Optical and thermal analysis for a modified flip-chip light emitting diode

Chuen Ching Wang, Wen Ren Yang, Jin Jia Chen, Wei Wen Shih, I. Ju Wang, Tzong Yih Guo, Kuang Lung Huang

Research output: Chapter in Book/Report/Conference proceedingConference contribution

Abstract

The proposed design for modified flip-chip LED (Light Emitting Diode) has average coupling efficiency of 49.6% for misalignment of 0.4~3 mm. The designed ambient environment also improves the thermal efficiency by factor of 1.6.

Original languageEnglish
Title of host publicationAsia Optical Fiber Communication and Optoelectronic Exposition and Conference, AOE 2008
PublisherOptical Society of America
ISBN (Print)9781557528636
Publication statusPublished - 2008 Jan 1
EventAsia Optical Fiber Communication and Optoelectronic Exposition and Conference, AOE 2008 - Shanghai, China
Duration: 2008 Oct 302008 Nov 2

Publication series

NameOptics InfoBase Conference Papers
ISSN (Electronic)2162-2701

Other

OtherAsia Optical Fiber Communication and Optoelectronic Exposition and Conference, AOE 2008
CountryChina
CityShanghai
Period08-10-3008-11-02

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All Science Journal Classification (ASJC) codes

  • Instrumentation
  • Atomic and Molecular Physics, and Optics

Cite this

Wang, C. C., Yang, W. R., Chen, J. J., Shih, W. W., Wang, I. J., Guo, T. Y., & Huang, K. L. (2008). Optical and thermal analysis for a modified flip-chip light emitting diode. In Asia Optical Fiber Communication and Optoelectronic Exposition and Conference, AOE 2008 (Optics InfoBase Conference Papers). Optical Society of America.