Optical and thermal analysis for a modified flip-chip light emitted diode

Chuen Ching Wang; Wen-Ren Yang; Jin-Jia Chen; Wei Wen Shih; I. Ju Wang; Tsung Yi Guo; Kwang Long Huang

Optical and thermal analysis for a modified flip-chip light emitted diode

Chuen Ching Wang, Wen-Ren Yang, Jin-Jia Chen, Wei Wen Shih, I. Ju Wang, Tsung Yi Guo, Kwang Long Huang

Department of Electrical Engineering

Research output: Chapter in Book/Report/Conference proceeding › Conference contribution

1 Citation (Scopus)

Abstract

The proposed design for modified flip-chip LED (Light Emitting Diode) has average coupling efficiency of 49.6% for misalignment of 0.4-3 mm. The designed ambient environment also improves the thermal efficiency by factor of 1.6.

Original language	English
Title of host publication	2008 Asia Optical Fiber Communication and Optoelectronic Exposition and Conference, AOE 2008
Publication status	Published - 2008 Dec 1
Event	2008 Asia Optical Fiber Communication and Optoelectronic Exposition and Conference, AOE 2008 - Shanghai, China Duration: 2008 Oct 30 → 2008 Nov 2

Other

Other	2008 Asia Optical Fiber Communication and Optoelectronic Exposition and Conference, AOE 2008
Country	China
City	Shanghai
Period	08-10-30 → 08-11-02

All Science Journal Classification (ASJC) codes

Computer Networks and Communications
Electrical and Electronic Engineering
Electronic, Optical and Magnetic Materials

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@inproceedings{c0a40ff1b0e34933a5843b892869fd75,

title = "Optical and thermal analysis for a modified flip-chip light emitted diode",

abstract = "The proposed design for modified flip-chip LED (Light Emitting Diode) has average coupling efficiency of 49.6% for misalignment of 0.4-3 mm. The designed ambient environment also improves the thermal efficiency by factor of 1.6.",

author = "Wang, {Chuen Ching} and Wen-Ren Yang and Jin-Jia Chen and Shih, {Wei Wen} and Wang, {I. Ju} and Guo, {Tsung Yi} and Huang, {Kwang Long}",

year = "2008",

month = dec,

day = "1",

language = "English",

isbn = "9781557528636",

booktitle = "2008 Asia Optical Fiber Communication and Optoelectronic Exposition and Conference, AOE 2008",

note = "2008 Asia Optical Fiber Communication and Optoelectronic Exposition and Conference, AOE 2008 ; Conference date: 30-10-2008 Through 02-11-2008",

}

Wang, CC, Yang, W-R , Chen, J-J, Shih, WW, Wang, IJ, Guo, TY & Huang, KL 2008, Optical and thermal analysis for a modified flip-chip light emitted diode. in 2008 Asia Optical Fiber Communication and Optoelectronic Exposition and Conference, AOE 2008., 5348753, 2008 Asia Optical Fiber Communication and Optoelectronic Exposition and Conference, AOE 2008, Shanghai, China, 08-10-30.

Optical and thermal analysis for a modified flip-chip light emitted diode. / Wang, Chuen Ching; Yang, Wen-Ren ; Chen, Jin-Jia; Shih, Wei Wen; Wang, I. Ju; Guo, Tsung Yi; Huang, Kwang Long.

2008 Asia Optical Fiber Communication and Optoelectronic Exposition and Conference, AOE 2008. 2008. 5348753.

Research output: Chapter in Book/Report/Conference proceeding › Conference contribution

TY - GEN

T1 - Optical and thermal analysis for a modified flip-chip light emitted diode

AU - Wang, Chuen Ching

AU - Yang, Wen-Ren

AU - Chen, Jin-Jia

AU - Shih, Wei Wen

AU - Wang, I. Ju

AU - Guo, Tsung Yi

AU - Huang, Kwang Long

PY - 2008/12/1

Y1 - 2008/12/1

N2 - The proposed design for modified flip-chip LED (Light Emitting Diode) has average coupling efficiency of 49.6% for misalignment of 0.4-3 mm. The designed ambient environment also improves the thermal efficiency by factor of 1.6.

AB - The proposed design for modified flip-chip LED (Light Emitting Diode) has average coupling efficiency of 49.6% for misalignment of 0.4-3 mm. The designed ambient environment also improves the thermal efficiency by factor of 1.6.

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UR - http://www.scopus.com/inward/citedby.url?scp=74549189349&partnerID=8YFLogxK

M3 - Conference contribution

AN - SCOPUS:74549189349

SN - 9781557528636

BT - 2008 Asia Optical Fiber Communication and Optoelectronic Exposition and Conference, AOE 2008

T2 - 2008 Asia Optical Fiber Communication and Optoelectronic Exposition and Conference, AOE 2008

Y2 - 30 October 2008 through 2 November 2008

ER -