Abstract
This paper presents an image processing approach that calculates the probe mark area on semiconductor wafer pads. The electrical characteristics of the chip pad must be tested using a probing needle before wire-bonding to the wafer. However, this test leaves probe marks on the pad. A large probe mark area results in poor adhesion forces at the bond ball of the pad, thus leading to undesirable products. Traditionally, given the difficulty of calculating the area of the irregular probe mark, probe mark area calculations were substituted by calculating the area of the oval that is manually drawn to cover the probe mark area. Nevertheless, this method is inaccurate, and the results varied from person to person. In this paper, we present an imaging processing approach to calculate the probe mark area utilizing high magnification microscopes to capture probe mark images. Our approach is faster and more accurate compared to traditional methods.
| Original language | English |
|---|---|
| Title of host publication | Proceedings of the 2010 5th IEEE Conference on Industrial Electronics and Applications, ICIEA 2010 |
| Pages | 414-419 |
| Number of pages | 6 |
| DOIs | |
| Publication status | Published - 2010 Sep 1 |
| Event | 5th IEEE Conference on Industrial Electronics and Applications, ICIEA 2010 - Taichung, Taiwan Duration: 2010 Jun 15 → 2010 Jun 17 |
Other
| Other | 5th IEEE Conference on Industrial Electronics and Applications, ICIEA 2010 |
|---|---|
| Country | Taiwan |
| City | Taichung |
| Period | 10-06-15 → 10-06-17 |
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All Science Journal Classification (ASJC) codes
- Electrical and Electronic Engineering
Cite this
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Application of image processing to wafer probe mark area calculation. / Wang, Chau-Shing; Yang, Wen-Ren; Chung, Cheng Yen; Chang, Wen Liang.
Proceedings of the 2010 5th IEEE Conference on Industrial Electronics and Applications, ICIEA 2010. 2010. p. 414-419 5516928.Research output: Chapter in Book/Report/Conference proceeding › Conference contribution
TY - GEN
T1 - Application of image processing to wafer probe mark area calculation
AU - Wang, Chau-Shing
AU - Yang, Wen-Ren
AU - Chung, Cheng Yen
AU - Chang, Wen Liang
PY - 2010/9/1
Y1 - 2010/9/1
N2 - This paper presents an image processing approach that calculates the probe mark area on semiconductor wafer pads. The electrical characteristics of the chip pad must be tested using a probing needle before wire-bonding to the wafer. However, this test leaves probe marks on the pad. A large probe mark area results in poor adhesion forces at the bond ball of the pad, thus leading to undesirable products. Traditionally, given the difficulty of calculating the area of the irregular probe mark, probe mark area calculations were substituted by calculating the area of the oval that is manually drawn to cover the probe mark area. Nevertheless, this method is inaccurate, and the results varied from person to person. In this paper, we present an imaging processing approach to calculate the probe mark area utilizing high magnification microscopes to capture probe mark images. Our approach is faster and more accurate compared to traditional methods.
AB - This paper presents an image processing approach that calculates the probe mark area on semiconductor wafer pads. The electrical characteristics of the chip pad must be tested using a probing needle before wire-bonding to the wafer. However, this test leaves probe marks on the pad. A large probe mark area results in poor adhesion forces at the bond ball of the pad, thus leading to undesirable products. Traditionally, given the difficulty of calculating the area of the irregular probe mark, probe mark area calculations were substituted by calculating the area of the oval that is manually drawn to cover the probe mark area. Nevertheless, this method is inaccurate, and the results varied from person to person. In this paper, we present an imaging processing approach to calculate the probe mark area utilizing high magnification microscopes to capture probe mark images. Our approach is faster and more accurate compared to traditional methods.
UR - http://www.scopus.com/inward/record.url?scp=77956054175&partnerID=8YFLogxK
UR - http://www.scopus.com/inward/citedby.url?scp=77956054175&partnerID=8YFLogxK
U2 - 10.1109/ICIEA.2010.5516928
DO - 10.1109/ICIEA.2010.5516928
M3 - Conference contribution
SN - 9781424450466
SP - 414
EP - 419
BT - Proceedings of the 2010 5th IEEE Conference on Industrial Electronics and Applications, ICIEA 2010
ER -