Abstract
The objective of this study is to investigate the mechanical behavior of copper thin film with different thicknesses subjected to varying strain rates. A micro-force tensile testing machine (MTS Tytron 250) was used to test the polyimide samples coated with different thicknesses of copper (500 nm, 750 nm, 1000 nm, and 1500 nm). The experiments were conducted by applying test vehicles to different strain rates (1.6×10-4s-1, 1.6×10-3s-1, and 1.6×10-2s-1). The experimental results showed the strain rate and the thickness have obvious influence upon the mechanical properties of Cu thin film. The yield stress increases as increasing the strain rate or decreasing the thickness of Cu film. For considering the strain rate sensitivity m, the strain rate sensitivity m is found that it increases as decreasing the thickness to imply that Cu film has high strain-rate response at low thickness.
| Original language | English |
|---|---|
| Title of host publication | Innovation for Applied Science and Technology |
| Pages | 94-97 |
| Number of pages | 4 |
| DOIs | |
| Publication status | Published - 2013 Feb 20 |
| Event | 2nd International Conference on Engineering and Technology Innovation 2012, ICETI 2012 - Kaohsiung, Taiwan Duration: 2012 Nov 2 → 2012 Nov 6 |
Publication series
| Name | Applied Mechanics and Materials |
|---|---|
| Volume | 284-287 |
| ISSN (Print) | 1660-9336 |
| ISSN (Electronic) | 1662-7482 |
Other
| Other | 2nd International Conference on Engineering and Technology Innovation 2012, ICETI 2012 |
|---|---|
| Country | Taiwan |
| City | Kaohsiung |
| Period | 12-11-02 → 12-11-06 |
Fingerprint
All Science Journal Classification (ASJC) codes
- Engineering(all)
Cite this
}
Effect of strain rates on the mechanical behavior of Cu thin films of various thicknesses. / Chung, Kuan-Jung; Lin, C. F.; Chiang, W. C.
Innovation for Applied Science and Technology. 2013. p. 94-97 (Applied Mechanics and Materials; Vol. 284-287).Research output: Chapter in Book/Report/Conference proceeding › Conference contribution
TY - GEN
T1 - Effect of strain rates on the mechanical behavior of Cu thin films of various thicknesses
AU - Chung, Kuan-Jung
AU - Lin, C. F.
AU - Chiang, W. C.
PY - 2013/2/20
Y1 - 2013/2/20
N2 - The objective of this study is to investigate the mechanical behavior of copper thin film with different thicknesses subjected to varying strain rates. A micro-force tensile testing machine (MTS Tytron 250) was used to test the polyimide samples coated with different thicknesses of copper (500 nm, 750 nm, 1000 nm, and 1500 nm). The experiments were conducted by applying test vehicles to different strain rates (1.6×10-4s-1, 1.6×10-3s-1, and 1.6×10-2s-1). The experimental results showed the strain rate and the thickness have obvious influence upon the mechanical properties of Cu thin film. The yield stress increases as increasing the strain rate or decreasing the thickness of Cu film. For considering the strain rate sensitivity m, the strain rate sensitivity m is found that it increases as decreasing the thickness to imply that Cu film has high strain-rate response at low thickness.
AB - The objective of this study is to investigate the mechanical behavior of copper thin film with different thicknesses subjected to varying strain rates. A micro-force tensile testing machine (MTS Tytron 250) was used to test the polyimide samples coated with different thicknesses of copper (500 nm, 750 nm, 1000 nm, and 1500 nm). The experiments were conducted by applying test vehicles to different strain rates (1.6×10-4s-1, 1.6×10-3s-1, and 1.6×10-2s-1). The experimental results showed the strain rate and the thickness have obvious influence upon the mechanical properties of Cu thin film. The yield stress increases as increasing the strain rate or decreasing the thickness of Cu film. For considering the strain rate sensitivity m, the strain rate sensitivity m is found that it increases as decreasing the thickness to imply that Cu film has high strain-rate response at low thickness.
UR - http://www.scopus.com/inward/record.url?scp=84873911687&partnerID=8YFLogxK
UR - http://www.scopus.com/inward/citedby.url?scp=84873911687&partnerID=8YFLogxK
U2 - 10.4028/www.scientific.net/AMM.284-287.94
DO - 10.4028/www.scientific.net/AMM.284-287.94
M3 - Conference contribution
AN - SCOPUS:84873911687
SN - 9783037856123
T3 - Applied Mechanics and Materials
SP - 94
EP - 97
BT - Innovation for Applied Science and Technology
ER -