Abstract
The authors describe their design for a paddlelike cantilever beam sample to relieve non-uniform stress distribution in beam-bending tests of the mechanical properties of thin film applications to MEMS. We added the sample to a custom-designed system equipped with an electrostatic panel and optical interferometer. The system overcomes problems associated with using nano-indentation for testing, and reduces errors tied to the amount of contact force required to bend the beam. Accurate paddle cantilever beam deflection was obtained using a four-step phase-shifting process with a Michelson interferometer. Film strain was determined using a simple force equilibrium equation. Residual stresses were measured at -41.3 MPa for 150 nm silver film, -3.2 MPa for 150 nm gold film, and - 16.8 MPa for 150 nm copper film. We observed residual stresses for copper films at different thicknesses. The results indicate high tensile stress forms during the early deposition stage for thin copper film due to grain coalescence, and a decrease in stress with an increase.
| Original language | English |
|---|---|
| Pages (from-to) | 1131-1137 |
| Number of pages | 7 |
| Journal | Microsystem Technologies |
| Volume | 16 |
| Issue number | 7 |
| DOIs | |
| Publication status | Published - 2010 Jul 1 |
Fingerprint
All Science Journal Classification (ASJC) codes
- Electronic, Optical and Magnetic Materials
- Condensed Matter Physics
- Hardware and Architecture
- Electrical and Electronic Engineering
Cite this
}
Optical micro-paddle beam deflection measurement for electrostatic mechanical testing of nano-scale thin film application to MEMS. / Tong, Chi Jia; Cheng, Ya Chi; Lin, Ming Tzer; Chung, Kuan Jung; Hsu, Jiong Shiun; Wu, Chung Lin.
In: Microsystem Technologies, Vol. 16, No. 7, 01.07.2010, p. 1131-1137.Research output: Contribution to journal › Article
TY - JOUR
T1 - Optical micro-paddle beam deflection measurement for electrostatic mechanical testing of nano-scale thin film application to MEMS
AU - Tong, Chi Jia
AU - Cheng, Ya Chi
AU - Lin, Ming Tzer
AU - Chung, Kuan Jung
AU - Hsu, Jiong Shiun
AU - Wu, Chung Lin
PY - 2010/7/1
Y1 - 2010/7/1
N2 - The authors describe their design for a paddlelike cantilever beam sample to relieve non-uniform stress distribution in beam-bending tests of the mechanical properties of thin film applications to MEMS. We added the sample to a custom-designed system equipped with an electrostatic panel and optical interferometer. The system overcomes problems associated with using nano-indentation for testing, and reduces errors tied to the amount of contact force required to bend the beam. Accurate paddle cantilever beam deflection was obtained using a four-step phase-shifting process with a Michelson interferometer. Film strain was determined using a simple force equilibrium equation. Residual stresses were measured at -41.3 MPa for 150 nm silver film, -3.2 MPa for 150 nm gold film, and - 16.8 MPa for 150 nm copper film. We observed residual stresses for copper films at different thicknesses. The results indicate high tensile stress forms during the early deposition stage for thin copper film due to grain coalescence, and a decrease in stress with an increase.
AB - The authors describe their design for a paddlelike cantilever beam sample to relieve non-uniform stress distribution in beam-bending tests of the mechanical properties of thin film applications to MEMS. We added the sample to a custom-designed system equipped with an electrostatic panel and optical interferometer. The system overcomes problems associated with using nano-indentation for testing, and reduces errors tied to the amount of contact force required to bend the beam. Accurate paddle cantilever beam deflection was obtained using a four-step phase-shifting process with a Michelson interferometer. Film strain was determined using a simple force equilibrium equation. Residual stresses were measured at -41.3 MPa for 150 nm silver film, -3.2 MPa for 150 nm gold film, and - 16.8 MPa for 150 nm copper film. We observed residual stresses for copper films at different thicknesses. The results indicate high tensile stress forms during the early deposition stage for thin copper film due to grain coalescence, and a decrease in stress with an increase.
UR - http://www.scopus.com/inward/record.url?scp=77955848198&partnerID=8YFLogxK
UR - http://www.scopus.com/inward/citedby.url?scp=77955848198&partnerID=8YFLogxK
U2 - 10.1007/s00542-009-0999-7
DO - 10.1007/s00542-009-0999-7
M3 - Article
AN - SCOPUS:77955848198
VL - 16
SP - 1131
EP - 1137
JO - Microsystem Technologies
JF - Microsystem Technologies
SN - 0946-7076
IS - 7
ER -