Integrated antennas on silicon substrates for communication over free space

Jau-Jr/jau Jr/jau Lin, Li Gao, Aravind Sugavanam, Xiaoling Guo, Ran Li, Joe E. Brewer, K. O. Kenneth

Research output: Contribution to journalLetter

44 Citations (Scopus)

Abstract

This letter reports the feasibility of using 2-mm-long on-chip antennas for communication over free space. Integration of antennas into radio frequency integrated circuits (RFICs) eliminates external transmission line connections and sophisticated packaging, which should lower the cost of wireless systems operating above 10 GHz. Mobile microwave probe stands have been developed for measurements at varying antenna pair separations. Antenna-pair gains for 2-mm-long integrated zigzag dipole antennas fabricated on 20-Ω-cm silicon substrates have been characterized near 24 GHz for separations up to 15 m. The antenna-pair gains show R-2 dependence up to ∼4-5 m. The antennas were found to be sufficient for use up to 5 m and possibly larger separations.

Original languageEnglish
Pages (from-to)196-198
Number of pages3
JournalIEEE Electron Device Letters
Volume25
Issue number4
DOIs
Publication statusPublished - 2004 Apr 1

Fingerprint

Silicon
Antennas
Communication
Substrates
Dipole antennas
Integrated circuits
Electric lines
Packaging
Microwaves
Costs

All Science Journal Classification (ASJC) codes

  • Electronic, Optical and Magnetic Materials
  • Electrical and Electronic Engineering

Cite this

Lin, J-J. J., Gao, L., Sugavanam, A., Guo, X., Li, R., Brewer, J. E., & Kenneth, K. O. (2004). Integrated antennas on silicon substrates for communication over free space. IEEE Electron Device Letters, 25(4), 196-198. https://doi.org/10.1109/LED.2004.824837
Lin, Jau-Jr/jau Jr/jau ; Gao, Li ; Sugavanam, Aravind ; Guo, Xiaoling ; Li, Ran ; Brewer, Joe E. ; Kenneth, K. O. / Integrated antennas on silicon substrates for communication over free space. In: IEEE Electron Device Letters. 2004 ; Vol. 25, No. 4. pp. 196-198.
@article{b558bda801264114a2b978d84794c100,
title = "Integrated antennas on silicon substrates for communication over free space",
abstract = "This letter reports the feasibility of using 2-mm-long on-chip antennas for communication over free space. Integration of antennas into radio frequency integrated circuits (RFICs) eliminates external transmission line connections and sophisticated packaging, which should lower the cost of wireless systems operating above 10 GHz. Mobile microwave probe stands have been developed for measurements at varying antenna pair separations. Antenna-pair gains for 2-mm-long integrated zigzag dipole antennas fabricated on 20-Ω-cm silicon substrates have been characterized near 24 GHz for separations up to 15 m. The antenna-pair gains show R-2 dependence up to ∼4-5 m. The antennas were found to be sufficient for use up to 5 m and possibly larger separations.",
author = "Lin, {Jau-Jr/jau Jr/jau} and Li Gao and Aravind Sugavanam and Xiaoling Guo and Ran Li and Brewer, {Joe E.} and Kenneth, {K. O.}",
year = "2004",
month = "4",
day = "1",
doi = "10.1109/LED.2004.824837",
language = "English",
volume = "25",
pages = "196--198",
journal = "IEEE Electron Device Letters",
issn = "0741-3106",
publisher = "Institute of Electrical and Electronics Engineers Inc.",
number = "4",

}

Lin, J-JJ, Gao, L, Sugavanam, A, Guo, X, Li, R, Brewer, JE & Kenneth, KO 2004, 'Integrated antennas on silicon substrates for communication over free space', IEEE Electron Device Letters, vol. 25, no. 4, pp. 196-198. https://doi.org/10.1109/LED.2004.824837

Integrated antennas on silicon substrates for communication over free space. / Lin, Jau-Jr/jau Jr/jau; Gao, Li; Sugavanam, Aravind; Guo, Xiaoling; Li, Ran; Brewer, Joe E.; Kenneth, K. O.

In: IEEE Electron Device Letters, Vol. 25, No. 4, 01.04.2004, p. 196-198.

Research output: Contribution to journalLetter

TY - JOUR

T1 - Integrated antennas on silicon substrates for communication over free space

AU - Lin, Jau-Jr/jau Jr/jau

AU - Gao, Li

AU - Sugavanam, Aravind

AU - Guo, Xiaoling

AU - Li, Ran

AU - Brewer, Joe E.

AU - Kenneth, K. O.

PY - 2004/4/1

Y1 - 2004/4/1

N2 - This letter reports the feasibility of using 2-mm-long on-chip antennas for communication over free space. Integration of antennas into radio frequency integrated circuits (RFICs) eliminates external transmission line connections and sophisticated packaging, which should lower the cost of wireless systems operating above 10 GHz. Mobile microwave probe stands have been developed for measurements at varying antenna pair separations. Antenna-pair gains for 2-mm-long integrated zigzag dipole antennas fabricated on 20-Ω-cm silicon substrates have been characterized near 24 GHz for separations up to 15 m. The antenna-pair gains show R-2 dependence up to ∼4-5 m. The antennas were found to be sufficient for use up to 5 m and possibly larger separations.

AB - This letter reports the feasibility of using 2-mm-long on-chip antennas for communication over free space. Integration of antennas into radio frequency integrated circuits (RFICs) eliminates external transmission line connections and sophisticated packaging, which should lower the cost of wireless systems operating above 10 GHz. Mobile microwave probe stands have been developed for measurements at varying antenna pair separations. Antenna-pair gains for 2-mm-long integrated zigzag dipole antennas fabricated on 20-Ω-cm silicon substrates have been characterized near 24 GHz for separations up to 15 m. The antenna-pair gains show R-2 dependence up to ∼4-5 m. The antennas were found to be sufficient for use up to 5 m and possibly larger separations.

UR - http://www.scopus.com/inward/record.url?scp=1942422651&partnerID=8YFLogxK

UR - http://www.scopus.com/inward/citedby.url?scp=1942422651&partnerID=8YFLogxK

U2 - 10.1109/LED.2004.824837

DO - 10.1109/LED.2004.824837

M3 - Letter

VL - 25

SP - 196

EP - 198

JO - IEEE Electron Device Letters

JF - IEEE Electron Device Letters

SN - 0741-3106

IS - 4

ER -