Dynamic analysis of micro devices with squeeze-film damping effect using hybrid numerical scheme

Research output: Chapter in Book/Report/Conference proceedingConference contribution

Abstract

Using traditional methods such as perturbation theory or Galerkin approach method to analyze the dynamic response of electrostatic devices is not easy due to the complexity of the interactions between the electrostatic coupling effect, the fringing field effect, the residual stress, the nonlinear electrostatic force and squeeze-film damping effect. Accordingly, the present study proposes a new approach for analyzing the dynamic response of such devices using a hybrid numerical scheme comprising the differential transformation method and the finite difference method by pure DC or combined DC / AC loading. The validity of the proposed scheme is confirmed by comparing the results obtained for the pull-in voltage of the micro-beam with those presented in the literature derived using a variety of schemes. Overall, the results show that the hybrid numerical scheme provides a suitable means of analyzing the nonlinear dynamic behavior of a wide variety of common electrostatically-actuated microstructures.

Original languageEnglish
Title of host publicationModern Materials and Technologies of Industrial Production
Pages474-477
Number of pages4
DOIs
Publication statusPublished - 2013 Nov 4
Event2nd International Conference on Mechanical Properties of Materials and Information Technology, ICMPMIT 2013 - , Hong Kong
Duration: 2013 Aug 172013 Aug 19

Publication series

NameAdvanced Materials Research
Volume811
ISSN (Print)1022-6680

Other

Other2nd International Conference on Mechanical Properties of Materials and Information Technology, ICMPMIT 2013
CountryHong Kong
Period13-08-1713-08-19

All Science Journal Classification (ASJC) codes

  • Engineering(all)

Fingerprint Dive into the research topics of 'Dynamic analysis of micro devices with squeeze-film damping effect using hybrid numerical scheme'. Together they form a unique fingerprint.

  • Cite this

    Liu, C-C. (2013). Dynamic analysis of micro devices with squeeze-film damping effect using hybrid numerical scheme. In Modern Materials and Technologies of Industrial Production (pp. 474-477). (Advanced Materials Research; Vol. 811). https://doi.org/10.4028/www.scientific.net/AMR.811.474