Capacitor discharge sintering with silver-nickel nano-composite in the interconnection of thermoelectric generators

C. H. Lu, Y. C. Lin, Kerwin Wang, M. J. Dai, C. K. Liu, L. L. Liao, H. C. Chien, Y. S. Chen

Research output: Chapter in Book/Report/Conference proceedingConference contribution

1 Citation (Scopus)

Abstract

This paper presents a capacitor discharge sintering process with a homemade silver-nickel paste for thermoelectric element interconnections. The paste is a 75 nm silver/nickel composite mixture. Without using any specific atmosphere control, the capacitor discharge is capable of nanoparticle sintering with time-efficient process at room temperature. A 0.01 F capacitor is serially connected to the sample and charged to 10 V (0.5 Joule) for the sintering process. To evaluate the conductivity of the sintered composite, the conductive material is screen-printed on an Al2 O3 ceramic substrate; it forms a rectangular tunnel to bridge two silver electrodes. After sintering process, the resistance of the screened conductive pass-way is dropped from 9.47 Ω to 0.35 Ω. The bonding strength and high temperature resistance test results of the sintered composite is also presented in this paper. Without generating a lot of heat, the sintering process can be applicable to flexible electronics.

Original languageEnglish
Title of host publication9th IEEE International Conference on Nano/Micro Engineered and Molecular Systems, IEEE-NEMS 2014
PublisherInstitute of Electrical and Electronics Engineers Inc.
Pages370-373
Number of pages4
ISBN (Electronic)9781479947270
DOIs
Publication statusPublished - 2014 Jan 1
Event9th IEEE International Conference on Nano/Micro Engineered and Molecular Systems, IEEE-NEMS 2014 - Waikiki Beach, United States
Duration: 2014 Apr 132014 Apr 16

Publication series

Name9th IEEE International Conference on Nano/Micro Engineered and Molecular Systems, IEEE-NEMS 2014

Other

Other9th IEEE International Conference on Nano/Micro Engineered and Molecular Systems, IEEE-NEMS 2014
CountryUnited States
CityWaikiki Beach
Period14-04-1314-04-16

Fingerprint

Silver
Capacitors
Sintering
Nickel
Composite materials
Flexible electronics
Conductive materials
Adhesive pastes
Tunnels
Nanoparticles
Temperature
Electrodes
Substrates

All Science Journal Classification (ASJC) codes

  • Control and Systems Engineering
  • Electrical and Electronic Engineering

Cite this

Lu, C. H., Lin, Y. C., Wang, K., Dai, M. J., Liu, C. K., Liao, L. L., ... Chen, Y. S. (2014). Capacitor discharge sintering with silver-nickel nano-composite in the interconnection of thermoelectric generators. In 9th IEEE International Conference on Nano/Micro Engineered and Molecular Systems, IEEE-NEMS 2014 (pp. 370-373). [6908829] (9th IEEE International Conference on Nano/Micro Engineered and Molecular Systems, IEEE-NEMS 2014). Institute of Electrical and Electronics Engineers Inc.. https://doi.org/10.1109/NEMS.2014.6908829
Lu, C. H. ; Lin, Y. C. ; Wang, Kerwin ; Dai, M. J. ; Liu, C. K. ; Liao, L. L. ; Chien, H. C. ; Chen, Y. S. / Capacitor discharge sintering with silver-nickel nano-composite in the interconnection of thermoelectric generators. 9th IEEE International Conference on Nano/Micro Engineered and Molecular Systems, IEEE-NEMS 2014. Institute of Electrical and Electronics Engineers Inc., 2014. pp. 370-373 (9th IEEE International Conference on Nano/Micro Engineered and Molecular Systems, IEEE-NEMS 2014).
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abstract = "This paper presents a capacitor discharge sintering process with a homemade silver-nickel paste for thermoelectric element interconnections. The paste is a 75 nm silver/nickel composite mixture. Without using any specific atmosphere control, the capacitor discharge is capable of nanoparticle sintering with time-efficient process at room temperature. A 0.01 F capacitor is serially connected to the sample and charged to 10 V (0.5 Joule) for the sintering process. To evaluate the conductivity of the sintered composite, the conductive material is screen-printed on an Al2 O3 ceramic substrate; it forms a rectangular tunnel to bridge two silver electrodes. After sintering process, the resistance of the screened conductive pass-way is dropped from 9.47 Ω to 0.35 Ω. The bonding strength and high temperature resistance test results of the sintered composite is also presented in this paper. Without generating a lot of heat, the sintering process can be applicable to flexible electronics.",
author = "Lu, {C. H.} and Lin, {Y. C.} and Kerwin Wang and Dai, {M. J.} and Liu, {C. K.} and Liao, {L. L.} and Chien, {H. C.} and Chen, {Y. S.}",
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Lu, CH, Lin, YC, Wang, K, Dai, MJ, Liu, CK, Liao, LL, Chien, HC & Chen, YS 2014, Capacitor discharge sintering with silver-nickel nano-composite in the interconnection of thermoelectric generators. in 9th IEEE International Conference on Nano/Micro Engineered and Molecular Systems, IEEE-NEMS 2014., 6908829, 9th IEEE International Conference on Nano/Micro Engineered and Molecular Systems, IEEE-NEMS 2014, Institute of Electrical and Electronics Engineers Inc., pp. 370-373, 9th IEEE International Conference on Nano/Micro Engineered and Molecular Systems, IEEE-NEMS 2014, Waikiki Beach, United States, 14-04-13. https://doi.org/10.1109/NEMS.2014.6908829

Capacitor discharge sintering with silver-nickel nano-composite in the interconnection of thermoelectric generators. / Lu, C. H.; Lin, Y. C.; Wang, Kerwin; Dai, M. J.; Liu, C. K.; Liao, L. L.; Chien, H. C.; Chen, Y. S.

9th IEEE International Conference on Nano/Micro Engineered and Molecular Systems, IEEE-NEMS 2014. Institute of Electrical and Electronics Engineers Inc., 2014. p. 370-373 6908829 (9th IEEE International Conference on Nano/Micro Engineered and Molecular Systems, IEEE-NEMS 2014).

Research output: Chapter in Book/Report/Conference proceedingConference contribution

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T1 - Capacitor discharge sintering with silver-nickel nano-composite in the interconnection of thermoelectric generators

AU - Lu, C. H.

AU - Lin, Y. C.

AU - Wang, Kerwin

AU - Dai, M. J.

AU - Liu, C. K.

AU - Liao, L. L.

AU - Chien, H. C.

AU - Chen, Y. S.

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N2 - This paper presents a capacitor discharge sintering process with a homemade silver-nickel paste for thermoelectric element interconnections. The paste is a 75 nm silver/nickel composite mixture. Without using any specific atmosphere control, the capacitor discharge is capable of nanoparticle sintering with time-efficient process at room temperature. A 0.01 F capacitor is serially connected to the sample and charged to 10 V (0.5 Joule) for the sintering process. To evaluate the conductivity of the sintered composite, the conductive material is screen-printed on an Al2 O3 ceramic substrate; it forms a rectangular tunnel to bridge two silver electrodes. After sintering process, the resistance of the screened conductive pass-way is dropped from 9.47 Ω to 0.35 Ω. The bonding strength and high temperature resistance test results of the sintered composite is also presented in this paper. Without generating a lot of heat, the sintering process can be applicable to flexible electronics.

AB - This paper presents a capacitor discharge sintering process with a homemade silver-nickel paste for thermoelectric element interconnections. The paste is a 75 nm silver/nickel composite mixture. Without using any specific atmosphere control, the capacitor discharge is capable of nanoparticle sintering with time-efficient process at room temperature. A 0.01 F capacitor is serially connected to the sample and charged to 10 V (0.5 Joule) for the sintering process. To evaluate the conductivity of the sintered composite, the conductive material is screen-printed on an Al2 O3 ceramic substrate; it forms a rectangular tunnel to bridge two silver electrodes. After sintering process, the resistance of the screened conductive pass-way is dropped from 9.47 Ω to 0.35 Ω. The bonding strength and high temperature resistance test results of the sintered composite is also presented in this paper. Without generating a lot of heat, the sintering process can be applicable to flexible electronics.

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M3 - Conference contribution

T3 - 9th IEEE International Conference on Nano/Micro Engineered and Molecular Systems, IEEE-NEMS 2014

SP - 370

EP - 373

BT - 9th IEEE International Conference on Nano/Micro Engineered and Molecular Systems, IEEE-NEMS 2014

PB - Institute of Electrical and Electronics Engineers Inc.

ER -

Lu CH, Lin YC, Wang K, Dai MJ, Liu CK, Liao LL et al. Capacitor discharge sintering with silver-nickel nano-composite in the interconnection of thermoelectric generators. In 9th IEEE International Conference on Nano/Micro Engineered and Molecular Systems, IEEE-NEMS 2014. Institute of Electrical and Electronics Engineers Inc. 2014. p. 370-373. 6908829. (9th IEEE International Conference on Nano/Micro Engineered and Molecular Systems, IEEE-NEMS 2014). https://doi.org/10.1109/NEMS.2014.6908829