Glass ball grid array arrangement and characterization for capacitive proximity sensor

Chun Yi Chu, Kerwin Wang

Research output: Chapter in Book/Report/Conference proceedingConference contribution

Abstract

In this paper, we proposed a novel capacitive sensor. It was constituted by the parallel enameled copper wires as the electrodes. This sensor can be used to detect the yield ratio of micro assembled glass ball grid array (GBGA). The vacancy of the GBGA causes the capacitance drop, so we can detect the yield ratio of the micro-assembly process of GBGA by monitoring the change of the capacitance. Additionally, we measured the capacitance variation of the relative displacement about the copper wires and the GBGA in longitudinal and transverse directions. The measurements of capacitance variation in longitudinal relative displacement have stepwise features. These features have not been seen in other capacitive proximity sensors.

Original languageEnglish
Title of host publicationProceedings of the 2017 IEEE International Conference on Information, Communication and Engineering
Subtitle of host publicationInformation and Innovation for Modern Technology, ICICE 2017
EditorsArtde Donald Kin-Tak Lam, Stephen D. Prior, Teen-Hang Meen
PublisherInstitute of Electrical and Electronics Engineers Inc.
Pages498-501
Number of pages4
ISBN (Electronic)9781538632024
DOIs
Publication statusPublished - 2018 Oct 1
Event2017 IEEE International Conference on Information, Communication and Engineering, ICICE 2017 - Xiamen, Fujian, China
Duration: 2017 Nov 172017 Nov 20

Publication series

NameProceedings of the 2017 IEEE International Conference on Information, Communication and Engineering: Information and Innovation for Modern Technology, ICICE 2017

Other

Other2017 IEEE International Conference on Information, Communication and Engineering, ICICE 2017
CountryChina
CityXiamen, Fujian
Period17-11-1717-11-20

Fingerprint

Proximity sensors
Capacitive sensors
Ball grid arrays
Capacitance
Glass
Wire
Copper
Vacancies
Electrodes
Grid
Proximity
Sensor
Monitoring
Sensors

All Science Journal Classification (ASJC) codes

  • Computer Networks and Communications
  • Hardware and Architecture
  • Information Systems and Management

Cite this

Chu, C. Y., & Wang, K. (2018). Glass ball grid array arrangement and characterization for capacitive proximity sensor. In A. D. K-T. Lam, S. D. Prior, & T-H. Meen (Eds.), Proceedings of the 2017 IEEE International Conference on Information, Communication and Engineering: Information and Innovation for Modern Technology, ICICE 2017 (pp. 498-501). [8478878] (Proceedings of the 2017 IEEE International Conference on Information, Communication and Engineering: Information and Innovation for Modern Technology, ICICE 2017). Institute of Electrical and Electronics Engineers Inc.. https://doi.org/10.1109/ICICE.2017.8478878
Chu, Chun Yi ; Wang, Kerwin. / Glass ball grid array arrangement and characterization for capacitive proximity sensor. Proceedings of the 2017 IEEE International Conference on Information, Communication and Engineering: Information and Innovation for Modern Technology, ICICE 2017. editor / Artde Donald Kin-Tak Lam ; Stephen D. Prior ; Teen-Hang Meen. Institute of Electrical and Electronics Engineers Inc., 2018. pp. 498-501 (Proceedings of the 2017 IEEE International Conference on Information, Communication and Engineering: Information and Innovation for Modern Technology, ICICE 2017).
@inproceedings{587cc676af214c788e4e7589aeea6a3e,
title = "Glass ball grid array arrangement and characterization for capacitive proximity sensor",
abstract = "In this paper, we proposed a novel capacitive sensor. It was constituted by the parallel enameled copper wires as the electrodes. This sensor can be used to detect the yield ratio of micro assembled glass ball grid array (GBGA). The vacancy of the GBGA causes the capacitance drop, so we can detect the yield ratio of the micro-assembly process of GBGA by monitoring the change of the capacitance. Additionally, we measured the capacitance variation of the relative displacement about the copper wires and the GBGA in longitudinal and transverse directions. The measurements of capacitance variation in longitudinal relative displacement have stepwise features. These features have not been seen in other capacitive proximity sensors.",
author = "Chu, {Chun Yi} and Kerwin Wang",
year = "2018",
month = "10",
day = "1",
doi = "10.1109/ICICE.2017.8478878",
language = "English",
series = "Proceedings of the 2017 IEEE International Conference on Information, Communication and Engineering: Information and Innovation for Modern Technology, ICICE 2017",
publisher = "Institute of Electrical and Electronics Engineers Inc.",
pages = "498--501",
editor = "Lam, {Artde Donald Kin-Tak} and Prior, {Stephen D.} and Teen-Hang Meen",
booktitle = "Proceedings of the 2017 IEEE International Conference on Information, Communication and Engineering",
address = "United States",

}

Chu, CY & Wang, K 2018, Glass ball grid array arrangement and characterization for capacitive proximity sensor. in ADK-T Lam, SD Prior & T-H Meen (eds), Proceedings of the 2017 IEEE International Conference on Information, Communication and Engineering: Information and Innovation for Modern Technology, ICICE 2017., 8478878, Proceedings of the 2017 IEEE International Conference on Information, Communication and Engineering: Information and Innovation for Modern Technology, ICICE 2017, Institute of Electrical and Electronics Engineers Inc., pp. 498-501, 2017 IEEE International Conference on Information, Communication and Engineering, ICICE 2017, Xiamen, Fujian, China, 17-11-17. https://doi.org/10.1109/ICICE.2017.8478878

Glass ball grid array arrangement and characterization for capacitive proximity sensor. / Chu, Chun Yi; Wang, Kerwin.

Proceedings of the 2017 IEEE International Conference on Information, Communication and Engineering: Information and Innovation for Modern Technology, ICICE 2017. ed. / Artde Donald Kin-Tak Lam; Stephen D. Prior; Teen-Hang Meen. Institute of Electrical and Electronics Engineers Inc., 2018. p. 498-501 8478878 (Proceedings of the 2017 IEEE International Conference on Information, Communication and Engineering: Information and Innovation for Modern Technology, ICICE 2017).

Research output: Chapter in Book/Report/Conference proceedingConference contribution

TY - GEN

T1 - Glass ball grid array arrangement and characterization for capacitive proximity sensor

AU - Chu, Chun Yi

AU - Wang, Kerwin

PY - 2018/10/1

Y1 - 2018/10/1

N2 - In this paper, we proposed a novel capacitive sensor. It was constituted by the parallel enameled copper wires as the electrodes. This sensor can be used to detect the yield ratio of micro assembled glass ball grid array (GBGA). The vacancy of the GBGA causes the capacitance drop, so we can detect the yield ratio of the micro-assembly process of GBGA by monitoring the change of the capacitance. Additionally, we measured the capacitance variation of the relative displacement about the copper wires and the GBGA in longitudinal and transverse directions. The measurements of capacitance variation in longitudinal relative displacement have stepwise features. These features have not been seen in other capacitive proximity sensors.

AB - In this paper, we proposed a novel capacitive sensor. It was constituted by the parallel enameled copper wires as the electrodes. This sensor can be used to detect the yield ratio of micro assembled glass ball grid array (GBGA). The vacancy of the GBGA causes the capacitance drop, so we can detect the yield ratio of the micro-assembly process of GBGA by monitoring the change of the capacitance. Additionally, we measured the capacitance variation of the relative displacement about the copper wires and the GBGA in longitudinal and transverse directions. The measurements of capacitance variation in longitudinal relative displacement have stepwise features. These features have not been seen in other capacitive proximity sensors.

UR - http://www.scopus.com/inward/record.url?scp=85056269331&partnerID=8YFLogxK

UR - http://www.scopus.com/inward/citedby.url?scp=85056269331&partnerID=8YFLogxK

U2 - 10.1109/ICICE.2017.8478878

DO - 10.1109/ICICE.2017.8478878

M3 - Conference contribution

T3 - Proceedings of the 2017 IEEE International Conference on Information, Communication and Engineering: Information and Innovation for Modern Technology, ICICE 2017

SP - 498

EP - 501

BT - Proceedings of the 2017 IEEE International Conference on Information, Communication and Engineering

A2 - Lam, Artde Donald Kin-Tak

A2 - Prior, Stephen D.

A2 - Meen, Teen-Hang

PB - Institute of Electrical and Electronics Engineers Inc.

ER -

Chu CY, Wang K. Glass ball grid array arrangement and characterization for capacitive proximity sensor. In Lam ADK-T, Prior SD, Meen T-H, editors, Proceedings of the 2017 IEEE International Conference on Information, Communication and Engineering: Information and Innovation for Modern Technology, ICICE 2017. Institute of Electrical and Electronics Engineers Inc. 2018. p. 498-501. 8478878. (Proceedings of the 2017 IEEE International Conference on Information, Communication and Engineering: Information and Innovation for Modern Technology, ICICE 2017). https://doi.org/10.1109/ICICE.2017.8478878