Life cycle design through modularity and disassembly

Hwai En Tseng, Shu-Hsuan Chang

Research output: Chapter in Book/Report/Conference proceedingConference contribution

2 Citations (Scopus)

Abstract

The fierce market competition result in the increasingly shorter product life cycles. It is a commonly known as a trend of green life cycle engineering design to consider the lightest harm to the environment in the early design stage. In this study, the author attempted to establish an integrated assessment method for modular design and disassembly plan. In this study, the lamp and printer are used as examples to verify the method proposed in this study.

Original languageEnglish
Title of host publicationProceedings - 2016 IEEE International Symposium on Computer, Consumer and Control, IS3C 2016
PublisherInstitute of Electrical and Electronics Engineers Inc.
Pages772-775
Number of pages4
ISBN (Electronic)9781509030712
DOIs
Publication statusPublished - 2016 Aug 16
Event2016 IEEE International Symposium on Computer, Consumer and Control, IS3C 2016 - Xi'an, China
Duration: 2016 Jul 42016 Jul 6

Other

Other2016 IEEE International Symposium on Computer, Consumer and Control, IS3C 2016
CountryChina
CityXi'an
Period16-07-0416-07-06

Fingerprint

Disassembly
Modularity
Life Cycle
Life cycle
Modular Design
Engineering Design
Verify
Electric lamps
Design
Trends
Market

All Science Journal Classification (ASJC) codes

  • Signal Processing
  • Computer Networks and Communications
  • Computer Science Applications
  • Energy Engineering and Power Technology
  • Control and Systems Engineering
  • Control and Optimization

Cite this

Tseng, H. E., & Chang, S-H. (2016). Life cycle design through modularity and disassembly. In Proceedings - 2016 IEEE International Symposium on Computer, Consumer and Control, IS3C 2016 (pp. 772-775). [7545307] Institute of Electrical and Electronics Engineers Inc.. https://doi.org/10.1109/IS3C.2016.197
Tseng, Hwai En ; Chang, Shu-Hsuan. / Life cycle design through modularity and disassembly. Proceedings - 2016 IEEE International Symposium on Computer, Consumer and Control, IS3C 2016. Institute of Electrical and Electronics Engineers Inc., 2016. pp. 772-775
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Tseng, HE & Chang, S-H 2016, Life cycle design through modularity and disassembly. in Proceedings - 2016 IEEE International Symposium on Computer, Consumer and Control, IS3C 2016., 7545307, Institute of Electrical and Electronics Engineers Inc., pp. 772-775, 2016 IEEE International Symposium on Computer, Consumer and Control, IS3C 2016, Xi'an, China, 16-07-04. https://doi.org/10.1109/IS3C.2016.197

Life cycle design through modularity and disassembly. / Tseng, Hwai En; Chang, Shu-Hsuan.

Proceedings - 2016 IEEE International Symposium on Computer, Consumer and Control, IS3C 2016. Institute of Electrical and Electronics Engineers Inc., 2016. p. 772-775 7545307.

Research output: Chapter in Book/Report/Conference proceedingConference contribution

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Tseng HE, Chang S-H. Life cycle design through modularity and disassembly. In Proceedings - 2016 IEEE International Symposium on Computer, Consumer and Control, IS3C 2016. Institute of Electrical and Electronics Engineers Inc. 2016. p. 772-775. 7545307 https://doi.org/10.1109/IS3C.2016.197