Abstract
The feasibility of integrating antennas and required circuits to form wireless interconnects in foundry digital CMOS technologies has been demonstrated. The key challenges including the effects of metal structures associated with integrated circuits, heat removal, packaging, and interaction between transmitted and received signals, and nearby circuits appear to be manageable. This technology can potentially be applied for implementation of a true single-chip radio for general purpose communication, on-chip and inter-chip data communication systems, RFID tags, RF sensors/radars, and others.
| Original language | English |
|---|---|
| Pages (from-to) | 1312-1323 |
| Number of pages | 12 |
| Journal | IEEE Transactions on Electron Devices |
| Volume | 52 |
| Issue number | 7 |
| DOIs | |
| Publication status | Published - 2005 Jul 1 |
Fingerprint
All Science Journal Classification (ASJC) codes
- Electronic, Optical and Magnetic Materials
- Electrical and Electronic Engineering
Cite this
}
On-chip antennas in silicon ICs and their application. / Kenneth, K. O.; Kim, Kihong; Floyd, Brian A.; Mehta, Jesal L.; Yoon, Hyun; Hung, Chih Ming; Bravo, Dan; Dickson, Timothy O.; Guo, Xiaoling; Li, Ran; Trichy, Narasimhan; Caserta, Jim; Bomstad, Wayne R.; Branch, Jason; Yang, Dong Jun; Bohorquez, Jose; Seok, Eunyoung; Gao, Li; Sugavanam, Aravind; Lin, Jau-Jr/jau Jr/jau; Chen, Jie; Brewer, J. E.
In: IEEE Transactions on Electron Devices, Vol. 52, No. 7, 01.07.2005, p. 1312-1323.Research output: Contribution to journal › Article
TY - JOUR
T1 - On-chip antennas in silicon ICs and their application
AU - Kenneth, K. O.
AU - Kim, Kihong
AU - Floyd, Brian A.
AU - Mehta, Jesal L.
AU - Yoon, Hyun
AU - Hung, Chih Ming
AU - Bravo, Dan
AU - Dickson, Timothy O.
AU - Guo, Xiaoling
AU - Li, Ran
AU - Trichy, Narasimhan
AU - Caserta, Jim
AU - Bomstad, Wayne R.
AU - Branch, Jason
AU - Yang, Dong Jun
AU - Bohorquez, Jose
AU - Seok, Eunyoung
AU - Gao, Li
AU - Sugavanam, Aravind
AU - Lin, Jau-Jr/jau Jr/jau
AU - Chen, Jie
AU - Brewer, J. E.
PY - 2005/7/1
Y1 - 2005/7/1
N2 - The feasibility of integrating antennas and required circuits to form wireless interconnects in foundry digital CMOS technologies has been demonstrated. The key challenges including the effects of metal structures associated with integrated circuits, heat removal, packaging, and interaction between transmitted and received signals, and nearby circuits appear to be manageable. This technology can potentially be applied for implementation of a true single-chip radio for general purpose communication, on-chip and inter-chip data communication systems, RFID tags, RF sensors/radars, and others.
AB - The feasibility of integrating antennas and required circuits to form wireless interconnects in foundry digital CMOS technologies has been demonstrated. The key challenges including the effects of metal structures associated with integrated circuits, heat removal, packaging, and interaction between transmitted and received signals, and nearby circuits appear to be manageable. This technology can potentially be applied for implementation of a true single-chip radio for general purpose communication, on-chip and inter-chip data communication systems, RFID tags, RF sensors/radars, and others.
UR - http://www.scopus.com/inward/record.url?scp=23944439990&partnerID=8YFLogxK
UR - http://www.scopus.com/inward/citedby.url?scp=23944439990&partnerID=8YFLogxK
U2 - 10.1109/TED.2005.850668
DO - 10.1109/TED.2005.850668
M3 - Article
AN - SCOPUS:23944439990
VL - 52
SP - 1312
EP - 1323
JO - IEEE Transactions on Electron Devices
JF - IEEE Transactions on Electron Devices
SN - 0018-9383
IS - 7
ER -