Abstract
Ceramics are commonly used as substrates in electrically insulated integrated circuit, printed circuit board, and lightemitting diode industries because of their excellent dielectric and thermal properties. However, brittle materials (e.q., ceramic alumina, sapphire, glass, and silicon wafer) are difficult to fabricate using wheel tools. Laser material processes are preferred over traditional methods because they allow noncontact processing, avoid tool wear problems, and achieve high speed, high accuracy, and high resolution. Laser material processes also exhibit minimal residual thermal effects and residual stress. This study investigated the laser drilling of Al2O 3 ceramic material (with a thickness of 380 μm and hole diameters of 200, 300, and 500 μm, respectively) by using a laser milling method. The macro- and micro-hole milling performance depended on various parameters including the galvanometric scan speed and milling time. A 3D confocal laser scanning microscope and a field-emission scanning electron microscope were used to measure the surface morphology, taper angle, and melted residual height of the machined surface after laser milling. The edge quality and roundness of laser milling were also observed using image-processing edge-detection technology.
| Original language | English |
|---|---|
| Title of host publication | International Conference on Optics in Precision Engineering and Nanotechnology, icOPEN 2013 |
| Volume | 8769 |
| DOIs | |
| Publication status | Published - 2013 Aug 15 |
| Event | International Conference on Optics in Precision Engineering and Nanotechnology, icOPEN 2013 - Singapore, Singapore Duration: 2013 Apr 9 → 2013 Apr 11 |
Other
| Other | International Conference on Optics in Precision Engineering and Nanotechnology, icOPEN 2013 |
|---|---|
| Country | Singapore |
| City | Singapore |
| Period | 13-04-09 → 13-04-11 |
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All Science Journal Classification (ASJC) codes
- Electronic, Optical and Magnetic Materials
- Condensed Matter Physics
- Computer Science Applications
- Applied Mathematics
- Electrical and Electronic Engineering
Cite this
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Effects of macro- and micro-hole milling parameters on Al2O 3 ceramics using an ultraviolet laser system. / Hsiao, W. T.; Tseng, S. F.; Chung, C. K.; Huang, K. C.; Chen, M. F.
International Conference on Optics in Precision Engineering and Nanotechnology, icOPEN 2013. Vol. 8769 2013. 87693L.Research output: Chapter in Book/Report/Conference proceeding › Conference contribution
TY - GEN
T1 - Effects of macro- and micro-hole milling parameters on Al2O 3 ceramics using an ultraviolet laser system
AU - Hsiao, W. T.
AU - Tseng, S. F.
AU - Chung, C. K.
AU - Huang, K. C.
AU - Chen, M. F.
PY - 2013/8/15
Y1 - 2013/8/15
N2 - Ceramics are commonly used as substrates in electrically insulated integrated circuit, printed circuit board, and lightemitting diode industries because of their excellent dielectric and thermal properties. However, brittle materials (e.q., ceramic alumina, sapphire, glass, and silicon wafer) are difficult to fabricate using wheel tools. Laser material processes are preferred over traditional methods because they allow noncontact processing, avoid tool wear problems, and achieve high speed, high accuracy, and high resolution. Laser material processes also exhibit minimal residual thermal effects and residual stress. This study investigated the laser drilling of Al2O 3 ceramic material (with a thickness of 380 μm and hole diameters of 200, 300, and 500 μm, respectively) by using a laser milling method. The macro- and micro-hole milling performance depended on various parameters including the galvanometric scan speed and milling time. A 3D confocal laser scanning microscope and a field-emission scanning electron microscope were used to measure the surface morphology, taper angle, and melted residual height of the machined surface after laser milling. The edge quality and roundness of laser milling were also observed using image-processing edge-detection technology.
AB - Ceramics are commonly used as substrates in electrically insulated integrated circuit, printed circuit board, and lightemitting diode industries because of their excellent dielectric and thermal properties. However, brittle materials (e.q., ceramic alumina, sapphire, glass, and silicon wafer) are difficult to fabricate using wheel tools. Laser material processes are preferred over traditional methods because they allow noncontact processing, avoid tool wear problems, and achieve high speed, high accuracy, and high resolution. Laser material processes also exhibit minimal residual thermal effects and residual stress. This study investigated the laser drilling of Al2O 3 ceramic material (with a thickness of 380 μm and hole diameters of 200, 300, and 500 μm, respectively) by using a laser milling method. The macro- and micro-hole milling performance depended on various parameters including the galvanometric scan speed and milling time. A 3D confocal laser scanning microscope and a field-emission scanning electron microscope were used to measure the surface morphology, taper angle, and melted residual height of the machined surface after laser milling. The edge quality and roundness of laser milling were also observed using image-processing edge-detection technology.
UR - http://www.scopus.com/inward/record.url?scp=84881364690&partnerID=8YFLogxK
UR - http://www.scopus.com/inward/citedby.url?scp=84881364690&partnerID=8YFLogxK
U2 - 10.1117/12.2018981
DO - 10.1117/12.2018981
M3 - Conference contribution
SN - 9780819495679
VL - 8769
BT - International Conference on Optics in Precision Engineering and Nanotechnology, icOPEN 2013
ER -