Labeling confidence values for wafer-handling robot arm performance using a feature-based general regression neural network and genetic algorithm

Yi Cheng Huang, Zi Sheng Yang, Hsien Shu Liao

Research output: Contribution to journalArticle

Abstract

The prognosis and management of machine health statuses are emerging research topics. In this study, the performance degradation of a wafer-handling robot arm (WHRA) was predicted using the proposed machine-learning approach. This method considers the eccentric vertical and planar position deviations from a wafer mark using a charge-coupled device (CCD) camera. Synthesized position signals were defined using the square root of x- and y-axes deviations in the horizontal view and the square of the wafer mark diameter in the vertical view. A feature extraction method was used to determine the position status on the basis of these displacements and the area of a wafer mark in a CCD image. The root mean square error and mean, maximum, and minimum of the synthesized position signals were extracted through feature extraction and used for data mining by a general regression neural network (GRNN) and logistic regression (LR) models. The lifetime assessment by confidence value of the WHRA's remaining useful life (RUL) by the genetic algorithm/GRNN exhibited nearly the same trend as that predicted through a run-to-failure LR model. The experimental results indicated that the proposed methodology can be used for proactive assessments of the RUL of WHRAs.

Original languageEnglish
Article number4241
JournalApplied Sciences (Switzerland)
Volume9
Issue number20
DOIs
Publication statusPublished - 2019 Oct 1

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All Science Journal Classification (ASJC) codes

  • Materials Science(all)
  • Instrumentation
  • Engineering(all)
  • Process Chemistry and Technology
  • Computer Science Applications
  • Fluid Flow and Transfer Processes

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