Highly sensitive infrared temperature sensor for CMOS compatible thermopiles

Chun An Huang, Chih Hsiung Shen

Research output: Chapter in Book/Report/Conference proceedingConference contribution

4 Citations (Scopus)


A high-sensitivity infrared detector requires small thermal capacitance and small thermal conductance to maximize the temperature change and signal induced by incident IR radiation. The suspended structure of infrared sensors provides ideal, thermally isolated, structures for support of the thin film detector. A new idea of improving CMOS thermopile performance is introduced to reduce the thermal conductance by dividing the thermocouple into several segments, which greatly increase the heat flow barrier. Then, adjacent segments are connected by a minimum width of alumina wire, which change the heat path and accumulated heat at the joint points. Several designs of infrared microsensors can improve performance of signal with reduce of thermal conductance. To that end, by using some adequate designs of polysilicon architecture, we can greatly reduce the heat flow from the main stream without introducing further electric resistance, which is related with noise. The design and simulation of thermopile sensors are realized by using the process parameters of standard 0.35μm CMOS IC technology. Firstly we develop such a structure of thermopile with low thermal conductance and high performance by using CMOS compatible process which can be easily and naturally fabricated. The simulation results show good match with our original idea and great performance than before.

Original languageEnglish
Title of host publicationProgress on Advanced Manufacture for Micro/Nano Technology 2005 - Proceedings of the 2005 International Conference on Advanced Manufacture
PublisherTrans Tech Publications Ltd
Number of pages6
EditionPART 1
ISBN (Print)0878499903, 9780878499908
Publication statusPublished - 2006 Jan 1
Event2005 International Conference on Advanced Manufacture, ICAM2005 - Taipei, R.O.C., Taiwan
Duration: 2005 Nov 282005 Dec 2

Publication series

NameMaterials Science Forum
NumberPART 1
ISSN (Print)0255-5476
ISSN (Electronic)1662-9752


Other2005 International Conference on Advanced Manufacture, ICAM2005
CityTaipei, R.O.C.

All Science Journal Classification (ASJC) codes

  • Materials Science(all)
  • Condensed Matter Physics
  • Mechanics of Materials
  • Mechanical Engineering

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