Real time monitoring of thickness of silicon membrane during wet etching using a novel surface acoustic wave sensor

Chi Yuan Lee, Tsung Tsong Wu, Yung Yu Chen, Ying Chou Cheng, Wen-Jong Chen, Shih Yung Pao, Pei Zen Chang, Ping Hei Chen, Kai Hsiang Yen, Fu Yuan Xiao

Research output: Contribution to journalConference article

1 Citation (Scopus)

Abstract

This study presents a novel method based on the surface acoustic wave (SAW) sensor, for monitoring the thickness of a silicon membrane in real time during wet etching. Similar to accelerometers and pressure sensors, some micro-electro-mechanical systems (MEMS) devices require the thickness of silicon membranes to be known precisely. Precisely controlling the thickness of a silicon membrane during wet etching is important, because the thickness strongly affects post-processing and device performance. Moreover, the proposed surface acoustic wave sensor allows the thickness of a silicon membrane to be monitored from a few μm to hundreds of μm in situ, which depends on the periodicity of interdigital transducers (IDT). A novel method, which differs from any in previous work on etch-stop techniques, is developed in-situ for monitoring the thickness of a silicon membrane during wet etching. In summary, the proposed method for measuring the thickness of a silicon membrane in real time, is highly accurate; is simple to implement, and can be mass-produced. This work also describes the principles of the method used, detailed process flows, the method of taking measurements and the simulated and experimental results. The theoretical and measured values differ by an error of less than 2.50μm, so the results closely agree with each other.

Original languageEnglish
Pages (from-to)319-330
Number of pages12
JournalProceedings of SPIE - The International Society for Optical Engineering
Volume5455
DOIs
Publication statusPublished - 2004 Dec 2
EventMEM, MOEMS, and Micromachining - Strasbourg, France
Duration: 2004 Apr 292004 Apr 30

Fingerprint

Real-time Monitoring
Surface Acoustic Wave
Wet etching
Silicon
Etching
Surface waves
Membrane
etching
Acoustic waves
membranes
Membranes
Sensor
acoustics
Monitoring
sensors
Sensors
silicon
interdigital transducers
Pressure sensors
Pressure Sensor

All Science Journal Classification (ASJC) codes

  • Electronic, Optical and Magnetic Materials
  • Condensed Matter Physics
  • Computer Science Applications
  • Applied Mathematics
  • Electrical and Electronic Engineering

Cite this

Lee, Chi Yuan ; Wu, Tsung Tsong ; Chen, Yung Yu ; Cheng, Ying Chou ; Chen, Wen-Jong ; Pao, Shih Yung ; Chang, Pei Zen ; Chen, Ping Hei ; Yen, Kai Hsiang ; Xiao, Fu Yuan. / Real time monitoring of thickness of silicon membrane during wet etching using a novel surface acoustic wave sensor. In: Proceedings of SPIE - The International Society for Optical Engineering. 2004 ; Vol. 5455. pp. 319-330.
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abstract = "This study presents a novel method based on the surface acoustic wave (SAW) sensor, for monitoring the thickness of a silicon membrane in real time during wet etching. Similar to accelerometers and pressure sensors, some micro-electro-mechanical systems (MEMS) devices require the thickness of silicon membranes to be known precisely. Precisely controlling the thickness of a silicon membrane during wet etching is important, because the thickness strongly affects post-processing and device performance. Moreover, the proposed surface acoustic wave sensor allows the thickness of a silicon membrane to be monitored from a few μm to hundreds of μm in situ, which depends on the periodicity of interdigital transducers (IDT). A novel method, which differs from any in previous work on etch-stop techniques, is developed in-situ for monitoring the thickness of a silicon membrane during wet etching. In summary, the proposed method for measuring the thickness of a silicon membrane in real time, is highly accurate; is simple to implement, and can be mass-produced. This work also describes the principles of the method used, detailed process flows, the method of taking measurements and the simulated and experimental results. The theoretical and measured values differ by an error of less than 2.50μm, so the results closely agree with each other.",
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Real time monitoring of thickness of silicon membrane during wet etching using a novel surface acoustic wave sensor. / Lee, Chi Yuan; Wu, Tsung Tsong; Chen, Yung Yu; Cheng, Ying Chou; Chen, Wen-Jong; Pao, Shih Yung; Chang, Pei Zen; Chen, Ping Hei; Yen, Kai Hsiang; Xiao, Fu Yuan.

In: Proceedings of SPIE - The International Society for Optical Engineering, Vol. 5455, 02.12.2004, p. 319-330.

Research output: Contribution to journalConference article

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AU - Lee, Chi Yuan

AU - Wu, Tsung Tsong

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AU - Cheng, Ying Chou

AU - Chen, Wen-Jong

AU - Pao, Shih Yung

AU - Chang, Pei Zen

AU - Chen, Ping Hei

AU - Yen, Kai Hsiang

AU - Xiao, Fu Yuan

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Y1 - 2004/12/2

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