Experiment study on bonding tool of thermosonic transducer for flip-chip bonding

Yi-Cheng Huang, Run Yang Li, Chi Hui Chen

Research output: Chapter in Book/Report/Conference proceedingConference contribution

2 Citations (Scopus)

Abstract

The thermosonic bonding parameters on LEDs involve different bonding temperatures, different bonding force, different bonding time and different ultrasonic power. Improving the efficiency of ultrasonic transducers plays an important role in the bonding process. However, the place of the tool on the transducer has affected transducer work efficiency. Therefore, to analyse the transducer and tool provided reliable experimental basis by using the commercial package GID & ATILA software. Finding the resonance frequency of the transducer was measured with LCR HiTESTER. By using laser metrology measurement, the real displacement was measured. Finding the results of the optimization promoted the parameter combination of less force and lower bonding temperature. Using a simple thrust machine created the shearing force for bonding force investigation. Experiment results considering temperature, pressure, ultrasonic power and ultrasonic time are conducted using the Taguchi method for optimization. Experimental results illustrated the optimization are reached a promising aim for the flip-chip LED in thermosonic bonding manufacturing.

Original languageEnglish
Title of host publicationProceedings of the 2008 IEEE/ASME International Conference on Advanced Intelligent Mechatronics, AIM 2008
Pages1002-1007
Number of pages6
DOIs
Publication statusPublished - 2008 Sep 30
Event2008 IEEE/ASME International Conference on Advanced Intelligent Mechatronics, AIM 2008 - Xi'an, China
Duration: 2008 Aug 22008 Aug 5

Publication series

NameIEEE/ASME International Conference on Advanced Intelligent Mechatronics, AIM

Other

Other2008 IEEE/ASME International Conference on Advanced Intelligent Mechatronics, AIM 2008
CountryChina
CityXi'an
Period08-08-0208-08-05

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All Science Journal Classification (ASJC) codes

  • Control and Systems Engineering
  • Software
  • Computer Science Applications
  • Electrical and Electronic Engineering

Cite this

Huang, Y-C., Li, R. Y., & Chen, C. H. (2008). Experiment study on bonding tool of thermosonic transducer for flip-chip bonding. In Proceedings of the 2008 IEEE/ASME International Conference on Advanced Intelligent Mechatronics, AIM 2008 (pp. 1002-1007). [4601798] (IEEE/ASME International Conference on Advanced Intelligent Mechatronics, AIM). https://doi.org/10.1109/AIM.2008.4601798