Electrical performance of micro-assembled beads under different temperatures and loadings

Yen Lin Tzeng, Kerwin Wang

Research output: Chapter in Book/Report/Conference proceedingConference contribution

Abstract

Micro-assembly is an efficient tool to build electrical connections with metallic micro-beads. This process uses patterned photoresist AZ1512 as an adhesion for micro-bead arrangement. The assembled beads is immobilized with underfill embedment (ZYMET 2821). This method allows arbitrary geometric pattern designs. All of these processes can be completed below 150°C. This paper characterizes the electrical performance of these densely-arranged anisotropic conductive tunnels under different temperatures and stresses loading Experiment results suggest that using photoresist to assemble micro conductive beads with underfill immobilization can yield stable performance.

Original languageEnglish
Title of host publication2012 7th IEEE International Conference on Nano/Micro Engineered and Molecular Systems, NEMS 2012
Pages433-436
Number of pages4
DOIs
Publication statusPublished - 2012 Jun 1
Event7th IEEE International Conference on Nano/Micro Engineered and Molecular Systems, NEMS 2012 - Kyoto, Japan
Duration: 2012 Mar 52012 Mar 8

Publication series

Name2012 7th IEEE International Conference on Nano/Micro Engineered and Molecular Systems, NEMS 2012

Other

Other7th IEEE International Conference on Nano/Micro Engineered and Molecular Systems, NEMS 2012
CountryJapan
CityKyoto
Period12-03-0512-03-08

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All Science Journal Classification (ASJC) codes

  • Engineering (miscellaneous)

Cite this

Tzeng, Y. L., & Wang, K. (2012). Electrical performance of micro-assembled beads under different temperatures and loadings. In 2012 7th IEEE International Conference on Nano/Micro Engineered and Molecular Systems, NEMS 2012 (pp. 433-436). [6196811] (2012 7th IEEE International Conference on Nano/Micro Engineered and Molecular Systems, NEMS 2012). https://doi.org/10.1109/NEMS.2012.6196811