In-situ monitoring of thickness of quartz membrane during batch chemical etching using a novel micromachined acoustic wave sensor

Chi Yuan Lee, Tsung Tsong Wu, Yung Yu Chen, Shih Yung Pao, Wen Jong Chen, Ying Chou Cheng, Pei Zen Chang, Ping Hei Chen, Chih Kung Lee, Ching Liang Dai, Lung Jieh Yang, Kaih Siang Yen, Fu Yuan Xiao, Chih Wei Liu, Shui Shong Lu

Research output: Contribution to journalConference article

Abstract

This work presents a novel method based on the surface acoustic wave (SAW) device for monitoring in-situ the thickness of quartz membrane during batch chemical etching. Similar to oscillators and resonators, some SAW devices require the thickness of quartz membranes to be known precisely. Precisely controlling the thickness of a quartz membrane during batch chemical etching is important, because it strongly influences post-processing and frequency control. Furthermore, the proposed micromachined acoustic wave sensor, allows the thickness of a quartz membrane from a few μm to hundreds of μm to be monitored in-situ. In particular, the proposed method is highly appropriate for monitoring in-situ a few μm thick quartz membranes, because the thickness of a quartz membrane is proportional to the phase velocity. In summary, the proposed method for measuring the thickness of quartz membrane in real time, has high accuracy, is simple to set up and can be mass produced. Also described herein are the principles of the method used, the detailed process flows, the measurement set-up and the simulation and experimental results. The theoretical and measured values differ by an error of less than 2μm, so the results agreed with each other closely.

Original languageEnglish
Pages (from-to)993-1000
Number of pages8
JournalProceedings of the Annual IEEE International Frequency Control Symposium
Publication statusPublished - 2003 Dec 1
EventProceedings of the 2003 IEEE International Frequency Control Symposium and PDA Exhibition Jointly with the 17th European Frequency and Time Forum - Tampa, FL., United States
Duration: 2003 May 42003 May 8

Fingerprint

Quartz
Etching
Acoustic waves
Membranes
Monitoring
Sensors
Acoustic surface wave devices
Phase velocity
Resonators
Processing

All Science Journal Classification (ASJC) codes

  • Control and Systems Engineering
  • Electrical and Electronic Engineering

Cite this

Lee, Chi Yuan ; Wu, Tsung Tsong ; Chen, Yung Yu ; Pao, Shih Yung ; Chen, Wen Jong ; Cheng, Ying Chou ; Chang, Pei Zen ; Chen, Ping Hei ; Lee, Chih Kung ; Dai, Ching Liang ; Yang, Lung Jieh ; Yen, Kaih Siang ; Xiao, Fu Yuan ; Liu, Chih Wei ; Lu, Shui Shong. / In-situ monitoring of thickness of quartz membrane during batch chemical etching using a novel micromachined acoustic wave sensor. In: Proceedings of the Annual IEEE International Frequency Control Symposium. 2003 ; pp. 993-1000.
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title = "In-situ monitoring of thickness of quartz membrane during batch chemical etching using a novel micromachined acoustic wave sensor",
abstract = "This work presents a novel method based on the surface acoustic wave (SAW) device for monitoring in-situ the thickness of quartz membrane during batch chemical etching. Similar to oscillators and resonators, some SAW devices require the thickness of quartz membranes to be known precisely. Precisely controlling the thickness of a quartz membrane during batch chemical etching is important, because it strongly influences post-processing and frequency control. Furthermore, the proposed micromachined acoustic wave sensor, allows the thickness of a quartz membrane from a few μm to hundreds of μm to be monitored in-situ. In particular, the proposed method is highly appropriate for monitoring in-situ a few μm thick quartz membranes, because the thickness of a quartz membrane is proportional to the phase velocity. In summary, the proposed method for measuring the thickness of quartz membrane in real time, has high accuracy, is simple to set up and can be mass produced. Also described herein are the principles of the method used, the detailed process flows, the measurement set-up and the simulation and experimental results. The theoretical and measured values differ by an error of less than 2μm, so the results agreed with each other closely.",
author = "Lee, {Chi Yuan} and Wu, {Tsung Tsong} and Chen, {Yung Yu} and Pao, {Shih Yung} and Chen, {Wen Jong} and Cheng, {Ying Chou} and Chang, {Pei Zen} and Chen, {Ping Hei} and Lee, {Chih Kung} and Dai, {Ching Liang} and Yang, {Lung Jieh} and Yen, {Kaih Siang} and Xiao, {Fu Yuan} and Liu, {Chih Wei} and Lu, {Shui Shong}",
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Lee, CY, Wu, TT, Chen, YY, Pao, SY, Chen, WJ, Cheng, YC, Chang, PZ, Chen, PH, Lee, CK, Dai, CL, Yang, LJ, Yen, KS, Xiao, FY, Liu, CW & Lu, SS 2003, 'In-situ monitoring of thickness of quartz membrane during batch chemical etching using a novel micromachined acoustic wave sensor', Proceedings of the Annual IEEE International Frequency Control Symposium, pp. 993-1000.

In-situ monitoring of thickness of quartz membrane during batch chemical etching using a novel micromachined acoustic wave sensor. / Lee, Chi Yuan; Wu, Tsung Tsong; Chen, Yung Yu; Pao, Shih Yung; Chen, Wen Jong; Cheng, Ying Chou; Chang, Pei Zen; Chen, Ping Hei; Lee, Chih Kung; Dai, Ching Liang; Yang, Lung Jieh; Yen, Kaih Siang; Xiao, Fu Yuan; Liu, Chih Wei; Lu, Shui Shong.

In: Proceedings of the Annual IEEE International Frequency Control Symposium, 01.12.2003, p. 993-1000.

Research output: Contribution to journalConference article

TY - JOUR

T1 - In-situ monitoring of thickness of quartz membrane during batch chemical etching using a novel micromachined acoustic wave sensor

AU - Lee, Chi Yuan

AU - Wu, Tsung Tsong

AU - Chen, Yung Yu

AU - Pao, Shih Yung

AU - Chen, Wen Jong

AU - Cheng, Ying Chou

AU - Chang, Pei Zen

AU - Chen, Ping Hei

AU - Lee, Chih Kung

AU - Dai, Ching Liang

AU - Yang, Lung Jieh

AU - Yen, Kaih Siang

AU - Xiao, Fu Yuan

AU - Liu, Chih Wei

AU - Lu, Shui Shong

PY - 2003/12/1

Y1 - 2003/12/1

N2 - This work presents a novel method based on the surface acoustic wave (SAW) device for monitoring in-situ the thickness of quartz membrane during batch chemical etching. Similar to oscillators and resonators, some SAW devices require the thickness of quartz membranes to be known precisely. Precisely controlling the thickness of a quartz membrane during batch chemical etching is important, because it strongly influences post-processing and frequency control. Furthermore, the proposed micromachined acoustic wave sensor, allows the thickness of a quartz membrane from a few μm to hundreds of μm to be monitored in-situ. In particular, the proposed method is highly appropriate for monitoring in-situ a few μm thick quartz membranes, because the thickness of a quartz membrane is proportional to the phase velocity. In summary, the proposed method for measuring the thickness of quartz membrane in real time, has high accuracy, is simple to set up and can be mass produced. Also described herein are the principles of the method used, the detailed process flows, the measurement set-up and the simulation and experimental results. The theoretical and measured values differ by an error of less than 2μm, so the results agreed with each other closely.

AB - This work presents a novel method based on the surface acoustic wave (SAW) device for monitoring in-situ the thickness of quartz membrane during batch chemical etching. Similar to oscillators and resonators, some SAW devices require the thickness of quartz membranes to be known precisely. Precisely controlling the thickness of a quartz membrane during batch chemical etching is important, because it strongly influences post-processing and frequency control. Furthermore, the proposed micromachined acoustic wave sensor, allows the thickness of a quartz membrane from a few μm to hundreds of μm to be monitored in-situ. In particular, the proposed method is highly appropriate for monitoring in-situ a few μm thick quartz membranes, because the thickness of a quartz membrane is proportional to the phase velocity. In summary, the proposed method for measuring the thickness of quartz membrane in real time, has high accuracy, is simple to set up and can be mass produced. Also described herein are the principles of the method used, the detailed process flows, the measurement set-up and the simulation and experimental results. The theoretical and measured values differ by an error of less than 2μm, so the results agreed with each other closely.

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M3 - Conference article

AN - SCOPUS:12144290037

SP - 993

EP - 1000

JO - Proceedings of the Annual IEEE International Frequency Control Symposium

JF - Proceedings of the Annual IEEE International Frequency Control Symposium

SN - 0161-6404

ER -