Lifetime prediction of the epoxy resin adhesive under the optical performance degradation process

Ching Yu Chen, Rong Fong Wu, Chun Ying Huang, Kuan Jung Chung

Research output: Chapter in Book/Report/Conference proceedingConference contribution

2 Citations (Scopus)

Abstract

In this study, an epoxy resin adhesive called optically clear resin (OCR) was prepared. The type I (time censored) accelerated degradation tests associated with various temperature-humidity conditions were performed to evaluate the lifetimes of the test vehicle. The optical performance, Yellow index (YI), was used and the failure criterion was defined when the YI reaches a specific value of 2. The test results indicate that the degradation path of test samples represent the brownian motion so that a Weiner process was applied to model the degradation of test samples. A typical Monde Carlo simulation was performed to predict the lifetimes at the threshold level for each test condition. The simulation results present that the lifetimes at the test condition 85?C/85% RH and 75?C/85% RH are 2216 hours and 3322 hours respectively. As the results, the acceleration factor and activation energy was calculated to be 1.5 and 0.6874 ev/K respectively. Furthermore, a bogey test method was used to determine the sample size and failure free test duration according to the specific reliability goal and confidence level.

Original languageEnglish
Title of host publication2015 10th International Microsystems, Packaging, Assembly and Circuits Technology Conference, IMPACT 2015 - Proceedings
PublisherInstitute of Electrical and Electronics Engineers Inc.
Pages213-216
Number of pages4
ISBN (Electronic)9781467383561
DOIs
Publication statusPublished - 2015 Dec 23
Event10th International Microsystems, Packaging, Assembly and Circuits Technology Conference, IMPACT 2015 - Taipei, Taiwan
Duration: 2015 Oct 212015 Oct 23

Other

Other10th International Microsystems, Packaging, Assembly and Circuits Technology Conference, IMPACT 2015
CountryTaiwan
CityTaipei
Period15-10-2115-10-23

Fingerprint

Epoxy Resins
Epoxy resins
Adhesives
Degradation
Brownian movement
Atmospheric humidity
Resins
Activation energy
Temperature

All Science Journal Classification (ASJC) codes

  • Electronic, Optical and Magnetic Materials
  • Electrical and Electronic Engineering

Cite this

Chen, C. Y., Wu, R. F., Huang, C. Y., & Chung, K. J. (2015). Lifetime prediction of the epoxy resin adhesive under the optical performance degradation process. In 2015 10th International Microsystems, Packaging, Assembly and Circuits Technology Conference, IMPACT 2015 - Proceedings (pp. 213-216). [7365251] Institute of Electrical and Electronics Engineers Inc.. https://doi.org/10.1109/IMPACT.2015.7365251
Chen, Ching Yu ; Wu, Rong Fong ; Huang, Chun Ying ; Chung, Kuan Jung. / Lifetime prediction of the epoxy resin adhesive under the optical performance degradation process. 2015 10th International Microsystems, Packaging, Assembly and Circuits Technology Conference, IMPACT 2015 - Proceedings. Institute of Electrical and Electronics Engineers Inc., 2015. pp. 213-216
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Chen, CY, Wu, RF, Huang, CY & Chung, KJ 2015, Lifetime prediction of the epoxy resin adhesive under the optical performance degradation process. in 2015 10th International Microsystems, Packaging, Assembly and Circuits Technology Conference, IMPACT 2015 - Proceedings., 7365251, Institute of Electrical and Electronics Engineers Inc., pp. 213-216, 10th International Microsystems, Packaging, Assembly and Circuits Technology Conference, IMPACT 2015, Taipei, Taiwan, 15-10-21. https://doi.org/10.1109/IMPACT.2015.7365251

Lifetime prediction of the epoxy resin adhesive under the optical performance degradation process. / Chen, Ching Yu; Wu, Rong Fong; Huang, Chun Ying; Chung, Kuan Jung.

2015 10th International Microsystems, Packaging, Assembly and Circuits Technology Conference, IMPACT 2015 - Proceedings. Institute of Electrical and Electronics Engineers Inc., 2015. p. 213-216 7365251.

Research output: Chapter in Book/Report/Conference proceedingConference contribution

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Chen CY, Wu RF, Huang CY, Chung KJ. Lifetime prediction of the epoxy resin adhesive under the optical performance degradation process. In 2015 10th International Microsystems, Packaging, Assembly and Circuits Technology Conference, IMPACT 2015 - Proceedings. Institute of Electrical and Electronics Engineers Inc. 2015. p. 213-216. 7365251 https://doi.org/10.1109/IMPACT.2015.7365251