Abstract
This paper presents a W-CDMA direct-conversion IQ modulator MMIC design that employs a new technique to generate the 90° phase shift with low implementation loss. The package and PCB effects on the implemented IQ modulator MMIC when further developed as a board module are studied. The package and PCB interconnects are analyzed using the 3-D EM simulation tool and transformed into the equivalent-circuit elements for co-simulation with the IQ modulator MMIC. The degradation of error vector magnitude and sideband suppression due to the presence of package and PCB can be well predicted by the co-simulation results and then verified by the final measurement results.
| Original language | English |
|---|---|
| Title of host publication | Proceedings - IEEE 56th Electronic Components and Technology Conference |
| Pages | 1726-1731 |
| Number of pages | 6 |
| Volume | 2006 |
| DOIs | |
| Publication status | Published - 2006 Dec 22 |
| Event | IEEE 56th Electronic Components and Technology Conference - San Diego, CA, United States Duration: 2006 May 30 → 2006 Jun 2 |
Other
| Other | IEEE 56th Electronic Components and Technology Conference |
|---|---|
| Country | United States |
| City | San Diego, CA |
| Period | 06-05-30 → 06-06-02 |
All Science Journal Classification (ASJC) codes
- Electronic, Optical and Magnetic Materials
- Electrical and Electronic Engineering
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Cite this
Han, F. Y., Wu, J. M., Horng, T. S., Lin, J., & Tu, C. C. (2006). Implementation of a W-CDMA direct-conversion IQ modulator module including evaluation of chip-package-board interactions. In Proceedings - IEEE 56th Electronic Components and Technology Conference (Vol. 2006, pp. 1726-1731). [1645891] https://doi.org/10.1109/ECTC.2006.1645891