Mechanical behavior of copper thin films subjected to various strain rate loadings

Kuan Jung Chung, Chi Feng Lin, Wei Cheng Chiang

Research output: Contribution to journalArticle

3 Citations (Scopus)

Abstract

In this study, a micro-force tensile testing machine (MTS Tytron 250) was applied to test the polyimide samples coated with different thicknesses of copper (500-1500 nm). The experiments using different strain rates (1.6 × 10-4 to 1.6 × 10-2 s-1) were conducted to the test vehicles. The results showed that the stress and strain of Cu films were strongly correlated with the strain rate and film thickness. The mechanical strength, yield stress, Young's modulus, and maximum tensile stress, increase as the strain rate increases or the thickness decreases. Strain rate sensitivity rapidly increases as the thickness decreases from 750 to 500 nm to imply that the work hardening rate increases while the thickness decreases, resulting in a higher probability of brittle failure.

Original languageEnglish
Pages (from-to)861-871
Number of pages11
JournalTransactions of the Canadian Society for Mechanical Engineering
Volume37
Issue number3
Publication statusPublished - 2013 Dec 1

Fingerprint

Strain rate
Copper
Thin films
Tensile testing
Strain hardening
Polyimides
Tensile stress
Strength of materials
Yield stress
Film thickness
Elastic moduli
Experiments

All Science Journal Classification (ASJC) codes

  • Mechanical Engineering

Cite this

@article{e435921065a849fdb75c3c753dd14a0d,
title = "Mechanical behavior of copper thin films subjected to various strain rate loadings",
abstract = "In this study, a micro-force tensile testing machine (MTS Tytron 250) was applied to test the polyimide samples coated with different thicknesses of copper (500-1500 nm). The experiments using different strain rates (1.6 × 10-4 to 1.6 × 10-2 s-1) were conducted to the test vehicles. The results showed that the stress and strain of Cu films were strongly correlated with the strain rate and film thickness. The mechanical strength, yield stress, Young's modulus, and maximum tensile stress, increase as the strain rate increases or the thickness decreases. Strain rate sensitivity rapidly increases as the thickness decreases from 750 to 500 nm to imply that the work hardening rate increases while the thickness decreases, resulting in a higher probability of brittle failure.",
author = "Chung, {Kuan Jung} and Lin, {Chi Feng} and Chiang, {Wei Cheng}",
year = "2013",
month = "12",
day = "1",
language = "English",
volume = "37",
pages = "861--871",
journal = "Transactions of the Canadian Society for Mechanical Engineering",
issn = "0315-8977",
publisher = "Canadian Society for Mechanical Engineering",
number = "3",

}

Mechanical behavior of copper thin films subjected to various strain rate loadings. / Chung, Kuan Jung; Lin, Chi Feng; Chiang, Wei Cheng.

In: Transactions of the Canadian Society for Mechanical Engineering, Vol. 37, No. 3, 01.12.2013, p. 861-871.

Research output: Contribution to journalArticle

TY - JOUR

T1 - Mechanical behavior of copper thin films subjected to various strain rate loadings

AU - Chung, Kuan Jung

AU - Lin, Chi Feng

AU - Chiang, Wei Cheng

PY - 2013/12/1

Y1 - 2013/12/1

N2 - In this study, a micro-force tensile testing machine (MTS Tytron 250) was applied to test the polyimide samples coated with different thicknesses of copper (500-1500 nm). The experiments using different strain rates (1.6 × 10-4 to 1.6 × 10-2 s-1) were conducted to the test vehicles. The results showed that the stress and strain of Cu films were strongly correlated with the strain rate and film thickness. The mechanical strength, yield stress, Young's modulus, and maximum tensile stress, increase as the strain rate increases or the thickness decreases. Strain rate sensitivity rapidly increases as the thickness decreases from 750 to 500 nm to imply that the work hardening rate increases while the thickness decreases, resulting in a higher probability of brittle failure.

AB - In this study, a micro-force tensile testing machine (MTS Tytron 250) was applied to test the polyimide samples coated with different thicknesses of copper (500-1500 nm). The experiments using different strain rates (1.6 × 10-4 to 1.6 × 10-2 s-1) were conducted to the test vehicles. The results showed that the stress and strain of Cu films were strongly correlated with the strain rate and film thickness. The mechanical strength, yield stress, Young's modulus, and maximum tensile stress, increase as the strain rate increases or the thickness decreases. Strain rate sensitivity rapidly increases as the thickness decreases from 750 to 500 nm to imply that the work hardening rate increases while the thickness decreases, resulting in a higher probability of brittle failure.

UR - http://www.scopus.com/inward/record.url?scp=84892770211&partnerID=8YFLogxK

UR - http://www.scopus.com/inward/citedby.url?scp=84892770211&partnerID=8YFLogxK

M3 - Article

AN - SCOPUS:84892770211

VL - 37

SP - 861

EP - 871

JO - Transactions of the Canadian Society for Mechanical Engineering

JF - Transactions of the Canadian Society for Mechanical Engineering

SN - 0315-8977

IS - 3

ER -