Position determination of a ball grid array by automated optical inspection method

Yi Chuan Lin, Kerwin Wang

Research output: Chapter in Book/Report/Conference proceedingConference contribution

Abstract

This paper introduces a novel automated optical inspection (AOI) method to measure the positions and diameters of micro-solder balls of a ball grid array (BGA). The method is focused on the refinement of optical configuration, image acquisition platform design to improve the time efficiency of AOI. We use a white LED ring as a light source. It is combined with the platform. The system can perform multiple image processing and object detection steps to locate the center of each ball. This paper also presents two methods to estimate the diameters of the balls. A dummy BGA, consists of misaligned solder balls, are assembled to a conductive substrate to evaluate the platform. Test result shows that the platform is capable of performing continuous image acquisition of a 15fps, 640 × 480, 8-bite grayscale video.

Original languageEnglish
Title of host publication9th IEEE International Conference on Nano/Micro Engineered and Molecular Systems, IEEE-NEMS 2014
PublisherInstitute of Electrical and Electronics Engineers Inc.
Pages97-101
Number of pages5
ISBN (Electronic)9781479947270
DOIs
Publication statusPublished - 2014 Jan 1
Event9th IEEE International Conference on Nano/Micro Engineered and Molecular Systems, IEEE-NEMS 2014 - Waikiki Beach, United States
Duration: 2014 Apr 132014 Apr 16

Other

Other9th IEEE International Conference on Nano/Micro Engineered and Molecular Systems, IEEE-NEMS 2014
CountryUnited States
CityWaikiki Beach
Period14-04-1314-04-16

All Science Journal Classification (ASJC) codes

  • Control and Systems Engineering
  • Electrical and Electronic Engineering

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