Abstract
An analysis method used to choose a suitable structural orientation layout for a microcompliant mechanism, which includes multi-curved-beams, is introduced, particularly, for fabricating microelectromechanical-systems (MEMS) thin-curved-beam microstructures on (100) and (111) single-crystal silicon (SCS) wafers. The achievement of a large deflection of a fabricated SCS device verifies the usability of this design rule. The orientation layouts of the device for a large deflection are restricted to a specific region. Based on the analysis method, it is better to follow a 21° safe region between the (100) and (110) orientations in order to decrease the possibility of crystal slip failure. Using this design consideration, one can design more robust MEMS compliant mechanisms from SCS, exploiting its ideal elasticity.
| Original language | English |
|---|---|
| Article number | 5462829 |
| Pages (from-to) | 706-714 |
| Number of pages | 9 |
| Journal | Journal of Microelectromechanical Systems |
| Volume | 19 |
| Issue number | 3 |
| DOIs | |
| Publication status | Published - 2010 Jun 1 |
Fingerprint
All Science Journal Classification (ASJC) codes
- Mechanical Engineering
- Electrical and Electronic Engineering
Cite this
}
Design rule and orientation layout for MEMS curved beams on silicon. / Chen, Tzung-Ming; Liu, Zhenyu; Korvink, Jan G.; Wallrabe, Ulrike.
In: Journal of Microelectromechanical Systems, Vol. 19, No. 3, 5462829, 01.06.2010, p. 706-714.Research output: Contribution to journal › Article
TY - JOUR
T1 - Design rule and orientation layout for MEMS curved beams on silicon
AU - Chen, Tzung-Ming
AU - Liu, Zhenyu
AU - Korvink, Jan G.
AU - Wallrabe, Ulrike
PY - 2010/6/1
Y1 - 2010/6/1
N2 - An analysis method used to choose a suitable structural orientation layout for a microcompliant mechanism, which includes multi-curved-beams, is introduced, particularly, for fabricating microelectromechanical-systems (MEMS) thin-curved-beam microstructures on (100) and (111) single-crystal silicon (SCS) wafers. The achievement of a large deflection of a fabricated SCS device verifies the usability of this design rule. The orientation layouts of the device for a large deflection are restricted to a specific region. Based on the analysis method, it is better to follow a 21° safe region between the (100) and (110) orientations in order to decrease the possibility of crystal slip failure. Using this design consideration, one can design more robust MEMS compliant mechanisms from SCS, exploiting its ideal elasticity.
AB - An analysis method used to choose a suitable structural orientation layout for a microcompliant mechanism, which includes multi-curved-beams, is introduced, particularly, for fabricating microelectromechanical-systems (MEMS) thin-curved-beam microstructures on (100) and (111) single-crystal silicon (SCS) wafers. The achievement of a large deflection of a fabricated SCS device verifies the usability of this design rule. The orientation layouts of the device for a large deflection are restricted to a specific region. Based on the analysis method, it is better to follow a 21° safe region between the (100) and (110) orientations in order to decrease the possibility of crystal slip failure. Using this design consideration, one can design more robust MEMS compliant mechanisms from SCS, exploiting its ideal elasticity.
UR - http://www.scopus.com/inward/record.url?scp=77953123809&partnerID=8YFLogxK
UR - http://www.scopus.com/inward/citedby.url?scp=77953123809&partnerID=8YFLogxK
U2 - 10.1109/JMEMS.2010.2048416
DO - 10.1109/JMEMS.2010.2048416
M3 - Article
AN - SCOPUS:77953123809
VL - 19
SP - 706
EP - 714
JO - Journal of Microelectromechanical Systems
JF - Journal of Microelectromechanical Systems
SN - 1057-7157
IS - 3
M1 - 5462829
ER -