Abstract
The proposed design for modified flip-chip LED (Light Emitting Diode) has average coupling efficiency of 49.6% for misalignment of 0.4~3 mm. The designed ambient environment also improves the thermal efficiency by factor of 1.6.
Original language | English |
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Title of host publication | Asia Optical Fiber Communication and Optoelectronic Exposition and Conference, AOE 2008 |
Publisher | Optical Society of America |
ISBN (Print) | 9781557528636 |
Publication status | Published - 2008 Jan 1 |
Event | Asia Optical Fiber Communication and Optoelectronic Exposition and Conference, AOE 2008 - Shanghai, China Duration: 2008 Oct 30 → 2008 Nov 2 |
Publication series
Name | Optics InfoBase Conference Papers |
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ISSN (Electronic) | 2162-2701 |
Other
Other | Asia Optical Fiber Communication and Optoelectronic Exposition and Conference, AOE 2008 |
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Country | China |
City | Shanghai |
Period | 08-10-30 → 08-11-02 |
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All Science Journal Classification (ASJC) codes
- Instrumentation
- Atomic and Molecular Physics, and Optics
Cite this
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Optical and thermal analysis for a modified flip-chip light emitting diode. / Wang, Chuen Ching; Yang, Wen Ren; Chen, Jin Jia; Shih, Wei Wen; Wang, I. Ju; Guo, Tzong Yih; Huang, Kuang Lung.
Asia Optical Fiber Communication and Optoelectronic Exposition and Conference, AOE 2008. Optical Society of America, 2008. (Optics InfoBase Conference Papers).Research output: Chapter in Book/Report/Conference proceeding › Conference contribution
TY - GEN
T1 - Optical and thermal analysis for a modified flip-chip light emitting diode
AU - Wang, Chuen Ching
AU - Yang, Wen Ren
AU - Chen, Jin Jia
AU - Shih, Wei Wen
AU - Wang, I. Ju
AU - Guo, Tzong Yih
AU - Huang, Kuang Lung
PY - 2008/1/1
Y1 - 2008/1/1
N2 - The proposed design for modified flip-chip LED (Light Emitting Diode) has average coupling efficiency of 49.6% for misalignment of 0.4~3 mm. The designed ambient environment also improves the thermal efficiency by factor of 1.6.
AB - The proposed design for modified flip-chip LED (Light Emitting Diode) has average coupling efficiency of 49.6% for misalignment of 0.4~3 mm. The designed ambient environment also improves the thermal efficiency by factor of 1.6.
UR - http://www.scopus.com/inward/record.url?scp=84898623881&partnerID=8YFLogxK
UR - http://www.scopus.com/inward/citedby.url?scp=84898623881&partnerID=8YFLogxK
M3 - Conference contribution
AN - SCOPUS:84898623881
SN - 9781557528636
T3 - Optics InfoBase Conference Papers
BT - Asia Optical Fiber Communication and Optoelectronic Exposition and Conference, AOE 2008
PB - Optical Society of America
ER -