Optical and thermal analysis for a modified flip-chip light emitting diode

Chuen Ching Wang, Wen Ren Yang, Jin Jia Chen, Wei Wen Shih, I. Ju Wang, Tzong Yih Guo, Kuang Lung Huang

Research output: Chapter in Book/Report/Conference proceedingConference contribution

Abstract

The proposed design for modified flip-chip LED (Light Emitting Diode) has average coupling efficiency of 49.6% for misalignment of 0.4~3 mm. The designed ambient environment also improves the thermal efficiency by factor of 1.6.

Original languageEnglish
Title of host publicationAsia Optical Fiber Communication and Optoelectronic Exposition and Conference, AOE 2008
PublisherOptical Society of America
ISBN (Print)9781557528636
Publication statusPublished - 2008 Jan 1
EventAsia Optical Fiber Communication and Optoelectronic Exposition and Conference, AOE 2008 - Shanghai, China
Duration: 2008 Oct 302008 Nov 2

Publication series

NameOptics InfoBase Conference Papers
ISSN (Electronic)2162-2701

Other

OtherAsia Optical Fiber Communication and Optoelectronic Exposition and Conference, AOE 2008
CountryChina
CityShanghai
Period08-10-3008-11-02

Fingerprint

thermodynamic efficiency
misalignment
Thermoanalysis
Light emitting diodes
thermal analysis
light emitting diodes
chips
Hot Temperature

All Science Journal Classification (ASJC) codes

  • Instrumentation
  • Atomic and Molecular Physics, and Optics

Cite this

Wang, C. C., Yang, W. R., Chen, J. J., Shih, W. W., Wang, I. J., Guo, T. Y., & Huang, K. L. (2008). Optical and thermal analysis for a modified flip-chip light emitting diode. In Asia Optical Fiber Communication and Optoelectronic Exposition and Conference, AOE 2008 (Optics InfoBase Conference Papers). Optical Society of America.
Wang, Chuen Ching ; Yang, Wen Ren ; Chen, Jin Jia ; Shih, Wei Wen ; Wang, I. Ju ; Guo, Tzong Yih ; Huang, Kuang Lung. / Optical and thermal analysis for a modified flip-chip light emitting diode. Asia Optical Fiber Communication and Optoelectronic Exposition and Conference, AOE 2008. Optical Society of America, 2008. (Optics InfoBase Conference Papers).
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title = "Optical and thermal analysis for a modified flip-chip light emitting diode",
abstract = "The proposed design for modified flip-chip LED (Light Emitting Diode) has average coupling efficiency of 49.6{\%} for misalignment of 0.4~3 mm. The designed ambient environment also improves the thermal efficiency by factor of 1.6.",
author = "Wang, {Chuen Ching} and Yang, {Wen Ren} and Chen, {Jin Jia} and Shih, {Wei Wen} and Wang, {I. Ju} and Guo, {Tzong Yih} and Huang, {Kuang Lung}",
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month = "1",
day = "1",
language = "English",
isbn = "9781557528636",
series = "Optics InfoBase Conference Papers",
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Wang, CC, Yang, WR, Chen, JJ, Shih, WW, Wang, IJ, Guo, TY & Huang, KL 2008, Optical and thermal analysis for a modified flip-chip light emitting diode. in Asia Optical Fiber Communication and Optoelectronic Exposition and Conference, AOE 2008. Optics InfoBase Conference Papers, Optical Society of America, Asia Optical Fiber Communication and Optoelectronic Exposition and Conference, AOE 2008, Shanghai, China, 08-10-30.

Optical and thermal analysis for a modified flip-chip light emitting diode. / Wang, Chuen Ching; Yang, Wen Ren; Chen, Jin Jia; Shih, Wei Wen; Wang, I. Ju; Guo, Tzong Yih; Huang, Kuang Lung.

Asia Optical Fiber Communication and Optoelectronic Exposition and Conference, AOE 2008. Optical Society of America, 2008. (Optics InfoBase Conference Papers).

Research output: Chapter in Book/Report/Conference proceedingConference contribution

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T1 - Optical and thermal analysis for a modified flip-chip light emitting diode

AU - Wang, Chuen Ching

AU - Yang, Wen Ren

AU - Chen, Jin Jia

AU - Shih, Wei Wen

AU - Wang, I. Ju

AU - Guo, Tzong Yih

AU - Huang, Kuang Lung

PY - 2008/1/1

Y1 - 2008/1/1

N2 - The proposed design for modified flip-chip LED (Light Emitting Diode) has average coupling efficiency of 49.6% for misalignment of 0.4~3 mm. The designed ambient environment also improves the thermal efficiency by factor of 1.6.

AB - The proposed design for modified flip-chip LED (Light Emitting Diode) has average coupling efficiency of 49.6% for misalignment of 0.4~3 mm. The designed ambient environment also improves the thermal efficiency by factor of 1.6.

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M3 - Conference contribution

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SN - 9781557528636

T3 - Optics InfoBase Conference Papers

BT - Asia Optical Fiber Communication and Optoelectronic Exposition and Conference, AOE 2008

PB - Optical Society of America

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Wang CC, Yang WR, Chen JJ, Shih WW, Wang IJ, Guo TY et al. Optical and thermal analysis for a modified flip-chip light emitting diode. In Asia Optical Fiber Communication and Optoelectronic Exposition and Conference, AOE 2008. Optical Society of America. 2008. (Optics InfoBase Conference Papers).