Heat dissipation analysis of continuously-moving plate undergoing thermal processing using Laplace Adomian decomposition method

Cha'o Kuang Chen, Yu Shen Chang, Chin Chia Liu, Bang Shiuh Chen

Research output: Contribution to journalArticlepeer-review

Fingerprint Dive into the research topics of 'Heat dissipation analysis of continuously-moving plate undergoing thermal processing using Laplace Adomian decomposition method'. Together they form a unique fingerprint.

Engineering & Materials Science