Optical and thermal analysis for a modified flip-chip light emitted diode

Chuen Ching Wang, Wen-Ren Yang, Jin-Jia Chen, Wei Wen Shih, I. Ju Wang, Tsung Yi Guo, Kwang Long Huang

Research output: Chapter in Book/Report/Conference proceedingConference contribution

1 Citation (Scopus)

Abstract

The proposed design for modified flip-chip LED (Light Emitting Diode) has average coupling efficiency of 49.6% for misalignment of 0.4-3 mm. The designed ambient environment also improves the thermal efficiency by factor of 1.6.

Original languageEnglish
Title of host publication2008 Asia Optical Fiber Communication and Optoelectronic Exposition and Conference, AOE 2008
Publication statusPublished - 2008 Dec 1
Event2008 Asia Optical Fiber Communication and Optoelectronic Exposition and Conference, AOE 2008 - Shanghai, China
Duration: 2008 Oct 302008 Nov 2

Other

Other2008 Asia Optical Fiber Communication and Optoelectronic Exposition and Conference, AOE 2008
CountryChina
CityShanghai
Period08-10-3008-11-02

All Science Journal Classification (ASJC) codes

  • Computer Networks and Communications
  • Electrical and Electronic Engineering
  • Electronic, Optical and Magnetic Materials

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  • Cite this

    Wang, C. C., Yang, W-R., Chen, J-J., Shih, W. W., Wang, I. J., Guo, T. Y., & Huang, K. L. (2008). Optical and thermal analysis for a modified flip-chip light emitted diode. In 2008 Asia Optical Fiber Communication and Optoelectronic Exposition and Conference, AOE 2008 [5348753]