Abstract
The contribution of this work is to propose novel balanced bandpass filters (BPFs) using the half-mode substrate integrated waveguide (HMSIW) and its size-reduced form, a folded HMSIW structure. The size of an HMSIW is about half of the substrate integrated waveguide (SIW) and the size of the folded HMSIW further reduces to 25%. Besides compactness, the proposed BPFs are attractive because the thru-via array needed for providing the side-wall effect is no longer required. In addition, the common-mode (CM) rejection of the HMSIW BPF is achieved from the non-coupling slots, caused by the PMC. The CM rejection of the folded HMSIW BPF is obtained by up-shifting the CM operating frequency far away from the differential-mode (DM) passband. Prototypes of the proposed circuits are fabricated and measured to present CM rejection levels larger than 40 dB over a wide frequency range and DM insertion losses around 2 dB in the passbands. Agreements between measured and simulated data are observed to validate the circuit design and performance.
| Original language | English |
|---|---|
| Article number | 6415314 |
| Pages (from-to) | 78-80 |
| Number of pages | 3 |
| Journal | IEEE Microwave and Wireless Components Letters |
| Volume | 23 |
| Issue number | 2 |
| DOIs | |
| Publication status | Published - 2013 Jan 22 |
Fingerprint
All Science Journal Classification (ASJC) codes
- Condensed Matter Physics
- Electrical and Electronic Engineering
Cite this
}
Novel balanced bandpass filters using substrate integrated half-mode waveguide. / Ho, Min Hua; Li, Cheng Siou.
In: IEEE Microwave and Wireless Components Letters, Vol. 23, No. 2, 6415314, 22.01.2013, p. 78-80.Research output: Contribution to journal › Article
TY - JOUR
T1 - Novel balanced bandpass filters using substrate integrated half-mode waveguide
AU - Ho, Min Hua
AU - Li, Cheng Siou
PY - 2013/1/22
Y1 - 2013/1/22
N2 - The contribution of this work is to propose novel balanced bandpass filters (BPFs) using the half-mode substrate integrated waveguide (HMSIW) and its size-reduced form, a folded HMSIW structure. The size of an HMSIW is about half of the substrate integrated waveguide (SIW) and the size of the folded HMSIW further reduces to 25%. Besides compactness, the proposed BPFs are attractive because the thru-via array needed for providing the side-wall effect is no longer required. In addition, the common-mode (CM) rejection of the HMSIW BPF is achieved from the non-coupling slots, caused by the PMC. The CM rejection of the folded HMSIW BPF is obtained by up-shifting the CM operating frequency far away from the differential-mode (DM) passband. Prototypes of the proposed circuits are fabricated and measured to present CM rejection levels larger than 40 dB over a wide frequency range and DM insertion losses around 2 dB in the passbands. Agreements between measured and simulated data are observed to validate the circuit design and performance.
AB - The contribution of this work is to propose novel balanced bandpass filters (BPFs) using the half-mode substrate integrated waveguide (HMSIW) and its size-reduced form, a folded HMSIW structure. The size of an HMSIW is about half of the substrate integrated waveguide (SIW) and the size of the folded HMSIW further reduces to 25%. Besides compactness, the proposed BPFs are attractive because the thru-via array needed for providing the side-wall effect is no longer required. In addition, the common-mode (CM) rejection of the HMSIW BPF is achieved from the non-coupling slots, caused by the PMC. The CM rejection of the folded HMSIW BPF is obtained by up-shifting the CM operating frequency far away from the differential-mode (DM) passband. Prototypes of the proposed circuits are fabricated and measured to present CM rejection levels larger than 40 dB over a wide frequency range and DM insertion losses around 2 dB in the passbands. Agreements between measured and simulated data are observed to validate the circuit design and performance.
UR - http://www.scopus.com/inward/record.url?scp=84873728611&partnerID=8YFLogxK
UR - http://www.scopus.com/inward/citedby.url?scp=84873728611&partnerID=8YFLogxK
U2 - 10.1109/LMWC.2013.2238911
DO - 10.1109/LMWC.2013.2238911
M3 - Article
AN - SCOPUS:84873728611
VL - 23
SP - 78
EP - 80
JO - IEEE Microwave and Wireless Components Letters
JF - IEEE Microwave and Wireless Components Letters
SN - 1531-1309
IS - 2
M1 - 6415314
ER -