Feature extraction of the wafer probe marks in IC packaging

Cheng Yu Tsai, Chia Te Lin, Chen Ting Kao, Chau Shing Wang

Research output: Chapter in Book/Report/Conference proceedingConference contribution

Abstract

This paper presents an image processing approach to extract six features of the probe mark on semiconductor wafer pads. The electrical characteristics of the chip pad must be tested using a probing needle before wire-bonding to the wafer. However, this test leaves probe marks on the pad. A large probe mark area results in poor adhesion forces at the bond ball of the pad, thus leading to undesirable products. In this paper, we present a method to extract six features of the wafer probe marks in IC packaging for further digital image processing.

Original languageEnglish
Title of host publication2017 International Conference on Robotics and Machine Vision
EditorsGenci Capi, Chiharu Ishii, Jianhong Zhou
PublisherSPIE
ISBN (Electronic)9781510617308
DOIs
Publication statusPublished - 2017 Jan 1
Event2017 2nd International Conference on Robotics and Machine Vision, ICRMV 2017 - Kitakyushu, Japan
Duration: 2017 Sep 152017 Sep 18

Publication series

NameProceedings of SPIE - The International Society for Optical Engineering
Volume10613
ISSN (Print)0277-786X
ISSN (Electronic)1996-756X

Other

Other2017 2nd International Conference on Robotics and Machine Vision, ICRMV 2017
CountryJapan
CityKitakyushu
Period17-09-1517-09-18

All Science Journal Classification (ASJC) codes

  • Electronic, Optical and Magnetic Materials
  • Condensed Matter Physics
  • Computer Science Applications
  • Applied Mathematics
  • Electrical and Electronic Engineering

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