Modeling of return loss on multilayer package for wideband applications

Nansen Chen; Kevin Chiang; Y. P. Wang; Yeong Lin Lai

Modeling of return loss on multilayer package for wideband applications

Nansen Chen, Kevin Chiang, Y. P. Wang, Yeong Lin Lai

Department of Mechatronic Engineering

Research output: Contribution to journal › Conference article › peer-review

2 Citations (Scopus)

Abstract

Minimizing return loss at the receiver is important for communication systems. An aim of this paper was to characterize the striplines surrounded with the ground guards or crossing different types of ground slot on the multilayer package using the 3D full-wave simulator. Results showed that the striplines crossing the ground slot were characterized with larger inductance, capacitance, coupling coefficient, and mutual capacitance. We do not recommend that the ground guards be surrounded to the stripline traces if the return loss is a major concern.

Original language	English
Pages (from-to)	892-896
Number of pages	5
Journal	Proceedings of SPIE - The International Society for Optical Engineering
Volume	4931
Publication status	Published - 2002 Jan 1
Event	2002 International Symposium on Microelectronics - Denver, CO, United States Duration: 2002 Sep 4 → 2002 Sep 6

All Science Journal Classification (ASJC) codes

Electronic, Optical and Magnetic Materials
Condensed Matter Physics
Computer Science Applications
Applied Mathematics
Electrical and Electronic Engineering

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title = "Modeling of return loss on multilayer package for wideband applications",

abstract = "Minimizing return loss at the receiver is important for communication systems. An aim of this paper was to characterize the striplines surrounded with the ground guards or crossing different types of ground slot on the multilayer package using the 3D full-wave simulator. Results showed that the striplines crossing the ground slot were characterized with larger inductance, capacitance, coupling coefficient, and mutual capacitance. We do not recommend that the ground guards be surrounded to the stripline traces if the return loss is a major concern.",

author = "Nansen Chen and Kevin Chiang and Wang, {Y. P.} and Lai, {Yeong Lin}",

year = "2002",

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day = "1",

language = "English",

volume = "4931",

pages = "892--896",

journal = "Proceedings of SPIE - The International Society for Optical Engineering",

issn = "0277-786X",

publisher = "SPIE",

note = "2002 International Symposium on Microelectronics ; Conference date: 04-09-2002 Through 06-09-2002",

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TY - JOUR

T1 - Modeling of return loss on multilayer package for wideband applications

AU - Chen, Nansen

AU - Chiang, Kevin

AU - Wang, Y. P.

AU - Lai, Yeong Lin

PY - 2002/1/1

Y1 - 2002/1/1

N2 - Minimizing return loss at the receiver is important for communication systems. An aim of this paper was to characterize the striplines surrounded with the ground guards or crossing different types of ground slot on the multilayer package using the 3D full-wave simulator. Results showed that the striplines crossing the ground slot were characterized with larger inductance, capacitance, coupling coefficient, and mutual capacitance. We do not recommend that the ground guards be surrounded to the stripline traces if the return loss is a major concern.

AB - Minimizing return loss at the receiver is important for communication systems. An aim of this paper was to characterize the striplines surrounded with the ground guards or crossing different types of ground slot on the multilayer package using the 3D full-wave simulator. Results showed that the striplines crossing the ground slot were characterized with larger inductance, capacitance, coupling coefficient, and mutual capacitance. We do not recommend that the ground guards be surrounded to the stripline traces if the return loss is a major concern.

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M3 - Conference article

AN - SCOPUS:0036450347

VL - 4931

SP - 892

EP - 896

JO - Proceedings of SPIE - The International Society for Optical Engineering

JF - Proceedings of SPIE - The International Society for Optical Engineering

SN - 0277-786X

T2 - 2002 International Symposium on Microelectronics

Y2 - 4 September 2002 through 6 September 2002

ER -