Numerical simulation and experimental study on bonding tool design of thermosonic transducer for Flip-Chip bonding

Yi Cheng Huang; Kun Yang Li

doi:10.4028/www.scientific.net/AMM.157-158.1670

Numerical simulation and experimental study on bonding tool design of thermosonic transducer for Flip-Chip bonding

Yi Cheng Huang, Kun Yang Li

Department of Mechatronic Engineering

Research output: Chapter in Book/Report/Conference proceeding › Conference contribution

Abstract

In this paper, the study for the bonding tool position of ultrasonic transducers for thermosonic Flip-Chip LED bonding is presented. Improving the efficiency of ultrasonic transducers plays an important role in the bonding process. To obtain the actual movement of ultrasonic transducer, finite element method ATILA was employed to get more detailed information. To verify the reliability of simulation results, the impedance characteristic and resonance frequency of the transducer mechanical system have been measured using a LCR meter. Moreover, different mounting position of bonding tool on the transducer was studied. Use ATILA to find the best tool position, and vibration amplitude of the tool was measured by Laser Doppeler Vibrometer. Experimental bonding results are verified by in-house shear force test bed.

Original language	English
Title of host publication	Mechatronics and Applied Mechanics
Pages	1670-1673
Number of pages	4
DOIs	https://doi.org/10.4028/www.scientific.net/AMM.157-158.1670
Publication status	Published - 2012
Event	Mechatronics and Applied Mechanics - Hong Kong, Hong Kong Duration: 2011 Dec 27 → 2011 Dec 28

Publication series

Name	Applied Mechanics and Materials
Volume	157-158
ISSN (Print)	1660-9336
ISSN (Electronic)	1662-7482

Other

Other	Mechatronics and Applied Mechanics
Country	Hong Kong
City	Hong Kong
Period	11-12-27 → 11-12-28

All Science Journal Classification (ASJC) codes

Engineering(all)

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Cite this

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title = "Numerical simulation and experimental study on bonding tool design of thermosonic transducer for Flip-Chip bonding",

abstract = "In this paper, the study for the bonding tool position of ultrasonic transducers for thermosonic Flip-Chip LED bonding is presented. Improving the efficiency of ultrasonic transducers plays an important role in the bonding process. To obtain the actual movement of ultrasonic transducer, finite element method ATILA was employed to get more detailed information. To verify the reliability of simulation results, the impedance characteristic and resonance frequency of the transducer mechanical system have been measured using a LCR meter. Moreover, different mounting position of bonding tool on the transducer was studied. Use ATILA to find the best tool position, and vibration amplitude of the tool was measured by Laser Doppeler Vibrometer. Experimental bonding results are verified by in-house shear force test bed.",

author = "Huang, {Yi Cheng} and Li, {Kun Yang}",

year = "2012",

doi = "10.4028/www.scientific.net/AMM.157-158.1670",

language = "English",

isbn = "9783037853801",

series = "Applied Mechanics and Materials",

pages = "1670--1673",

booktitle = "Mechatronics and Applied Mechanics",

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T1 - Numerical simulation and experimental study on bonding tool design of thermosonic transducer for Flip-Chip bonding

AU - Huang, Yi Cheng

AU - Li, Kun Yang

PY - 2012

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N2 - In this paper, the study for the bonding tool position of ultrasonic transducers for thermosonic Flip-Chip LED bonding is presented. Improving the efficiency of ultrasonic transducers plays an important role in the bonding process. To obtain the actual movement of ultrasonic transducer, finite element method ATILA was employed to get more detailed information. To verify the reliability of simulation results, the impedance characteristic and resonance frequency of the transducer mechanical system have been measured using a LCR meter. Moreover, different mounting position of bonding tool on the transducer was studied. Use ATILA to find the best tool position, and vibration amplitude of the tool was measured by Laser Doppeler Vibrometer. Experimental bonding results are verified by in-house shear force test bed.

AB - In this paper, the study for the bonding tool position of ultrasonic transducers for thermosonic Flip-Chip LED bonding is presented. Improving the efficiency of ultrasonic transducers plays an important role in the bonding process. To obtain the actual movement of ultrasonic transducer, finite element method ATILA was employed to get more detailed information. To verify the reliability of simulation results, the impedance characteristic and resonance frequency of the transducer mechanical system have been measured using a LCR meter. Moreover, different mounting position of bonding tool on the transducer was studied. Use ATILA to find the best tool position, and vibration amplitude of the tool was measured by Laser Doppeler Vibrometer. Experimental bonding results are verified by in-house shear force test bed.

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DO - 10.4028/www.scientific.net/AMM.157-158.1670

M3 - Conference contribution

AN - SCOPUS:84863249155

SN - 9783037853801

T3 - Applied Mechanics and Materials

SP - 1670

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BT - Mechatronics and Applied Mechanics

T2 - Mechatronics and Applied Mechanics

Y2 - 27 December 2011 through 28 December 2011

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