Numerical simulation and experimental study on bonding tool design of thermosonic transducer for Flip-Chip bonding

Yi Cheng Huang, Kun Yang Li

Research output: Chapter in Book/Report/Conference proceedingConference contribution

Fingerprint Dive into the research topics of 'Numerical simulation and experimental study on bonding tool design of thermosonic transducer for Flip-Chip bonding'. Together they form a unique fingerprint.

Engineering & Materials Science