Abstract
The current light-emitting diodes (LED) flip chip has the advantage of high speed electricity, small volume, good heat dissipation and high I/O density for modern display technology. Thermosonic bonding system for LED seeking to feature with lower temperature and lower pressure for industrial application is overwhelming. Development of such potential precision, fine pitch and with shorten ultrasonic time for manufacturing process is studied in this paper. This apparatus consists of (1). a mechanism system comprised with the precise positioning, loading and unloading stages, (2) control system for chip placement and visualization of LED, (3) the flip chip bonding head module consisted with ultrasonic bolt-clamped Langevin type transducer (piezo actuator), horn device and tool for chip and substrate compression, and (4) a chip vacuum head is design for the bettering bonding processing. Experiments results with consideration of temperature, pressure, ultrasonic power and ultrasonic time are conducted by using Taguchi method for optimization. Results show the in laboratory developed thermosonic flip chip bonding system can be potentially used for back light module in display technology.
| Original language | English |
|---|---|
| Title of host publication | Proceedings of the 2007 4th IEEE International Conference on Mechatronics, ICM 2007 |
| DOIs | |
| Publication status | Published - 2007 Dec 1 |
| Event | 4th IEEE International Conference on Mechatronics, ICM 2007 - Kumamoto, Japan Duration: 2007 May 8 → 2007 May 10 |
Publication series
| Name | Proceedings of the 2007 4th IEEE International Conference on Mechatronics, ICM 2007 |
|---|
Other
| Other | 4th IEEE International Conference on Mechatronics, ICM 2007 |
|---|---|
| Country | Japan |
| City | Kumamoto |
| Period | 07-05-08 → 07-05-10 |
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All Science Journal Classification (ASJC) codes
- Control and Systems Engineering
- Electrical and Electronic Engineering
Cite this
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Fabrication study of a LED thermosonic flip chip bonding apparatus. / Huang, Yi-Cheng; Li, K. Y.; Hsiao, F. S.; Chen, C. H.
Proceedings of the 2007 4th IEEE International Conference on Mechatronics, ICM 2007. 2007. 4280023 (Proceedings of the 2007 4th IEEE International Conference on Mechatronics, ICM 2007).Research output: Chapter in Book/Report/Conference proceeding › Conference contribution
TY - GEN
T1 - Fabrication study of a LED thermosonic flip chip bonding apparatus
AU - Huang, Yi-Cheng
AU - Li, K. Y.
AU - Hsiao, F. S.
AU - Chen, C. H.
PY - 2007/12/1
Y1 - 2007/12/1
N2 - The current light-emitting diodes (LED) flip chip has the advantage of high speed electricity, small volume, good heat dissipation and high I/O density for modern display technology. Thermosonic bonding system for LED seeking to feature with lower temperature and lower pressure for industrial application is overwhelming. Development of such potential precision, fine pitch and with shorten ultrasonic time for manufacturing process is studied in this paper. This apparatus consists of (1). a mechanism system comprised with the precise positioning, loading and unloading stages, (2) control system for chip placement and visualization of LED, (3) the flip chip bonding head module consisted with ultrasonic bolt-clamped Langevin type transducer (piezo actuator), horn device and tool for chip and substrate compression, and (4) a chip vacuum head is design for the bettering bonding processing. Experiments results with consideration of temperature, pressure, ultrasonic power and ultrasonic time are conducted by using Taguchi method for optimization. Results show the in laboratory developed thermosonic flip chip bonding system can be potentially used for back light module in display technology.
AB - The current light-emitting diodes (LED) flip chip has the advantage of high speed electricity, small volume, good heat dissipation and high I/O density for modern display technology. Thermosonic bonding system for LED seeking to feature with lower temperature and lower pressure for industrial application is overwhelming. Development of such potential precision, fine pitch and with shorten ultrasonic time for manufacturing process is studied in this paper. This apparatus consists of (1). a mechanism system comprised with the precise positioning, loading and unloading stages, (2) control system for chip placement and visualization of LED, (3) the flip chip bonding head module consisted with ultrasonic bolt-clamped Langevin type transducer (piezo actuator), horn device and tool for chip and substrate compression, and (4) a chip vacuum head is design for the bettering bonding processing. Experiments results with consideration of temperature, pressure, ultrasonic power and ultrasonic time are conducted by using Taguchi method for optimization. Results show the in laboratory developed thermosonic flip chip bonding system can be potentially used for back light module in display technology.
UR - http://www.scopus.com/inward/record.url?scp=50649114416&partnerID=8YFLogxK
UR - http://www.scopus.com/inward/citedby.url?scp=50649114416&partnerID=8YFLogxK
U2 - 10.1109/ICMECH.2007.4280023
DO - 10.1109/ICMECH.2007.4280023
M3 - Conference contribution
AN - SCOPUS:50649114416
SN - 142441184X
SN - 9781424411849
T3 - Proceedings of the 2007 4th IEEE International Conference on Mechatronics, ICM 2007
BT - Proceedings of the 2007 4th IEEE International Conference on Mechatronics, ICM 2007
ER -