Characteristics of a system in a package with silver wires

Yeong Lin Lai, Wen Jung Chiang

Research output: Chapter in Book/Report/Conference proceedingConference contribution

2 Citations (Scopus)

Abstract

This study examined the high-speed characteristics of a system in a package (SiP) including a system on a chip (SoC) and a double-data-rate-three synchronous dynamic random access memory (DDR3 SDRAM) chip. The SiP was a multi-chip-module thin-profile fine-pitch ball grid array (MCM TFBGA) package with a four-layer substrate. High-speed DDR3 signals with a 1600-Mbps data rate were used in the signal integrity (SI) analysis. The SiP with low-cost silver (Ag) wires displayed a 500.18-ps aperture width in an eye diagram, which successfully met the SI performance requirement. This study thus demonstrated that the SiP with Ag wires would have significant potential for advanced high-speed product applications.

Original languageEnglish
Title of host publicationMaterials and Technologies in Precision Machinery
EditorsGow-Yi Tzou
PublisherTrans Tech Publications Ltd
Pages121-127
Number of pages7
ISBN (Print)9783038355731
DOIs
Publication statusPublished - 2015 Jan 1
Event1st International Conference on Precision Machinery and Manufacturing Technology, ICPMMT 2015 - Pingtung, Taiwan
Duration: 2015 May 222015 May 24

Publication series

NameKey Engineering Materials
Volume661
ISSN (Print)1013-9826

Other

Other1st International Conference on Precision Machinery and Manufacturing Technology, ICPMMT 2015
CountryTaiwan
CityPingtung
Period15-05-2215-05-24

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All Science Journal Classification (ASJC) codes

  • Materials Science(all)
  • Mechanics of Materials
  • Mechanical Engineering

Cite this

Lai, Y. L., & Chiang, W. J. (2015). Characteristics of a system in a package with silver wires. In G-Y. Tzou (Ed.), Materials and Technologies in Precision Machinery (pp. 121-127). (Key Engineering Materials; Vol. 661). Trans Tech Publications Ltd. https://doi.org/10.4028/www.scientific.net/KEM.661.121