Abstract
The thermosonic flip-chip bonding technology operates in lower temperature, bonding force, and less bonding time than wire bonding. Improving the bonding efficiency of ultrasonic transducers plays an important role for bettering bonding process in gold-to-gold interfaces. Analysis of the transducer tool both in mechanical vibration and electrical performance is great concern. The commercial package GID & ATILA software is used for simulation first. Finding the best resonance frequency of the transducer tool was determined with LCR impedance meter experimentally. In this paper, we illustrate the in-laboratory thermosonic flip-chip bonding machine systematically and some characteristics of an ultrasonic transducer are investigated.
| Original language | English |
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| Title of host publication | 2009 IEEE International Conference on Information and Automation, ICIA 2009 |
| Pages | 773-777 |
| Number of pages | 5 |
| DOIs | |
| Publication status | Published - 2009 Nov 23 |
| Event | 2009 IEEE International Conference on Information and Automation, ICIA 2009 - Zhuhai, Macau, China Duration: 2009 Jun 22 → 2009 Jun 25 |
Publication series
| Name | 2009 IEEE International Conference on Information and Automation, ICIA 2009 |
|---|
Other
| Other | 2009 IEEE International Conference on Information and Automation, ICIA 2009 |
|---|---|
| Country | China |
| City | Zhuhai, Macau |
| Period | 09-06-22 → 09-06-25 |
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All Science Journal Classification (ASJC) codes
- Computational Theory and Mathematics
- Computer Science Applications
- Control and Systems Engineering
Cite this
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FEM analysis and experimental verification of the ultrasonic transducer for thermosonic flip-chip bonding machine. / Huang, Yi Cheng; Hsiao, Fu Sheng.
2009 IEEE International Conference on Information and Automation, ICIA 2009. 2009. p. 773-777 5205025 (2009 IEEE International Conference on Information and Automation, ICIA 2009).Research output: Chapter in Book/Report/Conference proceeding › Conference contribution
TY - GEN
T1 - FEM analysis and experimental verification of the ultrasonic transducer for thermosonic flip-chip bonding machine
AU - Huang, Yi Cheng
AU - Hsiao, Fu Sheng
PY - 2009/11/23
Y1 - 2009/11/23
N2 - The thermosonic flip-chip bonding technology operates in lower temperature, bonding force, and less bonding time than wire bonding. Improving the bonding efficiency of ultrasonic transducers plays an important role for bettering bonding process in gold-to-gold interfaces. Analysis of the transducer tool both in mechanical vibration and electrical performance is great concern. The commercial package GID & ATILA software is used for simulation first. Finding the best resonance frequency of the transducer tool was determined with LCR impedance meter experimentally. In this paper, we illustrate the in-laboratory thermosonic flip-chip bonding machine systematically and some characteristics of an ultrasonic transducer are investigated.
AB - The thermosonic flip-chip bonding technology operates in lower temperature, bonding force, and less bonding time than wire bonding. Improving the bonding efficiency of ultrasonic transducers plays an important role for bettering bonding process in gold-to-gold interfaces. Analysis of the transducer tool both in mechanical vibration and electrical performance is great concern. The commercial package GID & ATILA software is used for simulation first. Finding the best resonance frequency of the transducer tool was determined with LCR impedance meter experimentally. In this paper, we illustrate the in-laboratory thermosonic flip-chip bonding machine systematically and some characteristics of an ultrasonic transducer are investigated.
UR - http://www.scopus.com/inward/record.url?scp=70449644233&partnerID=8YFLogxK
UR - http://www.scopus.com/inward/citedby.url?scp=70449644233&partnerID=8YFLogxK
U2 - 10.1109/ICINFA.2009.5205025
DO - 10.1109/ICINFA.2009.5205025
M3 - Conference contribution
AN - SCOPUS:70449644233
SN - 9781424436088
T3 - 2009 IEEE International Conference on Information and Automation, ICIA 2009
SP - 773
EP - 777
BT - 2009 IEEE International Conference on Information and Automation, ICIA 2009
ER -