Deterministic three-dimensional micro-assembly in parallel

Huo Chuan Lin, Chia Chung Wang, Kerwin Wang

Research output: Chapter in Book/Report/Conference proceedingConference contribution

1 Citation (Scopus)

Abstract

This paper introduces a novel deterministic three-dimensional micro-assembly method to tackle the difficulty of micro-part assembling at unstable equilibrium region. We design, characterize and manufacture an parallel assembly system, which is capable of connecting micro-parts from almost arbitrary direction into desired structures in batch processes. This paper also introduces a non-contact method to measurement the surface adhesion forces among parts, donor and receiver substrates. Five successive 3D micro-assembly processes have be tested with yield ratio investigation to demonstrate this technology. Table 1. A comparison of this study to some published three-dimensional assembly technologies

Original languageEnglish
Title of host publicationNEMS 2011 - 6th IEEE International Conference on Nano/Micro Engineered and Molecular Systems
Pages1128-1131
Number of pages4
DOIs
Publication statusPublished - 2011 Oct 4
Event6th IEEE International Conference on Nano/Micro Engineered and Molecular Systems, NEMS 2011 - Kaohsiung, Taiwan
Duration: 2011 Feb 202011 Feb 23

Other

Other6th IEEE International Conference on Nano/Micro Engineered and Molecular Systems, NEMS 2011
CountryTaiwan
CityKaohsiung
Period11-02-2011-02-23

All Science Journal Classification (ASJC) codes

  • Atomic and Molecular Physics, and Optics

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  • Cite this

    Lin, H. C., Wang, C. C., & Wang, K. (2011). Deterministic three-dimensional micro-assembly in parallel. In NEMS 2011 - 6th IEEE International Conference on Nano/Micro Engineered and Molecular Systems (pp. 1128-1131). [6017555] https://doi.org/10.1109/NEMS.2011.6017555