Abstract
The proposed design for modified flip-chip LED (Light Emitting Diode) has average coupling efficiency of 49.6% for misalignment of 0.4-3 mm. The designed ambient environment also improves the thermal efficiency by factor of 1.6.
| Original language | English |
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| Title of host publication | 2008 Asia Optical Fiber Communication and Optoelectronic Exposition and Conference, AOE 2008 |
| Publication status | Published - 2008 Dec 1 |
| Event | 2008 Asia Optical Fiber Communication and Optoelectronic Exposition and Conference, AOE 2008 - Shanghai, China Duration: 2008 Oct 30 → 2008 Nov 2 |
Other
| Other | 2008 Asia Optical Fiber Communication and Optoelectronic Exposition and Conference, AOE 2008 |
|---|---|
| Country | China |
| City | Shanghai |
| Period | 08-10-30 → 08-11-02 |
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All Science Journal Classification (ASJC) codes
- Computer Networks and Communications
- Electrical and Electronic Engineering
- Electronic, Optical and Magnetic Materials
Cite this
Wang, C. C., Yang, W-R., Chen, J-J., Shih, W. W., Wang, I. J., Guo, T. Y., & Huang, K. L. (2008). Optical and thermal analysis for a modified flip-chip light emitted diode. In 2008 Asia Optical Fiber Communication and Optoelectronic Exposition and Conference, AOE 2008 [5348753]