Mechanical properties study of nano-scale thin films on the novel paddle cantilever using optical interferometer with four step phase-shifting method

Ming Tzer Lin, Chi Jia Tong, Ya Chi Cheng, Kuan-Jung Chung, Jiong Shiun Hsu

Research output: Chapter in Book/Report/Conference proceedingConference contribution

Abstract

A paddle-like cantilever beam was designed and developed as a specimen to measure the mechanical behavior of thin films. This beam is in triangle shape in order to provide uniform plane strain distribution and standard clean room processing was used to prepare the sample. The residual stress measurement of thin films application for MEMS were studied with the deflections of silver, gold, and copper films (50-250 nm) driven by the electrostatic force and measured using four step phase-shifting method. The results present that the test structure and the optical (FSPS) method work excellently. Furthermore, silver presents that the deflection decreases after deposition to demonstrate that the tensile residual stress in the film. Oppositely, gold and copper films show compressive residual stress in them.

Original languageEnglish
Title of host publication2009 Symposium on Design, Test, Integration and Packaging of MEMS/MOEMS, MEMS/MOEMS 2009
Pages140-144
Number of pages5
Publication statusPublished - 2009 Sep 23
Event2009 Symposium on Design, Test, Integration and Packaging of MEMS/MOEMS, MEMS/MOEMS 2009 - Rome, Italy
Duration: 2009 Apr 12009 Apr 3

Publication series

NameDTIP of MEMS and MOEMS - Symposium on Design, Test, Integration and Packaging of MEMS/MOEMS

Other

Other2009 Symposium on Design, Test, Integration and Packaging of MEMS/MOEMS, MEMS/MOEMS 2009
CountryItaly
CityRome
Period09-04-0109-04-03

Fingerprint

Interferometers
Residual stresses
Thin films
Mechanical properties
Silver
Gold
Copper
Clean rooms
Electrostatic force
Stress measurement
Cantilever beams
Compressive stress
Tensile stress
MEMS
Processing

All Science Journal Classification (ASJC) codes

  • Hardware and Architecture
  • Electrical and Electronic Engineering

Cite this

Lin, M. T., Tong, C. J., Cheng, Y. C., Chung, K-J., & Hsu, J. S. (2009). Mechanical properties study of nano-scale thin films on the novel paddle cantilever using optical interferometer with four step phase-shifting method. In 2009 Symposium on Design, Test, Integration and Packaging of MEMS/MOEMS, MEMS/MOEMS 2009 (pp. 140-144). [4919482] (DTIP of MEMS and MOEMS - Symposium on Design, Test, Integration and Packaging of MEMS/MOEMS).
Lin, Ming Tzer ; Tong, Chi Jia ; Cheng, Ya Chi ; Chung, Kuan-Jung ; Hsu, Jiong Shiun. / Mechanical properties study of nano-scale thin films on the novel paddle cantilever using optical interferometer with four step phase-shifting method. 2009 Symposium on Design, Test, Integration and Packaging of MEMS/MOEMS, MEMS/MOEMS 2009. 2009. pp. 140-144 (DTIP of MEMS and MOEMS - Symposium on Design, Test, Integration and Packaging of MEMS/MOEMS).
@inproceedings{89212cf95c184ec7b33ebda6a298e708,
title = "Mechanical properties study of nano-scale thin films on the novel paddle cantilever using optical interferometer with four step phase-shifting method",
abstract = "A paddle-like cantilever beam was designed and developed as a specimen to measure the mechanical behavior of thin films. This beam is in triangle shape in order to provide uniform plane strain distribution and standard clean room processing was used to prepare the sample. The residual stress measurement of thin films application for MEMS were studied with the deflections of silver, gold, and copper films (50-250 nm) driven by the electrostatic force and measured using four step phase-shifting method. The results present that the test structure and the optical (FSPS) method work excellently. Furthermore, silver presents that the deflection decreases after deposition to demonstrate that the tensile residual stress in the film. Oppositely, gold and copper films show compressive residual stress in them.",
author = "Lin, {Ming Tzer} and Tong, {Chi Jia} and Cheng, {Ya Chi} and Kuan-Jung Chung and Hsu, {Jiong Shiun}",
year = "2009",
month = "9",
day = "23",
language = "English",
isbn = "9782355000096",
series = "DTIP of MEMS and MOEMS - Symposium on Design, Test, Integration and Packaging of MEMS/MOEMS",
pages = "140--144",
booktitle = "2009 Symposium on Design, Test, Integration and Packaging of MEMS/MOEMS, MEMS/MOEMS 2009",

}

Lin, MT, Tong, CJ, Cheng, YC, Chung, K-J & Hsu, JS 2009, Mechanical properties study of nano-scale thin films on the novel paddle cantilever using optical interferometer with four step phase-shifting method. in 2009 Symposium on Design, Test, Integration and Packaging of MEMS/MOEMS, MEMS/MOEMS 2009., 4919482, DTIP of MEMS and MOEMS - Symposium on Design, Test, Integration and Packaging of MEMS/MOEMS, pp. 140-144, 2009 Symposium on Design, Test, Integration and Packaging of MEMS/MOEMS, MEMS/MOEMS 2009, Rome, Italy, 09-04-01.

Mechanical properties study of nano-scale thin films on the novel paddle cantilever using optical interferometer with four step phase-shifting method. / Lin, Ming Tzer; Tong, Chi Jia; Cheng, Ya Chi; Chung, Kuan-Jung; Hsu, Jiong Shiun.

2009 Symposium on Design, Test, Integration and Packaging of MEMS/MOEMS, MEMS/MOEMS 2009. 2009. p. 140-144 4919482 (DTIP of MEMS and MOEMS - Symposium on Design, Test, Integration and Packaging of MEMS/MOEMS).

Research output: Chapter in Book/Report/Conference proceedingConference contribution

TY - GEN

T1 - Mechanical properties study of nano-scale thin films on the novel paddle cantilever using optical interferometer with four step phase-shifting method

AU - Lin, Ming Tzer

AU - Tong, Chi Jia

AU - Cheng, Ya Chi

AU - Chung, Kuan-Jung

AU - Hsu, Jiong Shiun

PY - 2009/9/23

Y1 - 2009/9/23

N2 - A paddle-like cantilever beam was designed and developed as a specimen to measure the mechanical behavior of thin films. This beam is in triangle shape in order to provide uniform plane strain distribution and standard clean room processing was used to prepare the sample. The residual stress measurement of thin films application for MEMS were studied with the deflections of silver, gold, and copper films (50-250 nm) driven by the electrostatic force and measured using four step phase-shifting method. The results present that the test structure and the optical (FSPS) method work excellently. Furthermore, silver presents that the deflection decreases after deposition to demonstrate that the tensile residual stress in the film. Oppositely, gold and copper films show compressive residual stress in them.

AB - A paddle-like cantilever beam was designed and developed as a specimen to measure the mechanical behavior of thin films. This beam is in triangle shape in order to provide uniform plane strain distribution and standard clean room processing was used to prepare the sample. The residual stress measurement of thin films application for MEMS were studied with the deflections of silver, gold, and copper films (50-250 nm) driven by the electrostatic force and measured using four step phase-shifting method. The results present that the test structure and the optical (FSPS) method work excellently. Furthermore, silver presents that the deflection decreases after deposition to demonstrate that the tensile residual stress in the film. Oppositely, gold and copper films show compressive residual stress in them.

UR - http://www.scopus.com/inward/record.url?scp=70349216824&partnerID=8YFLogxK

UR - http://www.scopus.com/inward/citedby.url?scp=70349216824&partnerID=8YFLogxK

M3 - Conference contribution

AN - SCOPUS:70349216824

SN - 9782355000096

T3 - DTIP of MEMS and MOEMS - Symposium on Design, Test, Integration and Packaging of MEMS/MOEMS

SP - 140

EP - 144

BT - 2009 Symposium on Design, Test, Integration and Packaging of MEMS/MOEMS, MEMS/MOEMS 2009

ER -

Lin MT, Tong CJ, Cheng YC, Chung K-J, Hsu JS. Mechanical properties study of nano-scale thin films on the novel paddle cantilever using optical interferometer with four step phase-shifting method. In 2009 Symposium on Design, Test, Integration and Packaging of MEMS/MOEMS, MEMS/MOEMS 2009. 2009. p. 140-144. 4919482. (DTIP of MEMS and MOEMS - Symposium on Design, Test, Integration and Packaging of MEMS/MOEMS).