Deterministic three-dimensional micro-assembly in parallel

Huo Chuan Lin; Chia Chung Wang; Kerwin Wang

doi:10.1109/NEMS.2011.6017555

Deterministic three-dimensional micro-assembly in parallel

Huo Chuan Lin, Chia Chung Wang, Kerwin Wang

Department of Mechatronic Engineering

Research output: Chapter in Book/Report/Conference proceeding › Conference contribution

1 Citation (Scopus)

Abstract

This paper introduces a novel deterministic three-dimensional micro-assembly method to tackle the difficulty of micro-part assembling at unstable equilibrium region. We design, characterize and manufacture an parallel assembly system, which is capable of connecting micro-parts from almost arbitrary direction into desired structures in batch processes. This paper also introduces a non-contact method to measurement the surface adhesion forces among parts, donor and receiver substrates. Five successive 3D micro-assembly processes have be tested with yield ratio investigation to demonstrate this technology. Table 1. A comparison of this study to some published three-dimensional assembly technologies

Original language	English
Title of host publication	NEMS 2011 - 6th IEEE International Conference on Nano/Micro Engineered and Molecular Systems
Pages	1128-1131
Number of pages	4
DOIs	https://doi.org/10.1109/NEMS.2011.6017555
Publication status	Published - 2011 Oct 4
Event	6th IEEE International Conference on Nano/Micro Engineered and Molecular Systems, NEMS 2011 - Kaohsiung, Taiwan Duration: 2011 Feb 20 → 2011 Feb 23

Other

Other	6th IEEE International Conference on Nano/Micro Engineered and Molecular Systems, NEMS 2011
Country	Taiwan
City	Kaohsiung
Period	11-02-20 → 11-02-23

All Science Journal Classification (ASJC) codes

Atomic and Molecular Physics, and Optics

Access to Document

10.1109/NEMS.2011.6017555

Fingerprint Dive into the research topics of 'Deterministic three-dimensional micro-assembly in parallel'. Together they form a unique fingerprint.

Cite this

Lin, H. C., Wang, C. C., & Wang, K. (2011). Deterministic three-dimensional micro-assembly in parallel. In NEMS 2011 - 6th IEEE International Conference on Nano/Micro Engineered and Molecular Systems (pp. 1128-1131). [6017555] https://doi.org/10.1109/NEMS.2011.6017555

@inproceedings{d80de5523bf84d7e9261826dbdf4ae0b,

title = "Deterministic three-dimensional micro-assembly in parallel",

abstract = "This paper introduces a novel deterministic three-dimensional micro-assembly method to tackle the difficulty of micro-part assembling at unstable equilibrium region. We design, characterize and manufacture an parallel assembly system, which is capable of connecting micro-parts from almost arbitrary direction into desired structures in batch processes. This paper also introduces a non-contact method to measurement the surface adhesion forces among parts, donor and receiver substrates. Five successive 3D micro-assembly processes have be tested with yield ratio investigation to demonstrate this technology. Table 1. A comparison of this study to some published three-dimensional assembly technologies",

author = "Lin, {Huo Chuan} and Wang, {Chia Chung} and Kerwin Wang",

year = "2011",

month = oct,

day = "4",

doi = "10.1109/NEMS.2011.6017555",

language = "English",

isbn = "9781612847757",

pages = "1128--1131",

booktitle = "NEMS 2011 - 6th IEEE International Conference on Nano/Micro Engineered and Molecular Systems",

note = "6th IEEE International Conference on Nano/Micro Engineered and Molecular Systems, NEMS 2011 ; Conference date: 20-02-2011 Through 23-02-2011",

}

Lin, HC, Wang, CC & Wang, K 2011, Deterministic three-dimensional micro-assembly in parallel. in NEMS 2011 - 6th IEEE International Conference on Nano/Micro Engineered and Molecular Systems., 6017555, pp. 1128-1131, 6th IEEE International Conference on Nano/Micro Engineered and Molecular Systems, NEMS 2011, Kaohsiung, Taiwan, 11-02-20. https://doi.org/10.1109/NEMS.2011.6017555

TY - GEN

T1 - Deterministic three-dimensional micro-assembly in parallel

AU - Lin, Huo Chuan

AU - Wang, Chia Chung

AU - Wang, Kerwin

PY - 2011/10/4

Y1 - 2011/10/4

N2 - This paper introduces a novel deterministic three-dimensional micro-assembly method to tackle the difficulty of micro-part assembling at unstable equilibrium region. We design, characterize and manufacture an parallel assembly system, which is capable of connecting micro-parts from almost arbitrary direction into desired structures in batch processes. This paper also introduces a non-contact method to measurement the surface adhesion forces among parts, donor and receiver substrates. Five successive 3D micro-assembly processes have be tested with yield ratio investigation to demonstrate this technology. Table 1. A comparison of this study to some published three-dimensional assembly technologies

AB - This paper introduces a novel deterministic three-dimensional micro-assembly method to tackle the difficulty of micro-part assembling at unstable equilibrium region. We design, characterize and manufacture an parallel assembly system, which is capable of connecting micro-parts from almost arbitrary direction into desired structures in batch processes. This paper also introduces a non-contact method to measurement the surface adhesion forces among parts, donor and receiver substrates. Five successive 3D micro-assembly processes have be tested with yield ratio investigation to demonstrate this technology. Table 1. A comparison of this study to some published three-dimensional assembly technologies

UR - http://www.scopus.com/inward/record.url?scp=80053304971&partnerID=8YFLogxK

UR - http://www.scopus.com/inward/citedby.url?scp=80053304971&partnerID=8YFLogxK

U2 - 10.1109/NEMS.2011.6017555

DO - 10.1109/NEMS.2011.6017555

M3 - Conference contribution

AN - SCOPUS:80053304971

SN - 9781612847757

SP - 1128

EP - 1131

BT - NEMS 2011 - 6th IEEE International Conference on Nano/Micro Engineered and Molecular Systems

T2 - 6th IEEE International Conference on Nano/Micro Engineered and Molecular Systems, NEMS 2011

Y2 - 20 February 2011 through 23 February 2011

ER -