Dynamic analysis of micro devices with squeeze-film damping effect using hybrid numerical scheme

Research output: Chapter in Book/Report/Conference proceedingConference contribution

Abstract

Using traditional methods such as perturbation theory or Galerkin approach method to analyze the dynamic response of electrostatic devices is not easy due to the complexity of the interactions between the electrostatic coupling effect, the fringing field effect, the residual stress, the nonlinear electrostatic force and squeeze-film damping effect. Accordingly, the present study proposes a new approach for analyzing the dynamic response of such devices using a hybrid numerical scheme comprising the differential transformation method and the finite difference method by pure DC or combined DC / AC loading. The validity of the proposed scheme is confirmed by comparing the results obtained for the pull-in voltage of the micro-beam with those presented in the literature derived using a variety of schemes. Overall, the results show that the hybrid numerical scheme provides a suitable means of analyzing the nonlinear dynamic behavior of a wide variety of common electrostatically-actuated microstructures.

Original languageEnglish
Title of host publicationModern Materials and Technologies of Industrial Production
Pages474-477
Number of pages4
DOIs
Publication statusPublished - 2013 Nov 4
Event2nd International Conference on Mechanical Properties of Materials and Information Technology, ICMPMIT 2013 - , Hong Kong
Duration: 2013 Aug 172013 Aug 19

Publication series

NameAdvanced Materials Research
Volume811
ISSN (Print)1022-6680

Other

Other2nd International Conference on Mechanical Properties of Materials and Information Technology, ICMPMIT 2013
CountryHong Kong
Period13-08-1713-08-19

Fingerprint

Dynamic analysis
Dynamic response
Electrostatic devices
Damping
Electrostatic force
Finite difference method
Electrostatics
Residual stresses
Microstructure
Electric potential

All Science Journal Classification (ASJC) codes

  • Engineering(all)

Cite this

Liu, C-C. (2013). Dynamic analysis of micro devices with squeeze-film damping effect using hybrid numerical scheme. In Modern Materials and Technologies of Industrial Production (pp. 474-477). (Advanced Materials Research; Vol. 811). https://doi.org/10.4028/www.scientific.net/AMR.811.474
Liu, Chin-Chia. / Dynamic analysis of micro devices with squeeze-film damping effect using hybrid numerical scheme. Modern Materials and Technologies of Industrial Production. 2013. pp. 474-477 (Advanced Materials Research).
@inproceedings{3b3e5909f46d4b66bc183f73336e7343,
title = "Dynamic analysis of micro devices with squeeze-film damping effect using hybrid numerical scheme",
abstract = "Using traditional methods such as perturbation theory or Galerkin approach method to analyze the dynamic response of electrostatic devices is not easy due to the complexity of the interactions between the electrostatic coupling effect, the fringing field effect, the residual stress, the nonlinear electrostatic force and squeeze-film damping effect. Accordingly, the present study proposes a new approach for analyzing the dynamic response of such devices using a hybrid numerical scheme comprising the differential transformation method and the finite difference method by pure DC or combined DC / AC loading. The validity of the proposed scheme is confirmed by comparing the results obtained for the pull-in voltage of the micro-beam with those presented in the literature derived using a variety of schemes. Overall, the results show that the hybrid numerical scheme provides a suitable means of analyzing the nonlinear dynamic behavior of a wide variety of common electrostatically-actuated microstructures.",
author = "Chin-Chia Liu",
year = "2013",
month = "11",
day = "4",
doi = "10.4028/www.scientific.net/AMR.811.474",
language = "English",
isbn = "9783037858608",
series = "Advanced Materials Research",
pages = "474--477",
booktitle = "Modern Materials and Technologies of Industrial Production",

}

Liu, C-C 2013, Dynamic analysis of micro devices with squeeze-film damping effect using hybrid numerical scheme. in Modern Materials and Technologies of Industrial Production. Advanced Materials Research, vol. 811, pp. 474-477, 2nd International Conference on Mechanical Properties of Materials and Information Technology, ICMPMIT 2013, Hong Kong, 13-08-17. https://doi.org/10.4028/www.scientific.net/AMR.811.474

Dynamic analysis of micro devices with squeeze-film damping effect using hybrid numerical scheme. / Liu, Chin-Chia.

Modern Materials and Technologies of Industrial Production. 2013. p. 474-477 (Advanced Materials Research; Vol. 811).

Research output: Chapter in Book/Report/Conference proceedingConference contribution

TY - GEN

T1 - Dynamic analysis of micro devices with squeeze-film damping effect using hybrid numerical scheme

AU - Liu, Chin-Chia

PY - 2013/11/4

Y1 - 2013/11/4

N2 - Using traditional methods such as perturbation theory or Galerkin approach method to analyze the dynamic response of electrostatic devices is not easy due to the complexity of the interactions between the electrostatic coupling effect, the fringing field effect, the residual stress, the nonlinear electrostatic force and squeeze-film damping effect. Accordingly, the present study proposes a new approach for analyzing the dynamic response of such devices using a hybrid numerical scheme comprising the differential transformation method and the finite difference method by pure DC or combined DC / AC loading. The validity of the proposed scheme is confirmed by comparing the results obtained for the pull-in voltage of the micro-beam with those presented in the literature derived using a variety of schemes. Overall, the results show that the hybrid numerical scheme provides a suitable means of analyzing the nonlinear dynamic behavior of a wide variety of common electrostatically-actuated microstructures.

AB - Using traditional methods such as perturbation theory or Galerkin approach method to analyze the dynamic response of electrostatic devices is not easy due to the complexity of the interactions between the electrostatic coupling effect, the fringing field effect, the residual stress, the nonlinear electrostatic force and squeeze-film damping effect. Accordingly, the present study proposes a new approach for analyzing the dynamic response of such devices using a hybrid numerical scheme comprising the differential transformation method and the finite difference method by pure DC or combined DC / AC loading. The validity of the proposed scheme is confirmed by comparing the results obtained for the pull-in voltage of the micro-beam with those presented in the literature derived using a variety of schemes. Overall, the results show that the hybrid numerical scheme provides a suitable means of analyzing the nonlinear dynamic behavior of a wide variety of common electrostatically-actuated microstructures.

UR - http://www.scopus.com/inward/record.url?scp=84886700300&partnerID=8YFLogxK

UR - http://www.scopus.com/inward/citedby.url?scp=84886700300&partnerID=8YFLogxK

U2 - 10.4028/www.scientific.net/AMR.811.474

DO - 10.4028/www.scientific.net/AMR.811.474

M3 - Conference contribution

AN - SCOPUS:84886700300

SN - 9783037858608

T3 - Advanced Materials Research

SP - 474

EP - 477

BT - Modern Materials and Technologies of Industrial Production

ER -

Liu C-C. Dynamic analysis of micro devices with squeeze-film damping effect using hybrid numerical scheme. In Modern Materials and Technologies of Industrial Production. 2013. p. 474-477. (Advanced Materials Research). https://doi.org/10.4028/www.scientific.net/AMR.811.474