Abstract
The thermosonic bonding parameters on LEDs involve different bonding temperatures, different bonding force, different bonding time and different ultrasonic power. Improving the efficiency of ultrasonic transducers plays an important role in the bonding process. However, the place of the tool on the transducer has affected transducer work efficiency. Therefore, to analyse the transducer and tool provided reliable experimental basis by using the commercial package GID & ATILA software. Finding the resonance frequency of the transducer was measured with LCR HiTESTER. By using laser metrology measurement, the real displacement was measured. Finding the results of the optimization promoted the parameter combination of less force and lower bonding temperature. Using a simple thrust machine created the shearing force for bonding force investigation. Experiment results considering temperature, pressure, ultrasonic power and ultrasonic time are conducted using the Taguchi method for optimization. Experimental results illustrated the optimization are reached a promising aim for the flip-chip LED in thermosonic bonding manufacturing.
| Original language | English |
|---|---|
| Title of host publication | Proceedings of the 2008 IEEE/ASME International Conference on Advanced Intelligent Mechatronics, AIM 2008 |
| Pages | 1002-1007 |
| Number of pages | 6 |
| DOIs | |
| Publication status | Published - 2008 Sep 30 |
| Event | 2008 IEEE/ASME International Conference on Advanced Intelligent Mechatronics, AIM 2008 - Xi'an, China Duration: 2008 Aug 2 → 2008 Aug 5 |
Publication series
| Name | IEEE/ASME International Conference on Advanced Intelligent Mechatronics, AIM |
|---|
Other
| Other | 2008 IEEE/ASME International Conference on Advanced Intelligent Mechatronics, AIM 2008 |
|---|---|
| Country | China |
| City | Xi'an |
| Period | 08-08-02 → 08-08-05 |
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All Science Journal Classification (ASJC) codes
- Control and Systems Engineering
- Software
- Computer Science Applications
- Electrical and Electronic Engineering
Cite this
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Experiment study on bonding tool of thermosonic transducer for flip-chip bonding. / Huang, Yi-Cheng; Li, Run Yang; Chen, Chi Hui.
Proceedings of the 2008 IEEE/ASME International Conference on Advanced Intelligent Mechatronics, AIM 2008. 2008. p. 1002-1007 4601798 (IEEE/ASME International Conference on Advanced Intelligent Mechatronics, AIM).Research output: Chapter in Book/Report/Conference proceeding › Conference contribution
TY - GEN
T1 - Experiment study on bonding tool of thermosonic transducer for flip-chip bonding
AU - Huang, Yi-Cheng
AU - Li, Run Yang
AU - Chen, Chi Hui
PY - 2008/9/30
Y1 - 2008/9/30
N2 - The thermosonic bonding parameters on LEDs involve different bonding temperatures, different bonding force, different bonding time and different ultrasonic power. Improving the efficiency of ultrasonic transducers plays an important role in the bonding process. However, the place of the tool on the transducer has affected transducer work efficiency. Therefore, to analyse the transducer and tool provided reliable experimental basis by using the commercial package GID & ATILA software. Finding the resonance frequency of the transducer was measured with LCR HiTESTER. By using laser metrology measurement, the real displacement was measured. Finding the results of the optimization promoted the parameter combination of less force and lower bonding temperature. Using a simple thrust machine created the shearing force for bonding force investigation. Experiment results considering temperature, pressure, ultrasonic power and ultrasonic time are conducted using the Taguchi method for optimization. Experimental results illustrated the optimization are reached a promising aim for the flip-chip LED in thermosonic bonding manufacturing.
AB - The thermosonic bonding parameters on LEDs involve different bonding temperatures, different bonding force, different bonding time and different ultrasonic power. Improving the efficiency of ultrasonic transducers plays an important role in the bonding process. However, the place of the tool on the transducer has affected transducer work efficiency. Therefore, to analyse the transducer and tool provided reliable experimental basis by using the commercial package GID & ATILA software. Finding the resonance frequency of the transducer was measured with LCR HiTESTER. By using laser metrology measurement, the real displacement was measured. Finding the results of the optimization promoted the parameter combination of less force and lower bonding temperature. Using a simple thrust machine created the shearing force for bonding force investigation. Experiment results considering temperature, pressure, ultrasonic power and ultrasonic time are conducted using the Taguchi method for optimization. Experimental results illustrated the optimization are reached a promising aim for the flip-chip LED in thermosonic bonding manufacturing.
UR - http://www.scopus.com/inward/record.url?scp=52449105354&partnerID=8YFLogxK
UR - http://www.scopus.com/inward/citedby.url?scp=52449105354&partnerID=8YFLogxK
U2 - 10.1109/AIM.2008.4601798
DO - 10.1109/AIM.2008.4601798
M3 - Conference contribution
AN - SCOPUS:52449105354
SN - 9781424424955
T3 - IEEE/ASME International Conference on Advanced Intelligent Mechatronics, AIM
SP - 1002
EP - 1007
BT - Proceedings of the 2008 IEEE/ASME International Conference on Advanced Intelligent Mechatronics, AIM 2008
ER -