Optical and thermal analysis for a modified flip-chip light emitted diode

Chuen Ching Wang, Wen-Ren Yang, Jin-Jia Chen, Wei Wen Shih, I. Ju Wang, Tsung Yi Guo, Kwang Long Huang

Research output: Chapter in Book/Report/Conference proceedingConference contribution

1 Citation (Scopus)

Abstract

The proposed design for modified flip-chip LED (Light Emitting Diode) has average coupling efficiency of 49.6% for misalignment of 0.4-3 mm. The designed ambient environment also improves the thermal efficiency by factor of 1.6.

Original languageEnglish
Title of host publication2008 Asia Optical Fiber Communication and Optoelectronic Exposition and Conference, AOE 2008
Publication statusPublished - 2008 Dec 1
Event2008 Asia Optical Fiber Communication and Optoelectronic Exposition and Conference, AOE 2008 - Shanghai, China
Duration: 2008 Oct 302008 Nov 2

Other

Other2008 Asia Optical Fiber Communication and Optoelectronic Exposition and Conference, AOE 2008
CountryChina
CityShanghai
Period08-10-3008-11-02

Fingerprint

Thermoanalysis
Diodes
Light emitting diodes
Hot Temperature

All Science Journal Classification (ASJC) codes

  • Computer Networks and Communications
  • Electrical and Electronic Engineering
  • Electronic, Optical and Magnetic Materials

Cite this

Wang, C. C., Yang, W-R., Chen, J-J., Shih, W. W., Wang, I. J., Guo, T. Y., & Huang, K. L. (2008). Optical and thermal analysis for a modified flip-chip light emitted diode. In 2008 Asia Optical Fiber Communication and Optoelectronic Exposition and Conference, AOE 2008 [5348753]
Wang, Chuen Ching ; Yang, Wen-Ren ; Chen, Jin-Jia ; Shih, Wei Wen ; Wang, I. Ju ; Guo, Tsung Yi ; Huang, Kwang Long. / Optical and thermal analysis for a modified flip-chip light emitted diode. 2008 Asia Optical Fiber Communication and Optoelectronic Exposition and Conference, AOE 2008. 2008.
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title = "Optical and thermal analysis for a modified flip-chip light emitted diode",
abstract = "The proposed design for modified flip-chip LED (Light Emitting Diode) has average coupling efficiency of 49.6{\%} for misalignment of 0.4-3 mm. The designed ambient environment also improves the thermal efficiency by factor of 1.6.",
author = "Wang, {Chuen Ching} and Wen-Ren Yang and Jin-Jia Chen and Shih, {Wei Wen} and Wang, {I. Ju} and Guo, {Tsung Yi} and Huang, {Kwang Long}",
year = "2008",
month = "12",
day = "1",
language = "English",
isbn = "9781557528636",
booktitle = "2008 Asia Optical Fiber Communication and Optoelectronic Exposition and Conference, AOE 2008",

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Wang, CC, Yang, W-R, Chen, J-J, Shih, WW, Wang, IJ, Guo, TY & Huang, KL 2008, Optical and thermal analysis for a modified flip-chip light emitted diode. in 2008 Asia Optical Fiber Communication and Optoelectronic Exposition and Conference, AOE 2008., 5348753, 2008 Asia Optical Fiber Communication and Optoelectronic Exposition and Conference, AOE 2008, Shanghai, China, 08-10-30.

Optical and thermal analysis for a modified flip-chip light emitted diode. / Wang, Chuen Ching; Yang, Wen-Ren; Chen, Jin-Jia; Shih, Wei Wen; Wang, I. Ju; Guo, Tsung Yi; Huang, Kwang Long.

2008 Asia Optical Fiber Communication and Optoelectronic Exposition and Conference, AOE 2008. 2008. 5348753.

Research output: Chapter in Book/Report/Conference proceedingConference contribution

TY - GEN

T1 - Optical and thermal analysis for a modified flip-chip light emitted diode

AU - Wang, Chuen Ching

AU - Yang, Wen-Ren

AU - Chen, Jin-Jia

AU - Shih, Wei Wen

AU - Wang, I. Ju

AU - Guo, Tsung Yi

AU - Huang, Kwang Long

PY - 2008/12/1

Y1 - 2008/12/1

N2 - The proposed design for modified flip-chip LED (Light Emitting Diode) has average coupling efficiency of 49.6% for misalignment of 0.4-3 mm. The designed ambient environment also improves the thermal efficiency by factor of 1.6.

AB - The proposed design for modified flip-chip LED (Light Emitting Diode) has average coupling efficiency of 49.6% for misalignment of 0.4-3 mm. The designed ambient environment also improves the thermal efficiency by factor of 1.6.

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M3 - Conference contribution

SN - 9781557528636

BT - 2008 Asia Optical Fiber Communication and Optoelectronic Exposition and Conference, AOE 2008

ER -

Wang CC, Yang W-R, Chen J-J, Shih WW, Wang IJ, Guo TY et al. Optical and thermal analysis for a modified flip-chip light emitted diode. In 2008 Asia Optical Fiber Communication and Optoelectronic Exposition and Conference, AOE 2008. 2008. 5348753