Fabrication study of a LED thermosonic flip chip bonding apparatus

Yi-Cheng Huang, K. Y. Li, F. S. Hsiao, C. H. Chen

Research output: Chapter in Book/Report/Conference proceedingConference contribution

Abstract

The current light-emitting diodes (LED) flip chip has the advantage of high speed electricity, small volume, good heat dissipation and high I/O density for modern display technology. Thermosonic bonding system for LED seeking to feature with lower temperature and lower pressure for industrial application is overwhelming. Development of such potential precision, fine pitch and with shorten ultrasonic time for manufacturing process is studied in this paper. This apparatus consists of (1). a mechanism system comprised with the precise positioning, loading and unloading stages, (2) control system for chip placement and visualization of LED, (3) the flip chip bonding head module consisted with ultrasonic bolt-clamped Langevin type transducer (piezo actuator), horn device and tool for chip and substrate compression, and (4) a chip vacuum head is design for the bettering bonding processing. Experiments results with consideration of temperature, pressure, ultrasonic power and ultrasonic time are conducted by using Taguchi method for optimization. Results show the in laboratory developed thermosonic flip chip bonding system can be potentially used for back light module in display technology.

Original languageEnglish
Title of host publicationProceedings of the 2007 4th IEEE International Conference on Mechatronics, ICM 2007
DOIs
Publication statusPublished - 2007 Dec 1
Event4th IEEE International Conference on Mechatronics, ICM 2007 - Kumamoto, Japan
Duration: 2007 May 82007 May 10

Publication series

NameProceedings of the 2007 4th IEEE International Conference on Mechatronics, ICM 2007

Other

Other4th IEEE International Conference on Mechatronics, ICM 2007
CountryJapan
CityKumamoto
Period07-05-0807-05-10

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All Science Journal Classification (ASJC) codes

  • Control and Systems Engineering
  • Electrical and Electronic Engineering

Cite this

Huang, Y-C., Li, K. Y., Hsiao, F. S., & Chen, C. H. (2007). Fabrication study of a LED thermosonic flip chip bonding apparatus. In Proceedings of the 2007 4th IEEE International Conference on Mechatronics, ICM 2007 [4280023] (Proceedings of the 2007 4th IEEE International Conference on Mechatronics, ICM 2007). https://doi.org/10.1109/ICMECH.2007.4280023