FEM analysis and experimental verification of the ultrasonic transducer for thermosonic flip-chip bonding machine

Yi Cheng Huang; Fu Sheng Hsiao

doi:10.1109/ICINFA.2009.5205025

FEM analysis and experimental verification of the ultrasonic transducer for thermosonic flip-chip bonding machine

Yi Cheng Huang, Fu Sheng Hsiao

Department of Mechatronic Engineering

Research output: Chapter in Book/Report/Conference proceeding › Conference contribution

Abstract

The thermosonic flip-chip bonding technology operates in lower temperature, bonding force, and less bonding time than wire bonding. Improving the bonding efficiency of ultrasonic transducers plays an important role for bettering bonding process in gold-to-gold interfaces. Analysis of the transducer tool both in mechanical vibration and electrical performance is great concern. The commercial package GID & ATILA software is used for simulation first. Finding the best resonance frequency of the transducer tool was determined with LCR impedance meter experimentally. In this paper, we illustrate the in-laboratory thermosonic flip-chip bonding machine systematically and some characteristics of an ultrasonic transducer are investigated.

Original language	English
Title of host publication	2009 IEEE International Conference on Information and Automation, ICIA 2009
Pages	773-777
Number of pages	5
DOIs	https://doi.org/10.1109/ICINFA.2009.5205025
Publication status	Published - 2009 Nov 23
Event	2009 IEEE International Conference on Information and Automation, ICIA 2009 - Zhuhai, Macau, China Duration: 2009 Jun 22 → 2009 Jun 25

Publication series

Name	2009 IEEE International Conference on Information and Automation, ICIA 2009

Other

Other	2009 IEEE International Conference on Information and Automation, ICIA 2009
Country	China
City	Zhuhai, Macau
Period	09-06-22 → 09-06-25

All Science Journal Classification (ASJC) codes

Computational Theory and Mathematics
Computer Science Applications
Control and Systems Engineering

Access to Document

10.1109/ICINFA.2009.5205025

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Huang, Y. C., & Hsiao, F. S. (2009). FEM analysis and experimental verification of the ultrasonic transducer for thermosonic flip-chip bonding machine. In 2009 IEEE International Conference on Information and Automation, ICIA 2009 (pp. 773-777). [5205025] (2009 IEEE International Conference on Information and Automation, ICIA 2009). https://doi.org/10.1109/ICINFA.2009.5205025

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title = "FEM analysis and experimental verification of the ultrasonic transducer for thermosonic flip-chip bonding machine",

abstract = "The thermosonic flip-chip bonding technology operates in lower temperature, bonding force, and less bonding time than wire bonding. Improving the bonding efficiency of ultrasonic transducers plays an important role for bettering bonding process in gold-to-gold interfaces. Analysis of the transducer tool both in mechanical vibration and electrical performance is great concern. The commercial package GID & ATILA software is used for simulation first. Finding the best resonance frequency of the transducer tool was determined with LCR impedance meter experimentally. In this paper, we illustrate the in-laboratory thermosonic flip-chip bonding machine systematically and some characteristics of an ultrasonic transducer are investigated.",

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doi = "10.1109/ICINFA.2009.5205025",

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Huang, YC & Hsiao, FS 2009, FEM analysis and experimental verification of the ultrasonic transducer for thermosonic flip-chip bonding machine. in 2009 IEEE International Conference on Information and Automation, ICIA 2009., 5205025, 2009 IEEE International Conference on Information and Automation, ICIA 2009, pp. 773-777, 2009 IEEE International Conference on Information and Automation, ICIA 2009, Zhuhai, Macau, China, 09-06-22. https://doi.org/10.1109/ICINFA.2009.5205025

FEM analysis and experimental verification of the ultrasonic transducer for thermosonic flip-chip bonding machine. / Huang, Yi Cheng; Hsiao, Fu Sheng.

2009 IEEE International Conference on Information and Automation, ICIA 2009. 2009. p. 773-777 5205025 (2009 IEEE International Conference on Information and Automation, ICIA 2009).

Research output: Chapter in Book/Report/Conference proceeding › Conference contribution

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