Die-bonding study for double-channel ridge waveguide AlGaInP laser diodes

Zhen Wu Yang, Man Fang Huang, Jung Tsung Hsu, Chau Chong Kuo, Chien Chia Chiu, Chiu Ling Chen, Meng Chyi Wu

Research output: Contribution to journalConference article

Abstract

The double-channel ridge waveguide (DCRW) laser diode is investigated to determine its die-bonding conditions and thermal dissipation capability. Two different bonding facilities are employed when doing die-bonding to verify if pre-vacuumed environment is helpful for good die-bonding. Scanning electron microscopy is used to determine the condition of the interface between laser diode and heatsink. From the measured group behavior of thermal resistance, it is noted that poor die bonding lead to rapid increase in thermal resistance and ineffective heat dissipation occur when heat is transported to heat sinks.

Original languageEnglish
Pages (from-to)98-105
Number of pages8
JournalProceedings of SPIE - The International Society for Optical Engineering
Volume3626
Publication statusPublished - 1999 Jan 1
EventProceedings of the 1999 Testing, Packaging, Reliability, and Applications of Semiconductor Lasers IV - San Jose, CA, USA
Duration: 1999 Jan 281999 Jan 28

Fingerprint

Ridge waveguides
waveguide lasers
Laser Diode
Ridge
Waveguide
Semiconductor lasers
ridges
Die
semiconductor lasers
Thermal Resistance
Heat
Dissipation
thermal resistance
Heat resistance
group dynamics
Scanning Electron Microscopy
heat sinks
Heat sinks
Heat losses
Verify

All Science Journal Classification (ASJC) codes

  • Electronic, Optical and Magnetic Materials
  • Condensed Matter Physics
  • Computer Science Applications
  • Applied Mathematics
  • Electrical and Electronic Engineering

Cite this

Yang, Zhen Wu ; Huang, Man Fang ; Hsu, Jung Tsung ; Kuo, Chau Chong ; Chiu, Chien Chia ; Chen, Chiu Ling ; Wu, Meng Chyi. / Die-bonding study for double-channel ridge waveguide AlGaInP laser diodes. In: Proceedings of SPIE - The International Society for Optical Engineering. 1999 ; Vol. 3626. pp. 98-105.
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abstract = "The double-channel ridge waveguide (DCRW) laser diode is investigated to determine its die-bonding conditions and thermal dissipation capability. Two different bonding facilities are employed when doing die-bonding to verify if pre-vacuumed environment is helpful for good die-bonding. Scanning electron microscopy is used to determine the condition of the interface between laser diode and heatsink. From the measured group behavior of thermal resistance, it is noted that poor die bonding lead to rapid increase in thermal resistance and ineffective heat dissipation occur when heat is transported to heat sinks.",
author = "Yang, {Zhen Wu} and Huang, {Man Fang} and Hsu, {Jung Tsung} and Kuo, {Chau Chong} and Chiu, {Chien Chia} and Chen, {Chiu Ling} and Wu, {Meng Chyi}",
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Die-bonding study for double-channel ridge waveguide AlGaInP laser diodes. / Yang, Zhen Wu; Huang, Man Fang; Hsu, Jung Tsung; Kuo, Chau Chong; Chiu, Chien Chia; Chen, Chiu Ling; Wu, Meng Chyi.

In: Proceedings of SPIE - The International Society for Optical Engineering, Vol. 3626, 01.01.1999, p. 98-105.

Research output: Contribution to journalConference article

TY - JOUR

T1 - Die-bonding study for double-channel ridge waveguide AlGaInP laser diodes

AU - Yang, Zhen Wu

AU - Huang, Man Fang

AU - Hsu, Jung Tsung

AU - Kuo, Chau Chong

AU - Chiu, Chien Chia

AU - Chen, Chiu Ling

AU - Wu, Meng Chyi

PY - 1999/1/1

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N2 - The double-channel ridge waveguide (DCRW) laser diode is investigated to determine its die-bonding conditions and thermal dissipation capability. Two different bonding facilities are employed when doing die-bonding to verify if pre-vacuumed environment is helpful for good die-bonding. Scanning electron microscopy is used to determine the condition of the interface between laser diode and heatsink. From the measured group behavior of thermal resistance, it is noted that poor die bonding lead to rapid increase in thermal resistance and ineffective heat dissipation occur when heat is transported to heat sinks.

AB - The double-channel ridge waveguide (DCRW) laser diode is investigated to determine its die-bonding conditions and thermal dissipation capability. Two different bonding facilities are employed when doing die-bonding to verify if pre-vacuumed environment is helpful for good die-bonding. Scanning electron microscopy is used to determine the condition of the interface between laser diode and heatsink. From the measured group behavior of thermal resistance, it is noted that poor die bonding lead to rapid increase in thermal resistance and ineffective heat dissipation occur when heat is transported to heat sinks.

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