24 → 2018 Feb 26 |
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All Science Journal Classification (ASJC) codes
- Materials Science(all)
- Engineering(all)
Cite this
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Research on an ultra-low power thermoelectric-type anemometer. / Shen, Chih Hsiung; Lin, Po Hsuan; Chen, Shu Jung.
In: IOP Conference Series: Materials Science and Engineering, Vol. 383, No. 1, 012021, 04.07.2018.Research output: Contribution to journal › Conference article
TY - JOUR
T1 - Research on an ultra-low power thermoelectric-type anemometer
AU - Shen, Chih Hsiung
AU - Lin, Po Hsuan
AU - Chen, Shu Jung
PY - 2018/7/4
Y1 - 2018/7/4
N2 - Beyond the conventional hot-wire sensor, a new thermoelectric sensor with ultra-low power consumption without heating is proposed. Using the TSMC 0.35 um CMOS-MEMS process, the thermoelectric sensor is fabricated with 32 pair of central-symmetrical thermocouples positioned. When the fluid passes through the thermopile, the fluid will take away the heat, so that a temperature difference is generated between the cold end and hot end of the thermocouples. The temperature sensor is calibrated and senses the drop of temperature at the center of membrane during the measurement. For different flow velocities, it is interesting to find that the drop of temperature is verified by the output voltage of sensing circuit from thermopile and the same for temperature sensor which behaves as a function of flow velocity. The new approach for the anemometer of sensing flow velocity is realized by our proposed thermopile which is proved to be a practical technique with ultra-low power consumption.
AB - Beyond the conventional hot-wire sensor, a new thermoelectric sensor with ultra-low power consumption without heating is proposed. Using the TSMC 0.35 um CMOS-MEMS process, the thermoelectric sensor is fabricated with 32 pair of central-symmetrical thermocouples positioned. When the fluid passes through the thermopile, the fluid will take away the heat, so that a temperature difference is generated between the cold end and hot end of the thermocouples. The temperature sensor is calibrated and senses the drop of temperature at the center of membrane during the measurement. For different flow velocities, it is interesting to find that the drop of temperature is verified by the output voltage of sensing circuit from thermopile and the same for temperature sensor which behaves as a function of flow velocity. The new approach for the anemometer of sensing flow velocity is realized by our proposed thermopile which is proved to be a practical technique with ultra-low power consumption.
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U2 - 10.1088/1757-899X/383/1/012021
DO - 10.1088/1757-899X/383/1/012021
M3 - Conference article
AN - SCOPUS:85050497832
VL - 383
JO - IOP Conference Series: Materials Science and Engineering
JF - IOP Conference Series: Materials Science and Engineering
SN - 1757-8981
IS - 1
M1 - 012021
ER -