Microhole machining of silicon wafer in air and under deionized water by pulsed UV laser system

Wen Tse Hsiao, Shih Feng Tseng, Kuo Cheng Huang, Donyau Chiang, Ming Fei Chen

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4 Citations (Scopus)

Abstract

The study investigated the laser microhole drilling performance of polycrystalline silicon using the trepanning drilling method combined with the helix swing path with varying parameters, including laser pulse energy, pulse repetition frequency, and galvanometric scan speed. A pulsed ultraviolet laser system was used in an atmospheric condition and under deionized water. Moreover, the trepanning method was used to obtain a larger via diameter. The surface morphology, taper angle, and melted residual high were evaluated using a three-dimensional confocal laser scanning microscope and field emission scanning electron microscope. This method can produce larger holes and can be applied to crystalline silicon, multicrystalline silicon, thinfilm silicon, and other materials for photovoltaic applications.

Original languageEnglish
Pages (from-to)565-570
Number of pages6
JournalApplied Physics A: Materials Science and Processing
Volume110
Issue number3
DOIs
Publication statusPublished - 2013 Jan 1

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All Science Journal Classification (ASJC) codes

  • Chemistry(all)
  • Materials Science(all)

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