Feature extraction of the wafer probe marks in IC packaging

Cheng Yu Tsai, Chia Te Lin, Chen Ting Kao, Chau-Shing Wang

Research output: Chapter in Book/Report/Conference proceedingConference contribution

Abstract

This paper presents an image processing approach to extract six features of the probe mark on semiconductor wafer pads. The electrical characteristics of the chip pad must be tested using a probing needle before wire-bonding to the wafer. However, this test leaves probe marks on the pad. A large probe mark area results in poor adhesion forces at the bond ball of the pad, thus leading to undesirable products. In this paper, we present a method to extract six features of the wafer probe marks in IC packaging for further digital image processing.

Original languageEnglish
Title of host publication2017 International Conference on Robotics and Machine Vision
PublisherSPIE
Volume10613
ISBN (Electronic)9781510617308
DOIs
Publication statusPublished - 2017 Jan 1
Event2017 2nd International Conference on Robotics and Machine Vision, ICRMV 2017 - Kitakyushu, Japan
Duration: 2017 Sep 152017 Sep 18

Other

Other2017 2nd International Conference on Robotics and Machine Vision, ICRMV 2017
CountryJapan
CityKitakyushu
Period17-09-1517-09-18

Fingerprint

Packaging
packaging
pattern recognition
Wafer
Feature Extraction
Feature extraction
Probe
wafers
probes
image processing
Image processing
Digital Image Processing
Adhesion
needles
Needles
leaves
balls
Semiconductors
Image Processing
Ball

All Science Journal Classification (ASJC) codes

  • Electronic, Optical and Magnetic Materials
  • Condensed Matter Physics
  • Computer Science Applications
  • Applied Mathematics
  • Electrical and Electronic Engineering

Cite this

Tsai, C. Y., Lin, C. T., Kao, C. T., & Wang, C-S. (2017). Feature extraction of the wafer probe marks in IC packaging. In 2017 International Conference on Robotics and Machine Vision (Vol. 10613). [1061308] SPIE. https://doi.org/10.1117/12.2299924
Tsai, Cheng Yu ; Lin, Chia Te ; Kao, Chen Ting ; Wang, Chau-Shing. / Feature extraction of the wafer probe marks in IC packaging. 2017 International Conference on Robotics and Machine Vision. Vol. 10613 SPIE, 2017.
@inproceedings{7d4ff2fe84af4c218b16e7d93269e27f,
title = "Feature extraction of the wafer probe marks in IC packaging",
abstract = "This paper presents an image processing approach to extract six features of the probe mark on semiconductor wafer pads. The electrical characteristics of the chip pad must be tested using a probing needle before wire-bonding to the wafer. However, this test leaves probe marks on the pad. A large probe mark area results in poor adhesion forces at the bond ball of the pad, thus leading to undesirable products. In this paper, we present a method to extract six features of the wafer probe marks in IC packaging for further digital image processing.",
author = "Tsai, {Cheng Yu} and Lin, {Chia Te} and Kao, {Chen Ting} and Chau-Shing Wang",
year = "2017",
month = "1",
day = "1",
doi = "10.1117/12.2299924",
language = "English",
volume = "10613",
booktitle = "2017 International Conference on Robotics and Machine Vision",
publisher = "SPIE",
address = "United States",

}

Tsai, CY, Lin, CT, Kao, CT & Wang, C-S 2017, Feature extraction of the wafer probe marks in IC packaging. in 2017 International Conference on Robotics and Machine Vision. vol. 10613, 1061308, SPIE, 2017 2nd International Conference on Robotics and Machine Vision, ICRMV 2017, Kitakyushu, Japan, 17-09-15. https://doi.org/10.1117/12.2299924

Feature extraction of the wafer probe marks in IC packaging. / Tsai, Cheng Yu; Lin, Chia Te; Kao, Chen Ting; Wang, Chau-Shing.

2017 International Conference on Robotics and Machine Vision. Vol. 10613 SPIE, 2017. 1061308.

Research output: Chapter in Book/Report/Conference proceedingConference contribution

TY - GEN

T1 - Feature extraction of the wafer probe marks in IC packaging

AU - Tsai, Cheng Yu

AU - Lin, Chia Te

AU - Kao, Chen Ting

AU - Wang, Chau-Shing

PY - 2017/1/1

Y1 - 2017/1/1

N2 - This paper presents an image processing approach to extract six features of the probe mark on semiconductor wafer pads. The electrical characteristics of the chip pad must be tested using a probing needle before wire-bonding to the wafer. However, this test leaves probe marks on the pad. A large probe mark area results in poor adhesion forces at the bond ball of the pad, thus leading to undesirable products. In this paper, we present a method to extract six features of the wafer probe marks in IC packaging for further digital image processing.

AB - This paper presents an image processing approach to extract six features of the probe mark on semiconductor wafer pads. The electrical characteristics of the chip pad must be tested using a probing needle before wire-bonding to the wafer. However, this test leaves probe marks on the pad. A large probe mark area results in poor adhesion forces at the bond ball of the pad, thus leading to undesirable products. In this paper, we present a method to extract six features of the wafer probe marks in IC packaging for further digital image processing.

UR - http://www.scopus.com/inward/record.url?scp=85040452832&partnerID=8YFLogxK

UR - http://www.scopus.com/inward/citedby.url?scp=85040452832&partnerID=8YFLogxK

U2 - 10.1117/12.2299924

DO - 10.1117/12.2299924

M3 - Conference contribution

VL - 10613

BT - 2017 International Conference on Robotics and Machine Vision

PB - SPIE

ER -

Tsai CY, Lin CT, Kao CT, Wang C-S. Feature extraction of the wafer probe marks in IC packaging. In 2017 International Conference on Robotics and Machine Vision. Vol. 10613. SPIE. 2017. 1061308 https://doi.org/10.1117/12.2299924