Abstract
Minimizing return loss at the receiver is important for communication systems. An aim of this paper was to characterize the striplines surrounded with the ground guards or crossing different types of ground slot on the multilayer package using the 3D full-wave simulator. Results showed that the striplines crossing the ground slot were characterized with larger inductance, capacitance, coupling coefficient, and mutual capacitance. We do not recommend that the ground guards be surrounded to the stripline traces if the return loss is a major concern.
| Original language | English |
|---|---|
| Pages (from-to) | 892-896 |
| Number of pages | 5 |
| Journal | Proceedings of SPIE - The International Society for Optical Engineering |
| Volume | 4931 |
| Publication status | Published - 2002 Jan 1 |
| Event | 2002 International Symposium on Microelectronics - Denver, CO, United States Duration: 2002 Sep 4 → 2002 Sep 6 |
All Science Journal Classification (ASJC) codes
- Electronic, Optical and Magnetic Materials
- Condensed Matter Physics
- Computer Science Applications
- Applied Mathematics
- Electrical and Electronic Engineering
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Cite this
Chen, N., Chiang, K., Wang, Y. P., & Lai, Y. L. (2002). Modeling of return loss on multilayer package for wideband applications. Proceedings of SPIE - The International Society for Optical Engineering, 4931, 892-896.