Balanced Diplexer Design Using Multi-Layered Substrate Integrated Waveguide Cavities

Jen Chih Li, Muhammad Mimsyad, Cheng You Hou, Chung I.G. Hsu, Min Hua Ho

Research output: Chapter in Book/Report/Conference proceedingConference contribution

Abstract

This paper presents balanced diplexer design using multi-layered substrate integrated waveguide cavities (SIWCs). Four SIWCs are employed in the diplexer design, and each of the two duplexing bands is created by two vertically stacked SIWCs. Two types of the diplexers are proposed, one is the single mode resonance of the SIWC, and the other is the dual-mode resonance. The former has its SIWC either an mathbf{TE}-{mathbf{102}} or mathbf{TE}-{mathbf{201}} mode resonance and the latter is under the dual-mode (both mathbf{TE}-{mathbf{102}} and mathbf{TE}-{mathbf{201}}) operation. A paired CPW is used to form the balanced common port and the SMAs are applied in the balanced duplexing ports. The dual-mode diplexer exhibits a wider bandwidth and sharper band-edges than those of the single-mode due to the dual-mode's double circuit order effect. Experiments are conducted to verify the circuit design and reasonable agreements are observed between the measured and simulated data.

Original languageEnglish
Title of host publication2018 48th European Microwave Conference, EuMC 2018
PublisherInstitute of Electrical and Electronics Engineers Inc.
Pages707-710
Number of pages4
ISBN (Electronic)9782874870514
DOIs
Publication statusPublished - 2018 Nov 20
Event48th European Microwave Conference, EuMC 2018 - Madrid, Spain
Duration: 2018 Sep 252018 Sep 27

Publication series

Name2018 48th European Microwave Conference, EuMC 2018

Other

Other48th European Microwave Conference, EuMC 2018
CountrySpain
CityMadrid
Period18-09-2518-09-27

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All Science Journal Classification (ASJC) codes

  • Computer Networks and Communications
  • Instrumentation
  • Radiation

Cite this

Li, J. C., Mimsyad, M., Hou, C. Y., Hsu, C. I. G., & Ho, M. H. (2018). Balanced Diplexer Design Using Multi-Layered Substrate Integrated Waveguide Cavities. In 2018 48th European Microwave Conference, EuMC 2018 (pp. 707-710). [8541624] (2018 48th European Microwave Conference, EuMC 2018). Institute of Electrical and Electronics Engineers Inc.. https://doi.org/10.23919/EuMC.2018.8541624