Abstract
The proposed design for modified flip-chip LED (Light Emitting Diode) has average coupling efficiency of 49.6% for misalignment of 0.4-3 mm. The designed ambient environment also improves the thermal efficiency by factor of 1.6.
| Original language | English |
|---|---|
| Title of host publication | 2008 Asia Optical Fiber Communication and Optoelectronic Exposition and Conference, AOE 2008 |
| Publication status | Published - 2008 Dec 1 |
| Event | 2008 Asia Optical Fiber Communication and Optoelectronic Exposition and Conference, AOE 2008 - Shanghai, China Duration: 2008 Oct 30 → 2008 Nov 2 |
Other
| Other | 2008 Asia Optical Fiber Communication and Optoelectronic Exposition and Conference, AOE 2008 |
|---|---|
| Country | China |
| City | Shanghai |
| Period | 08-10-30 → 08-11-02 |
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All Science Journal Classification (ASJC) codes
- Computer Networks and Communications
- Electrical and Electronic Engineering
- Electronic, Optical and Magnetic Materials
Cite this
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Optical and thermal analysis for a modified flip-chip light emitted diode. / Wang, Chuen Ching; Yang, Wen-Ren; Chen, Jin-Jia; Shih, Wei Wen; Wang, I. Ju; Guo, Tsung Yi; Huang, Kwang Long.
2008 Asia Optical Fiber Communication and Optoelectronic Exposition and Conference, AOE 2008. 2008. 5348753.Research output: Chapter in Book/Report/Conference proceeding › Conference contribution
TY - GEN
T1 - Optical and thermal analysis for a modified flip-chip light emitted diode
AU - Wang, Chuen Ching
AU - Yang, Wen-Ren
AU - Chen, Jin-Jia
AU - Shih, Wei Wen
AU - Wang, I. Ju
AU - Guo, Tsung Yi
AU - Huang, Kwang Long
PY - 2008/12/1
Y1 - 2008/12/1
N2 - The proposed design for modified flip-chip LED (Light Emitting Diode) has average coupling efficiency of 49.6% for misalignment of 0.4-3 mm. The designed ambient environment also improves the thermal efficiency by factor of 1.6.
AB - The proposed design for modified flip-chip LED (Light Emitting Diode) has average coupling efficiency of 49.6% for misalignment of 0.4-3 mm. The designed ambient environment also improves the thermal efficiency by factor of 1.6.
UR - http://www.scopus.com/inward/record.url?scp=74549189349&partnerID=8YFLogxK
UR - http://www.scopus.com/inward/citedby.url?scp=74549189349&partnerID=8YFLogxK
M3 - Conference contribution
SN - 9781557528636
BT - 2008 Asia Optical Fiber Communication and Optoelectronic Exposition and Conference, AOE 2008
ER -