Multi-force-field assisted self-assembly process of thermoelectric device

Y. B. Lin, Y. L. Tzeng, M. J. Dai, C. K. Liu, L. L. Liao, H. C. Chien, Y. S. Chen, Kerwin Wang

Research output: Chapter in Book/Report/Conference proceedingConference contribution

1 Citation (Scopus)

Abstract

This study presents a dynamic multi-force field platform for micro thermoelectric generator (μTEG) assembly. The platform consists of a guide template and an alignment template. The dynamic force fields are provided by gravitational force and magnetic force. The thermolegs are confined by an anti-static ITO cubical well. Without using any redundant thermolegs, the assembly process can achieve 100% yield within 13 minutes. P-type and N-type TEG legs are assembled and transferred to the top and bottom electrodes, respectively. After hot pressing, a 6×6 and a 10×10 Bi 2+xTe3-x μTEG array are packaged for testing. The TEG array generates a power of 1.29 mW for a ΔT of 65.9°C under optimized external load of 22.3 Ohm.

Original languageEnglish
Title of host publication2013 Transducers and Eurosensors XXVII
Subtitle of host publicationThe 17th International Conference on Solid-State Sensors, Actuators and Microsystems, TRANSDUCERS and EUROSENSORS 2013
Pages818-821
Number of pages4
DOIs
Publication statusPublished - 2013 Dec 1
Event2013 17th International Conference on Solid-State Sensors, Actuators and Microsystems, TRANSDUCERS and EUROSENSORS 2013 - Barcelona, Spain
Duration: 2013 Jun 162013 Jun 20

Other

Other2013 17th International Conference on Solid-State Sensors, Actuators and Microsystems, TRANSDUCERS and EUROSENSORS 2013
CountrySpain
CityBarcelona
Period13-06-1613-06-20

All Science Journal Classification (ASJC) codes

  • Hardware and Architecture
  • Electrical and Electronic Engineering

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  • Cite this

    Lin, Y. B., Tzeng, Y. L., Dai, M. J., Liu, C. K., Liao, L. L., Chien, H. C., Chen, Y. S., & Wang, K. (2013). Multi-force-field assisted self-assembly process of thermoelectric device. In 2013 Transducers and Eurosensors XXVII: The 17th International Conference on Solid-State Sensors, Actuators and Microsystems, TRANSDUCERS and EUROSENSORS 2013 (pp. 818-821). [6626892] https://doi.org/10.1109/Transducers.2013.6626892