Electrical characterization of quad flat non-lead package for RFIC applications

Nansen Chen, K. Chiang, T. D. Her, Yeong Lin Lai, Chichyang Chen

Research output: Chapter in Book/Report/Conference proceedingConference contribution

6 Citations (Scopus)

Abstract

The QFN package is a near chip scale package plastic encapsulated package with a coppery leadframe substrate. The purpose of this paper was to establish the wideband equivalent circuit model of QFN packages for RF applications. Only short-path configuration was required for S-parameter measurement to achieve this purpose. The comparison of S11 and S21 between S-parameter measurement and optimized equivalent circuit model verified that those results were well matched and optimized. The parasitic parameters of equivalent circuit were reliable up to 6 GHz. The methods proposed in this paper may reduce the cost for samples preparation and chip simulation run time.

Original languageEnglish
Title of host publication2001 International Semiconductor Device Research Symposium, ISDRS 2001 - Proceedings
PublisherInstitute of Electrical and Electronics Engineers Inc.
Pages266-269
Number of pages4
ISBN (Electronic)0780374320, 9780780374324
DOIs
Publication statusPublished - 2001 Jan 1
EventInternational Semiconductor Device Research Symposium, ISDRS 2001 - Washington, United States
Duration: 2001 Dec 52001 Dec 7

Publication series

Name2001 International Semiconductor Device Research Symposium, ISDRS 2001 - Proceedings

Other

OtherInternational Semiconductor Device Research Symposium, ISDRS 2001
CountryUnited States
CityWashington
Period01-12-0501-12-07

All Science Journal Classification (ASJC) codes

  • Electrical and Electronic Engineering
  • Electronic, Optical and Magnetic Materials

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