Heat dissipation analysis of continuously-moving plate undergoing thermal processing using Laplace Adomian decomposition method

Cha'o Kuang Chen, Yu Shen Chang, Chin Chia Liu, Bang Shiuh Chen

Research output: Contribution to journalArticle

Abstract

Purpose-This paper aims to use the Laplace Adomian decomposition method (LADM) to investigate the effects of thermal convection, thermal conduction, surface emissivity and thermal radiation on the heat dissipated by a continuously moving plate undergoing thermal processing. Design/methodology/approach-In performing the analysis, it is assumed that the thermal conductivity and surface emissivity of the plate are both temperature-dependent. The accuracy of the LADM solutions is confirmed by comparing the results obtained for the temperature distribution within the plate with those reported in the literature based on the differential transformation method. Findings-It is shown that the heat dissipated from the plate reduces as the Peclet number increases. By contrast, the dissipated heat increases as any one of the non-dimensionalized parameters of the system, i.e. Nc, Nr and B, increases. In addition, the temperature drop along the length of the plate reduces as parameter A increases owing to a more rapid heat transfer. Originality/value-The results provide a useful source of reference for the choice of suitable materials and cooling fluids in a variety of practical applications.

Original languageEnglish
Pages (from-to)2242-2255
Number of pages14
JournalEngineering Computations (Swansea, Wales)
Volume34
Issue number7
DOIs
Publication statusPublished - 2017 Jan 1

All Science Journal Classification (ASJC) codes

  • Software
  • Engineering(all)
  • Computer Science Applications
  • Computational Theory and Mathematics

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