Multi-step three dimensional micro assembly for a flexible LED display

Yu Ruei Chiou, Shih Ya Huang, Kerwin Wang

Research output: Chapter in Book/Report/Conference proceedingConference contribution

3 Citations (Scopus)

Abstract

This paper presents a novel multi-step three dimensional microassembly of passive-circuit-mesh, conductive beads, and LED chips to fabricate a flexible, bright, and wide viewing angle display. A novel flexible display architecture is proposed. To deliver this design, we focus our efforts on the multi-batch assembly integration. A 3-by-3 light-emitting diode array with a chip size of 610μm by 610μm by 90μm is successfully prototyped with device fill factor up to 37.97%. It yields a 990μm squared monochromatic pixel.

Original languageEnglish
Title of host publicationMEMS 2010 - The 23rd IEEE International Conference on Micro Electro Mechanical Systems, Technical Digest
Pages59-62
Number of pages4
DOIs
Publication statusPublished - 2010 Jun 1
Event23rd IEEE International Conference on Micro Electro Mechanical Systems, MEMS 2010 - Hong Kong, China
Duration: 2010 Jan 242010 Jan 28

Other

Other23rd IEEE International Conference on Micro Electro Mechanical Systems, MEMS 2010
CountryChina
CityHong Kong
Period10-01-2410-01-28

All Science Journal Classification (ASJC) codes

  • Electronic, Optical and Magnetic Materials
  • Condensed Matter Physics
  • Mechanical Engineering
  • Electrical and Electronic Engineering

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  • Cite this

    Chiou, Y. R., Huang, S. Y., & Wang, K. (2010). Multi-step three dimensional micro assembly for a flexible LED display. In MEMS 2010 - The 23rd IEEE International Conference on Micro Electro Mechanical Systems, Technical Digest (pp. 59-62). [5442567] https://doi.org/10.1109/MEMSYS.2010.5442567