Prognostic-based reliability assessment of a wafer handling robot arm using Wiener stochastic process model and Monte Carlo simulation

Jian Hua Huang, Hui Min Cheng, Yi Ru Li, Kuan Jung Chung

Research output: Chapter in Book/Report/Conference proceedingConference contribution

1 Citation (Scopus)

Abstract

In this study a Charge-coupled Device (CCD)- based robot arm fault diagnostic system was created, and a prognostic and health management (PHM) model was developed to predict the Mean-Time-to-Failure (MTTF) and Residual Useful Life (RUL) of the wafer handling robot arm. The prognostic results are used to evaluate the healthy state of the robot arm prior to maintenance. The observation of real random eccentric path of the robot arm based on the data collection from the handling position measurement represented the random walk likely and thus the Wiener stochastic process model was applied. The random sampling simulation called Monte Carlo method with the control of the uncertainty is also used to simulate all possible paths to the failure threshold. The MTTF and RUL are calculated for each prediction from the PDF on the threshold level. It is noted that the robot arm is in a healthy state to handling wafers according to the results of prognosis. The handling test of the robot arm runs continually and more measurement data were collected to validate the PHM model.

Original languageEnglish
Title of host publicationProceedings - 24th ISSAT International Conference on Reliability and Quality in Design
EditorsHoang Pham
PublisherInternational Society of Science and Applied Technologies
Pages1-5
Number of pages5
ISBN (Electronic)9780991057658
Publication statusPublished - 2018 Jan 1
Event24th ISSAT International Conference on Reliability and Quality in Design - Toronto, Canada
Duration: 2018 Aug 22018 Aug 4

Publication series

NameProceedings - 24th ISSAT International Conference on Reliability and Quality in Design

Other

Other24th ISSAT International Conference on Reliability and Quality in Design
CountryCanada
CityToronto
Period18-08-0218-08-04

All Science Journal Classification (ASJC) codes

  • Safety, Risk, Reliability and Quality

Fingerprint Dive into the research topics of 'Prognostic-based reliability assessment of a wafer handling robot arm using Wiener stochastic process model and Monte Carlo simulation'. Together they form a unique fingerprint.

  • Cite this

    Huang, J. H., Cheng, H. M., Li, Y. R., & Chung, K. J. (2018). Prognostic-based reliability assessment of a wafer handling robot arm using Wiener stochastic process model and Monte Carlo simulation. In H. Pham (Ed.), Proceedings - 24th ISSAT International Conference on Reliability and Quality in Design (pp. 1-5). (Proceedings - 24th ISSAT International Conference on Reliability and Quality in Design). International Society of Science and Applied Technologies.