Characteristics of System in a Package of Synchronous Dynamic Random Access Memory for High-Speed Data Storage Applications

Yeong Lin Lai, Wen Jung Chiang

Research output: Contribution to journalArticle

2 Citations (Scopus)

Abstract

This paper proposes a system in a package (SiP) integrating a system on a chip (SoC) and a double-data-rate-three synchronous dynamic random access memory (DDR3 SDRAM) for advanced data-storage-based systems. The characteristics of high frequency, signal integrity (SI), and power integrity (PI) were investigated for the SoC/DDR3-SDRAM SiP. The SiP exhibited low insertion loss, wide eye-diagram aperture, and low power impedance. The effect of de-coupling capacitors on the SiP was also examined. The SoC/DDR3-SDRAM SiP achieved excellent performance for high-speed data storage applications.

Original languageEnglish
Article number6851288
JournalIEEE Transactions on Magnetics
Volume50
Issue number7
DOIs
Publication statusPublished - 2014 Jul 1

Fingerprint

Data storage equipment
Insertion losses
Capacitors

All Science Journal Classification (ASJC) codes

  • Electronic, Optical and Magnetic Materials
  • Electrical and Electronic Engineering

Cite this

@article{7927715c6dfb41cb9b53d1d9a4934393,
title = "Characteristics of System in a Package of Synchronous Dynamic Random Access Memory for High-Speed Data Storage Applications",
abstract = "This paper proposes a system in a package (SiP) integrating a system on a chip (SoC) and a double-data-rate-three synchronous dynamic random access memory (DDR3 SDRAM) for advanced data-storage-based systems. The characteristics of high frequency, signal integrity (SI), and power integrity (PI) were investigated for the SoC/DDR3-SDRAM SiP. The SiP exhibited low insertion loss, wide eye-diagram aperture, and low power impedance. The effect of de-coupling capacitors on the SiP was also examined. The SoC/DDR3-SDRAM SiP achieved excellent performance for high-speed data storage applications.",
author = "Lai, {Yeong Lin} and Chiang, {Wen Jung}",
year = "2014",
month = "7",
day = "1",
doi = "10.1109/TMAG.2014.2306797",
language = "English",
volume = "50",
journal = "IEEE Transactions on Magnetics",
issn = "0018-9464",
publisher = "Institute of Electrical and Electronics Engineers Inc.",
number = "7",

}

Characteristics of System in a Package of Synchronous Dynamic Random Access Memory for High-Speed Data Storage Applications. / Lai, Yeong Lin; Chiang, Wen Jung.

In: IEEE Transactions on Magnetics, Vol. 50, No. 7, 6851288, 01.07.2014.

Research output: Contribution to journalArticle

TY - JOUR

T1 - Characteristics of System in a Package of Synchronous Dynamic Random Access Memory for High-Speed Data Storage Applications

AU - Lai, Yeong Lin

AU - Chiang, Wen Jung

PY - 2014/7/1

Y1 - 2014/7/1

N2 - This paper proposes a system in a package (SiP) integrating a system on a chip (SoC) and a double-data-rate-three synchronous dynamic random access memory (DDR3 SDRAM) for advanced data-storage-based systems. The characteristics of high frequency, signal integrity (SI), and power integrity (PI) were investigated for the SoC/DDR3-SDRAM SiP. The SiP exhibited low insertion loss, wide eye-diagram aperture, and low power impedance. The effect of de-coupling capacitors on the SiP was also examined. The SoC/DDR3-SDRAM SiP achieved excellent performance for high-speed data storage applications.

AB - This paper proposes a system in a package (SiP) integrating a system on a chip (SoC) and a double-data-rate-three synchronous dynamic random access memory (DDR3 SDRAM) for advanced data-storage-based systems. The characteristics of high frequency, signal integrity (SI), and power integrity (PI) were investigated for the SoC/DDR3-SDRAM SiP. The SiP exhibited low insertion loss, wide eye-diagram aperture, and low power impedance. The effect of de-coupling capacitors on the SiP was also examined. The SoC/DDR3-SDRAM SiP achieved excellent performance for high-speed data storage applications.

UR - http://www.scopus.com/inward/record.url?scp=84952833626&partnerID=8YFLogxK

UR - http://www.scopus.com/inward/citedby.url?scp=84952833626&partnerID=8YFLogxK

U2 - 10.1109/TMAG.2014.2306797

DO - 10.1109/TMAG.2014.2306797

M3 - Article

AN - SCOPUS:84952833626

VL - 50

JO - IEEE Transactions on Magnetics

JF - IEEE Transactions on Magnetics

SN - 0018-9464

IS - 7

M1 - 6851288

ER -