Numerical simulation and experimental study on bonding tool design of thermosonic transducer for Flip-Chip bonding

Yi Cheng Huang, Kun Yang Li

Research output: Chapter in Book/Report/Conference proceeding › Conference contribution

Abstract

In this paper, the study for the bonding tool position of ultrasonic transducers for thermosonic Flip-Chip LED bonding is presented. Improving the efficiency of ultrasonic transducers plays an important role in the bonding process. To obtain the actual movement of ultrasonic transducer, finite element method ATILA was employed to get more detailed information. To verify the reliability of simulation results, the impedance characteristic and resonance frequency of the transducer mechanical system have been measured using a LCR meter. Moreover, different mounting position of bonding tool on the transducer was studied. Use ATILA to find the best tool position, and vibration amplitude of the tool was measured by Laser Doppeler Vibrometer. Experimental bonding results are verified by in-house shear force test bed.

Original languageEnglish
Title of host publicationMechatronics and Applied Mechanics
Pages1670-1673
Number of pages4
Volume157-158
DOIs
Publication statusPublished - 2012 Mar 16
EventMechatronics and Applied Mechanics - Hong Kong, Hong Kong
Duration: 2011 Dec 27 → 2011 Dec 28

Publication series

NameApplied Mechanics and Materials
Volume157-158
ISSN (Print)1660-9336
ISSN (Electronic)1662-7482

Other

OtherMechatronics and Applied Mechanics
CountryHong Kong
CityHong Kong
Period11-12-27 → 11-12-28

All Science Journal Classification (ASJC) codes

  • Engineering(all)

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