Effect of strain rates on the mechanical behavior of Cu thin films of various thicknesses

Kuan-Jung Chung, C. F. Lin, W. C. Chiang

Research output: Chapter in Book/Report/Conference proceedingConference contribution

1 Citation (Scopus)

Abstract

The objective of this study is to investigate the mechanical behavior of copper thin film with different thicknesses subjected to varying strain rates. A micro-force tensile testing machine (MTS Tytron 250) was used to test the polyimide samples coated with different thicknesses of copper (500 nm, 750 nm, 1000 nm, and 1500 nm). The experiments were conducted by applying test vehicles to different strain rates (1.6×10-4s-1, 1.6×10-3s-1, and 1.6×10-2s-1). The experimental results showed the strain rate and the thickness have obvious influence upon the mechanical properties of Cu thin film. The yield stress increases as increasing the strain rate or decreasing the thickness of Cu film. For considering the strain rate sensitivity m, the strain rate sensitivity m is found that it increases as decreasing the thickness to imply that Cu film has high strain-rate response at low thickness.

Original languageEnglish
Title of host publicationInnovation for Applied Science and Technology
Pages94-97
Number of pages4
DOIs
Publication statusPublished - 2013 Feb 20
Event2nd International Conference on Engineering and Technology Innovation 2012, ICETI 2012 - Kaohsiung, Taiwan
Duration: 2012 Nov 22012 Nov 6

Publication series

NameApplied Mechanics and Materials
Volume284-287
ISSN (Print)1660-9336
ISSN (Electronic)1662-7482

Other

Other2nd International Conference on Engineering and Technology Innovation 2012, ICETI 2012
CountryTaiwan
CityKaohsiung
Period12-11-0212-11-06

All Science Journal Classification (ASJC) codes

  • Engineering(all)

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    Chung, K-J., Lin, C. F., & Chiang, W. C. (2013). Effect of strain rates on the mechanical behavior of Cu thin films of various thicknesses. In Innovation for Applied Science and Technology (pp. 94-97). (Applied Mechanics and Materials; Vol. 284-287). https://doi.org/10.4028/www.scientific.net/AMM.284-287.94