Electrical modeling of quad flat no-lead packages for high-frequency ic applications

Yeong-Lin Lai, Cheng Yu Ho

Research output: Contribution to conferencePaper

Abstract

This paper presents electrical modeling of quad flat no-lead (QFN) packages for high-frequency integrated-circuit (IC) applications. In order to predict effectively the package characteristics, the QFN packages were modeled by three-dimensional electromagnetic numerical simulation according to the physical package structures of the real QFN packages. An analytical method was also used to model the QFN packages and extract the parasitic parameters of the packages, including capacitances, inductances, and resistances. The microwave characteristics of the QFN packages, such as return loss and insertion loss, were studied under open-path and short-path configurations. The S parameters of the QFN packages from the numerical modeling are consistent with those from the analytical modeling at the frequencies up to 15 GHz.

Original languageEnglish
Publication statusPublished - 2004 Dec 1
EventIEEE TENCON 2004 - 2004 IEEE Region 10 Conference: Analog and Digital Techniques in Electrical Engineering - Chiang Mai, Thailand
Duration: 2004 Nov 212004 Nov 24

Other

OtherIEEE TENCON 2004 - 2004 IEEE Region 10 Conference: Analog and Digital Techniques in Electrical Engineering
CountryThailand
CityChiang Mai
Period04-11-2104-11-24

Fingerprint

Lead
Scattering parameters
Insertion losses
Inductance
Integrated circuits
Capacitance
Microwaves
Computer simulation

All Science Journal Classification (ASJC) codes

  • Computer Science Applications
  • Electrical and Electronic Engineering

Cite this

Lai, Y-L., & Ho, C. Y. (2004). Electrical modeling of quad flat no-lead packages for high-frequency ic applications. Paper presented at IEEE TENCON 2004 - 2004 IEEE Region 10 Conference: Analog and Digital Techniques in Electrical Engineering, Chiang Mai, Thailand.
Lai, Yeong-Lin ; Ho, Cheng Yu. / Electrical modeling of quad flat no-lead packages for high-frequency ic applications. Paper presented at IEEE TENCON 2004 - 2004 IEEE Region 10 Conference: Analog and Digital Techniques in Electrical Engineering, Chiang Mai, Thailand.
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Lai, Y-L & Ho, CY 2004, 'Electrical modeling of quad flat no-lead packages for high-frequency ic applications' Paper presented at IEEE TENCON 2004 - 2004 IEEE Region 10 Conference: Analog and Digital Techniques in Electrical Engineering, Chiang Mai, Thailand, 04-11-21 - 04-11-24, .

Electrical modeling of quad flat no-lead packages for high-frequency ic applications. / Lai, Yeong-Lin; Ho, Cheng Yu.

2004. Paper presented at IEEE TENCON 2004 - 2004 IEEE Region 10 Conference: Analog and Digital Techniques in Electrical Engineering, Chiang Mai, Thailand.

Research output: Contribution to conferencePaper

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AB - This paper presents electrical modeling of quad flat no-lead (QFN) packages for high-frequency integrated-circuit (IC) applications. In order to predict effectively the package characteristics, the QFN packages were modeled by three-dimensional electromagnetic numerical simulation according to the physical package structures of the real QFN packages. An analytical method was also used to model the QFN packages and extract the parasitic parameters of the packages, including capacitances, inductances, and resistances. The microwave characteristics of the QFN packages, such as return loss and insertion loss, were studied under open-path and short-path configurations. The S parameters of the QFN packages from the numerical modeling are consistent with those from the analytical modeling at the frequencies up to 15 GHz.

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Lai Y-L, Ho CY. Electrical modeling of quad flat no-lead packages for high-frequency ic applications. 2004. Paper presented at IEEE TENCON 2004 - 2004 IEEE Region 10 Conference: Analog and Digital Techniques in Electrical Engineering, Chiang Mai, Thailand.