Modeling of return loss on multilayer package for wideband applications

Nansen Chen, Kevin Chiang, Y. P. Wang, Yeong Lin Lai

Research output: Contribution to journalConference article

2 Citations (Scopus)

Abstract

Minimizing return loss at the receiver is important for communication systems. An aim of this paper was to characterize the striplines surrounded with the ground guards or crossing different types of ground slot on the multilayer package using the 3D full-wave simulator. Results showed that the striplines crossing the ground slot were characterized with larger inductance, capacitance, coupling coefficient, and mutual capacitance. We do not recommend that the ground guards be surrounded to the stripline traces if the return loss is a major concern.

Original languageEnglish
Pages (from-to)892-896
Number of pages5
JournalProceedings of SPIE - The International Society for Optical Engineering
Volume4931
Publication statusPublished - 2002 Jan 1
Event2002 International Symposium on Microelectronics - Denver, CO, United States
Duration: 2002 Sep 42002 Sep 6

All Science Journal Classification (ASJC) codes

  • Electronic, Optical and Magnetic Materials
  • Condensed Matter Physics
  • Computer Science Applications
  • Applied Mathematics
  • Electrical and Electronic Engineering

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