Design optimization of laser-induced microbridges for low resistance interline connections in ICs

Kuan Jung Chung, Martin Peckerar, Joseph B. Bernstein

Research output: Contribution to journalArticle

1 Citation (Scopus)

Abstract

In this work, we present a two-dimensional finite element (FE) model for laser beam-induced low-resistance lateral interconnects. We refer to these links as "Microbridges". The model allowed designers using different geometric parameters (interline spacing and the width-to-height ratio of metal lines) and metal-dielectric combination (Al/SiO2) to optimize the design structure. The results of the FE analysis are consistent with the experimental results. An optimal design diagram for the Al/SiO2 system is created to provide the best dimensional combinations exhibiting the widest process window and the best production yield.

Original languageEnglish
Pages (from-to)70-75
Number of pages6
JournalMicroelectronic Engineering
Volume103
DOIs
Publication statusPublished - 2013 Jan 1

Fingerprint

design optimization
low resistance
Metals
Lasers
metals
lasers
Laser beams
diagrams
spacing
laser beams
Finite element method
Design optimization
Optimal design

All Science Journal Classification (ASJC) codes

  • Electronic, Optical and Magnetic Materials
  • Atomic and Molecular Physics, and Optics
  • Condensed Matter Physics
  • Surfaces, Coatings and Films
  • Electrical and Electronic Engineering

Cite this

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Design optimization of laser-induced microbridges for low resistance interline connections in ICs. / Chung, Kuan Jung; Peckerar, Martin; Bernstein, Joseph B.

In: Microelectronic Engineering, Vol. 103, 01.01.2013, p. 70-75.

Research output: Contribution to journalArticle

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