Abstract
This paper presents a capacitor discharge sintering process with a homemade silver-nickel paste for thermoelectric element interconnections. The paste is a 75 nm silver/nickel composite mixture. Without using any specific atmosphere control, the capacitor discharge is capable of nanoparticle sintering with time-efficient process at room temperature. A 0.01 F capacitor is serially connected to the sample and charged to 10 V (0.5 Joule) for the sintering process. To evaluate the conductivity of the sintered composite, the conductive material is screen-printed on an Al2 O3 ceramic substrate; it forms a rectangular tunnel to bridge two silver electrodes. After sintering process, the resistance of the screened conductive pass-way is dropped from 9.47 Ω to 0.35 Ω. The bonding strength and high temperature resistance test results of the sintered composite is also presented in this paper. Without generating a lot of heat, the sintering process can be applicable to flexible electronics.
| Original language | English |
|---|---|
| Title of host publication | 9th IEEE International Conference on Nano/Micro Engineered and Molecular Systems, IEEE-NEMS 2014 |
| Publisher | Institute of Electrical and Electronics Engineers Inc. |
| Pages | 370-373 |
| Number of pages | 4 |
| ISBN (Electronic) | 9781479947270 |
| DOIs | |
| Publication status | Published - 2014 Jan 1 |
| Event | 9th IEEE International Conference on Nano/Micro Engineered and Molecular Systems, IEEE-NEMS 2014 - Waikiki Beach, United States Duration: 2014 Apr 13 → 2014 Apr 16 |
Publication series
| Name | 9th IEEE International Conference on Nano/Micro Engineered and Molecular Systems, IEEE-NEMS 2014 |
|---|
Other
| Other | 9th IEEE International Conference on Nano/Micro Engineered and Molecular Systems, IEEE-NEMS 2014 |
|---|---|
| Country | United States |
| City | Waikiki Beach |
| Period | 14-04-13 → 14-04-16 |
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All Science Journal Classification (ASJC) codes
- Control and Systems Engineering
- Electrical and Electronic Engineering
Cite this
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Capacitor discharge sintering with silver-nickel nano-composite in the interconnection of thermoelectric generators. / Lu, C. H.; Lin, Y. C.; Wang, Kerwin; Dai, M. J.; Liu, C. K.; Liao, L. L.; Chien, H. C.; Chen, Y. S.
9th IEEE International Conference on Nano/Micro Engineered and Molecular Systems, IEEE-NEMS 2014. Institute of Electrical and Electronics Engineers Inc., 2014. p. 370-373 6908829 (9th IEEE International Conference on Nano/Micro Engineered and Molecular Systems, IEEE-NEMS 2014).Research output: Chapter in Book/Report/Conference proceeding › Conference contribution
TY - GEN
T1 - Capacitor discharge sintering with silver-nickel nano-composite in the interconnection of thermoelectric generators
AU - Lu, C. H.
AU - Lin, Y. C.
AU - Wang, Kerwin
AU - Dai, M. J.
AU - Liu, C. K.
AU - Liao, L. L.
AU - Chien, H. C.
AU - Chen, Y. S.
PY - 2014/1/1
Y1 - 2014/1/1
N2 - This paper presents a capacitor discharge sintering process with a homemade silver-nickel paste for thermoelectric element interconnections. The paste is a 75 nm silver/nickel composite mixture. Without using any specific atmosphere control, the capacitor discharge is capable of nanoparticle sintering with time-efficient process at room temperature. A 0.01 F capacitor is serially connected to the sample and charged to 10 V (0.5 Joule) for the sintering process. To evaluate the conductivity of the sintered composite, the conductive material is screen-printed on an Al2 O3 ceramic substrate; it forms a rectangular tunnel to bridge two silver electrodes. After sintering process, the resistance of the screened conductive pass-way is dropped from 9.47 Ω to 0.35 Ω. The bonding strength and high temperature resistance test results of the sintered composite is also presented in this paper. Without generating a lot of heat, the sintering process can be applicable to flexible electronics.
AB - This paper presents a capacitor discharge sintering process with a homemade silver-nickel paste for thermoelectric element interconnections. The paste is a 75 nm silver/nickel composite mixture. Without using any specific atmosphere control, the capacitor discharge is capable of nanoparticle sintering with time-efficient process at room temperature. A 0.01 F capacitor is serially connected to the sample and charged to 10 V (0.5 Joule) for the sintering process. To evaluate the conductivity of the sintered composite, the conductive material is screen-printed on an Al2 O3 ceramic substrate; it forms a rectangular tunnel to bridge two silver electrodes. After sintering process, the resistance of the screened conductive pass-way is dropped from 9.47 Ω to 0.35 Ω. The bonding strength and high temperature resistance test results of the sintered composite is also presented in this paper. Without generating a lot of heat, the sintering process can be applicable to flexible electronics.
UR - http://www.scopus.com/inward/record.url?scp=84908657921&partnerID=8YFLogxK
UR - http://www.scopus.com/inward/citedby.url?scp=84908657921&partnerID=8YFLogxK
U2 - 10.1109/NEMS.2014.6908829
DO - 10.1109/NEMS.2014.6908829
M3 - Conference contribution
T3 - 9th IEEE International Conference on Nano/Micro Engineered and Molecular Systems, IEEE-NEMS 2014
SP - 370
EP - 373
BT - 9th IEEE International Conference on Nano/Micro Engineered and Molecular Systems, IEEE-NEMS 2014
PB - Institute of Electrical and Electronics Engineers Inc.
ER -