TY - GEN
T1 - Numerical simulation and experimental study on bonding tool design of thermosonic transducer for Flip-Chip bonding
AU - Huang, Yi Cheng
AU - Li, Kun Yang
PY - 2012/3/16
Y1 - 2012/3/16
N2 - In this paper, the study for the bonding tool position of ultrasonic transducers for thermosonic Flip-Chip LED bonding is presented. Improving the efficiency of ultrasonic transducers plays an important role in the bonding process. To obtain the actual movement of ultrasonic transducer, finite element method ATILA was employed to get more detailed information. To verify the reliability of simulation results, the impedance characteristic and resonance frequency of the transducer mechanical system have been measured using a LCR meter. Moreover, different mounting position of bonding tool on the transducer was studied. Use ATILA to find the best tool position, and vibration amplitude of the tool was measured by Laser Doppeler Vibrometer. Experimental bonding results are verified by in-house shear force test bed.
AB - In this paper, the study for the bonding tool position of ultrasonic transducers for thermosonic Flip-Chip LED bonding is presented. Improving the efficiency of ultrasonic transducers plays an important role in the bonding process. To obtain the actual movement of ultrasonic transducer, finite element method ATILA was employed to get more detailed information. To verify the reliability of simulation results, the impedance characteristic and resonance frequency of the transducer mechanical system have been measured using a LCR meter. Moreover, different mounting position of bonding tool on the transducer was studied. Use ATILA to find the best tool position, and vibration amplitude of the tool was measured by Laser Doppeler Vibrometer. Experimental bonding results are verified by in-house shear force test bed.
UR - http://www.scopus.com/inward/record.url?scp=84863249155&partnerID=8YFLogxK
UR - http://www.scopus.com/inward/citedby.url?scp=84863249155&partnerID=8YFLogxK
U2 - 10.4028/www.scientific.net/AMM.157-158.1670
DO - 10.4028/www.scientific.net/AMM.157-158.1670
M3 - Conference contribution
AN - SCOPUS:84863249155
SN - 9783037853801
VL - 157-158
T3 - Applied Mechanics and Materials
SP - 1670
EP - 1673
BT - Mechatronics and Applied Mechanics
T2 - Mechatronics and Applied Mechanics
Y2 - 27 December 2011 through 28 December 2011
ER -