FEM analysis and experimental verification of the ultrasonic transducer for thermosonic flip-chip bonding machine

Yi Cheng Huang, Fu Sheng Hsiao

Research output: Chapter in Book/Report/Conference proceedingConference contribution

Abstract

The thermosonic flip-chip bonding technology operates in lower temperature, bonding force, and less bonding time than wire bonding. Improving the bonding efficiency of ultrasonic transducers plays an important role for bettering bonding process in gold-to-gold interfaces. Analysis of the transducer tool both in mechanical vibration and electrical performance is great concern. The commercial package GID & ATILA software is used for simulation first. Finding the best resonance frequency of the transducer tool was determined with LCR impedance meter experimentally. In this paper, we illustrate the in-laboratory thermosonic flip-chip bonding machine systematically and some characteristics of an ultrasonic transducer are investigated.

Original languageEnglish
Title of host publication2009 IEEE International Conference on Information and Automation, ICIA 2009
Pages773-777
Number of pages5
DOIs
Publication statusPublished - 2009 Nov 23
Event2009 IEEE International Conference on Information and Automation, ICIA 2009 - Zhuhai, Macau, China
Duration: 2009 Jun 222009 Jun 25

Publication series

Name2009 IEEE International Conference on Information and Automation, ICIA 2009

Other

Other2009 IEEE International Conference on Information and Automation, ICIA 2009
CountryChina
CityZhuhai, Macau
Period09-06-2209-06-25

Fingerprint

Ultrasonic transducers
Finite element method
Transducers
Gold
Wire

All Science Journal Classification (ASJC) codes

  • Computational Theory and Mathematics
  • Computer Science Applications
  • Control and Systems Engineering

Cite this

Huang, Y. C., & Hsiao, F. S. (2009). FEM analysis and experimental verification of the ultrasonic transducer for thermosonic flip-chip bonding machine. In 2009 IEEE International Conference on Information and Automation, ICIA 2009 (pp. 773-777). [5205025] (2009 IEEE International Conference on Information and Automation, ICIA 2009). https://doi.org/10.1109/ICINFA.2009.5205025
Huang, Yi Cheng ; Hsiao, Fu Sheng. / FEM analysis and experimental verification of the ultrasonic transducer for thermosonic flip-chip bonding machine. 2009 IEEE International Conference on Information and Automation, ICIA 2009. 2009. pp. 773-777 (2009 IEEE International Conference on Information and Automation, ICIA 2009).
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Huang, YC & Hsiao, FS 2009, FEM analysis and experimental verification of the ultrasonic transducer for thermosonic flip-chip bonding machine. in 2009 IEEE International Conference on Information and Automation, ICIA 2009., 5205025, 2009 IEEE International Conference on Information and Automation, ICIA 2009, pp. 773-777, 2009 IEEE International Conference on Information and Automation, ICIA 2009, Zhuhai, Macau, China, 09-06-22. https://doi.org/10.1109/ICINFA.2009.5205025

FEM analysis and experimental verification of the ultrasonic transducer for thermosonic flip-chip bonding machine. / Huang, Yi Cheng; Hsiao, Fu Sheng.

2009 IEEE International Conference on Information and Automation, ICIA 2009. 2009. p. 773-777 5205025 (2009 IEEE International Conference on Information and Automation, ICIA 2009).

Research output: Chapter in Book/Report/Conference proceedingConference contribution

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Huang YC, Hsiao FS. FEM analysis and experimental verification of the ultrasonic transducer for thermosonic flip-chip bonding machine. In 2009 IEEE International Conference on Information and Automation, ICIA 2009. 2009. p. 773-777. 5205025. (2009 IEEE International Conference on Information and Automation, ICIA 2009). https://doi.org/10.1109/ICINFA.2009.5205025