TY - GEN
T1 - FEM analysis and experimental verification of the ultrasonic transducer for thermosonic flip-chip bonding machine
AU - Huang, Yi Cheng
AU - Hsiao, Fu Sheng
PY - 2009/11/23
Y1 - 2009/11/23
N2 - The thermosonic flip-chip bonding technology operates in lower temperature, bonding force, and less bonding time than wire bonding. Improving the bonding efficiency of ultrasonic transducers plays an important role for bettering bonding process in gold-to-gold interfaces. Analysis of the transducer tool both in mechanical vibration and electrical performance is great concern. The commercial package GID & ATILA software is used for simulation first. Finding the best resonance frequency of the transducer tool was determined with LCR impedance meter experimentally. In this paper, we illustrate the in-laboratory thermosonic flip-chip bonding machine systematically and some characteristics of an ultrasonic transducer are investigated.
AB - The thermosonic flip-chip bonding technology operates in lower temperature, bonding force, and less bonding time than wire bonding. Improving the bonding efficiency of ultrasonic transducers plays an important role for bettering bonding process in gold-to-gold interfaces. Analysis of the transducer tool both in mechanical vibration and electrical performance is great concern. The commercial package GID & ATILA software is used for simulation first. Finding the best resonance frequency of the transducer tool was determined with LCR impedance meter experimentally. In this paper, we illustrate the in-laboratory thermosonic flip-chip bonding machine systematically and some characteristics of an ultrasonic transducer are investigated.
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U2 - 10.1109/ICINFA.2009.5205025
DO - 10.1109/ICINFA.2009.5205025
M3 - Conference contribution
AN - SCOPUS:70449644233
SN - 9781424436088
T3 - 2009 IEEE International Conference on Information and Automation, ICIA 2009
SP - 773
EP - 777
BT - 2009 IEEE International Conference on Information and Automation, ICIA 2009
T2 - 2009 IEEE International Conference on Information and Automation, ICIA 2009
Y2 - 22 June 2009 through 25 June 2009
ER -