Implementation of a W-CDMA direct-conversion IQ modulator module including evaluation of chip-package-board interactions

F. Y. Han; J. M. Wu; T. S. Horng; J. Lin; C. C. Tu

doi:10.1109/ECTC.2006.1645891

Implementation of a W-CDMA direct-conversion IQ modulator module including evaluation of chip-package-board interactions

F. Y. Han, J. M. Wu, T. S. Horng, J. Lin, C. C. Tu

Department of Electrical Engineering

Research output: Chapter in Book/Report/Conference proceeding › Conference contribution

Abstract

This paper presents a W-CDMA direct-conversion IQ modulator MMIC design that employs a new technique to generate the 90° phase shift with low implementation loss. The package and PCB effects on the implemented IQ modulator MMIC when further developed as a board module are studied. The package and PCB interconnects are analyzed using the 3-D EM simulation tool and transformed into the equivalent-circuit elements for co-simulation with the IQ modulator MMIC. The degradation of error vector magnitude and sideband suppression due to the presence of package and PCB can be well predicted by the co-simulation results and then verified by the final measurement results.

Original language	English
Title of host publication	Proceedings - IEEE 56th Electronic Components and Technology Conference
Pages	1726-1731
Number of pages	6
Volume	2006
DOIs	https://doi.org/10.1109/ECTC.2006.1645891
Publication status	Published - 2006 Dec 22
Event	IEEE 56th Electronic Components and Technology Conference - San Diego, CA, United States Duration: 2006 May 30 → 2006 Jun 2

Other

Other	IEEE 56th Electronic Components and Technology Conference
Country	United States
City	San Diego, CA
Period	06-05-30 → 06-06-02

All Science Journal Classification (ASJC) codes

Electronic, Optical and Magnetic Materials
Electrical and Electronic Engineering

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title = "Implementation of a W-CDMA direct-conversion IQ modulator module including evaluation of chip-package-board interactions",

abstract = "This paper presents a W-CDMA direct-conversion IQ modulator MMIC design that employs a new technique to generate the 90° phase shift with low implementation loss. The package and PCB effects on the implemented IQ modulator MMIC when further developed as a board module are studied. The package and PCB interconnects are analyzed using the 3-D EM simulation tool and transformed into the equivalent-circuit elements for co-simulation with the IQ modulator MMIC. The degradation of error vector magnitude and sideband suppression due to the presence of package and PCB can be well predicted by the co-simulation results and then verified by the final measurement results.",

author = "Han, {F. Y.} and Wu, {J. M.} and Horng, {T. S.} and J. Lin and Tu, {C. C.}",

year = "2006",

month = dec,

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doi = "10.1109/ECTC.2006.1645891",

language = "English",

isbn = "1424401526",

volume = "2006",

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booktitle = "Proceedings - IEEE 56th Electronic Components and Technology Conference",

note = "IEEE 56th Electronic Components and Technology Conference ; Conference date: 30-05-2006 Through 02-06-2006",

}

Han, FY, Wu, JM, Horng, TS, Lin, J & Tu, CC 2006, Implementation of a W-CDMA direct-conversion IQ modulator module including evaluation of chip-package-board interactions. in Proceedings - IEEE 56th Electronic Components and Technology Conference. vol. 2006, 1645891, pp. 1726-1731, IEEE 56th Electronic Components and Technology Conference, San Diego, CA, United States, 06-05-30. https://doi.org/10.1109/ECTC.2006.1645891

Implementation of a W-CDMA direct-conversion IQ modulator module including evaluation of chip-package-board interactions. / Han, F. Y.; Wu, J. M.; Horng, T. S.; Lin, J.; Tu, C. C.

Proceedings - IEEE 56th Electronic Components and Technology Conference. Vol. 2006 2006. p. 1726-1731 1645891.

Research output: Chapter in Book/Report/Conference proceeding › Conference contribution

TY - GEN

T1 - Implementation of a W-CDMA direct-conversion IQ modulator module including evaluation of chip-package-board interactions

AU - Han, F. Y.

AU - Wu, J. M.

AU - Horng, T. S.

AU - Lin, J.

AU - Tu, C. C.

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N2 - This paper presents a W-CDMA direct-conversion IQ modulator MMIC design that employs a new technique to generate the 90° phase shift with low implementation loss. The package and PCB effects on the implemented IQ modulator MMIC when further developed as a board module are studied. The package and PCB interconnects are analyzed using the 3-D EM simulation tool and transformed into the equivalent-circuit elements for co-simulation with the IQ modulator MMIC. The degradation of error vector magnitude and sideband suppression due to the presence of package and PCB can be well predicted by the co-simulation results and then verified by the final measurement results.

AB - This paper presents a W-CDMA direct-conversion IQ modulator MMIC design that employs a new technique to generate the 90° phase shift with low implementation loss. The package and PCB effects on the implemented IQ modulator MMIC when further developed as a board module are studied. The package and PCB interconnects are analyzed using the 3-D EM simulation tool and transformed into the equivalent-circuit elements for co-simulation with the IQ modulator MMIC. The degradation of error vector magnitude and sideband suppression due to the presence of package and PCB can be well predicted by the co-simulation results and then verified by the final measurement results.

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BT - Proceedings - IEEE 56th Electronic Components and Technology Conference

T2 - IEEE 56th Electronic Components and Technology Conference

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