Abstract
Three are generalized simulation optimizations considering the forging force, the die stress, and the dual-goals in two-stage forging of micro/meso copper fastener. Constant shear friction between the dies and workpiece is assumed to perform multi-stage cold forging forming simulation analysis, and the Taguchi method with the finite element simulation has been used for mold-and-dies parameters design simulation optimizations considering the forging force, die stress, and dual-goals. The die stress optimization is used to explore the effects on effective stress, effective strain, velocity field, die stress, forging force, and shape of product. The influence rank to forging process of micro/meso copper fastener for three optimizations can be determined, and the optimal parameters assembly consider die stress can be obtained in this study. It is noted that the punch design innovation can reduce the forging force and die stress.
| Original language | English |
|---|---|
| Article number | 00002 |
| Journal | MATEC Web of Conferences |
| Volume | 185 |
| DOIs | |
| Publication status | Published - 2018 Jul 31 |
| Event | 2018 3rd International Conference on Precision Machinery and Manufacturing Technology, ICPMMT 2018 - Auckland, New Zealand Duration: 2018 Feb 4 → 2018 Feb 8 |
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All Science Journal Classification (ASJC) codes
- Chemistry(all)
- Materials Science(all)
- Engineering(all)
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Generalized optimizations of two-stage forging of micro/meso copper fastener. / Lin, Shih Hsien; Chai, Un Chin; Tzou, Gow Yi; Chen, Dyi Cheng.
In: MATEC Web of Conferences, Vol. 185, 00002, 31.07.2018.Research output: Contribution to journal › Conference article
TY - JOUR
T1 - Generalized optimizations of two-stage forging of micro/meso copper fastener
AU - Lin, Shih Hsien
AU - Chai, Un Chin
AU - Tzou, Gow Yi
AU - Chen, Dyi Cheng
PY - 2018/7/31
Y1 - 2018/7/31
N2 - Three are generalized simulation optimizations considering the forging force, the die stress, and the dual-goals in two-stage forging of micro/meso copper fastener. Constant shear friction between the dies and workpiece is assumed to perform multi-stage cold forging forming simulation analysis, and the Taguchi method with the finite element simulation has been used for mold-and-dies parameters design simulation optimizations considering the forging force, die stress, and dual-goals. The die stress optimization is used to explore the effects on effective stress, effective strain, velocity field, die stress, forging force, and shape of product. The influence rank to forging process of micro/meso copper fastener for three optimizations can be determined, and the optimal parameters assembly consider die stress can be obtained in this study. It is noted that the punch design innovation can reduce the forging force and die stress.
AB - Three are generalized simulation optimizations considering the forging force, the die stress, and the dual-goals in two-stage forging of micro/meso copper fastener. Constant shear friction between the dies and workpiece is assumed to perform multi-stage cold forging forming simulation analysis, and the Taguchi method with the finite element simulation has been used for mold-and-dies parameters design simulation optimizations considering the forging force, die stress, and dual-goals. The die stress optimization is used to explore the effects on effective stress, effective strain, velocity field, die stress, forging force, and shape of product. The influence rank to forging process of micro/meso copper fastener for three optimizations can be determined, and the optimal parameters assembly consider die stress can be obtained in this study. It is noted that the punch design innovation can reduce the forging force and die stress.
UR - http://www.scopus.com/inward/record.url?scp=85063180275&partnerID=8YFLogxK
UR - http://www.scopus.com/inward/citedby.url?scp=85063180275&partnerID=8YFLogxK
U2 - 10.1051/matecconf/201818500002
DO - 10.1051/matecconf/201818500002
M3 - Conference article
AN - SCOPUS:85063180275
VL - 185
JO - MATEC Web of Conferences
JF - MATEC Web of Conferences
SN - 2261-236X
M1 - 00002
ER -