Dip-drawing process characterization of making high-aspect-ratio polymeric microneedles

Chieh Cheng Yang, Kerwin Wang

Research output: Chapter in Book/Report/Conference proceedingConference contribution

Abstract

This paper presents a parametric study of a dip-drawing process for making high aspect-ratio polymeric microneedles. The process involves dip-pad spin coating, mold based dip-drawing, UV-curing, necking-break, and final curing. To gain more insight into the process, we characterize the dip-drawing speed and curing time to determine the critical parameters for the microneedle geometry control. The experiment results show that the diameters of the microneedle tips are gradually decreased to 1.69 μm with increasing of drawing speed.

Original languageEnglish
Title of host publicationProceedings of the 2018 IEEE International Conference on Advanced Manufacturing, ICAM 2018
EditorsTeen-Hang Meen
PublisherInstitute of Electrical and Electronics Engineers Inc.
Pages105-108
Number of pages4
ISBN (Electronic)9781538656099
DOIs
Publication statusPublished - 2019 Jan 16
Event2018 IEEE International Conference on Advanced Manufacturing, ICAM 2018 - Yunlin, Taiwan
Duration: 2018 Nov 162018 Nov 18

Publication series

NameProceedings of the 2018 IEEE International Conference on Advanced Manufacturing, ICAM 2018

Conference

Conference2018 IEEE International Conference on Advanced Manufacturing, ICAM 2018
CountryTaiwan
CityYunlin
Period18-11-1618-11-18

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All Science Journal Classification (ASJC) codes

  • Biomedical Engineering
  • Mechanics of Materials
  • Safety, Risk, Reliability and Quality
  • Management, Monitoring, Policy and Law
  • Education
  • Fluid Flow and Transfer Processes
  • Industrial and Manufacturing Engineering

Cite this

Yang, C. C., & Wang, K. (2019). Dip-drawing process characterization of making high-aspect-ratio polymeric microneedles. In T-H. Meen (Ed.), Proceedings of the 2018 IEEE International Conference on Advanced Manufacturing, ICAM 2018 (pp. 105-108). [8614952] (Proceedings of the 2018 IEEE International Conference on Advanced Manufacturing, ICAM 2018). Institute of Electrical and Electronics Engineers Inc.. https://doi.org/10.1109/AMCON.2018.8614952