Implementation of a W-CDMA direct-conversion IQ modulator module including evaluation of chip-package-board interactions

F. Y. Han, J. M. Wu, T. S. Horng, J. Lin, C. C. Tu

Research output: Chapter in Book/Report/Conference proceedingConference contribution

Abstract

This paper presents a W-CDMA direct-conversion IQ modulator MMIC design that employs a new technique to generate the 90° phase shift with low implementation loss. The package and PCB effects on the implemented IQ modulator MMIC when further developed as a board module are studied. The package and PCB interconnects are analyzed using the 3-D EM simulation tool and transformed into the equivalent-circuit elements for co-simulation with the IQ modulator MMIC. The degradation of error vector magnitude and sideband suppression due to the presence of package and PCB can be well predicted by the co-simulation results and then verified by the final measurement results.

Original languageEnglish
Title of host publicationProceedings - IEEE 56th Electronic Components and Technology Conference
Pages1726-1731
Number of pages6
Volume2006
DOIs
Publication statusPublished - 2006 Dec 22
EventIEEE 56th Electronic Components and Technology Conference - San Diego, CA, United States
Duration: 2006 May 302006 Jun 2

Other

OtherIEEE 56th Electronic Components and Technology Conference
CountryUnited States
CitySan Diego, CA
Period06-05-3006-06-02

All Science Journal Classification (ASJC) codes

  • Electronic, Optical and Magnetic Materials
  • Electrical and Electronic Engineering

Fingerprint Dive into the research topics of 'Implementation of a W-CDMA direct-conversion IQ modulator module including evaluation of chip-package-board interactions'. Together they form a unique fingerprint.

  • Cite this

    Han, F. Y., Wu, J. M., Horng, T. S., Lin, J., & Tu, C. C. (2006). Implementation of a W-CDMA direct-conversion IQ modulator module including evaluation of chip-package-board interactions. In Proceedings - IEEE 56th Electronic Components and Technology Conference (Vol. 2006, pp. 1726-1731). [1645891] https://doi.org/10.1109/ECTC.2006.1645891