Application of image processing to wafer probe mark area calculation

Chau-Shing Wang, Wen-Ren Yang, Cheng Yen Chung, Wen Liang Chang

Research output: Chapter in Book/Report/Conference proceedingConference contribution

2 Citations (Scopus)

Abstract

This paper presents an image processing approach that calculates the probe mark area on semiconductor wafer pads. The electrical characteristics of the chip pad must be tested using a probing needle before wire-bonding to the wafer. However, this test leaves probe marks on the pad. A large probe mark area results in poor adhesion forces at the bond ball of the pad, thus leading to undesirable products. Traditionally, given the difficulty of calculating the area of the irregular probe mark, probe mark area calculations were substituted by calculating the area of the oval that is manually drawn to cover the probe mark area. Nevertheless, this method is inaccurate, and the results varied from person to person. In this paper, we present an imaging processing approach to calculate the probe mark area utilizing high magnification microscopes to capture probe mark images. Our approach is faster and more accurate compared to traditional methods.

Original languageEnglish
Title of host publicationProceedings of the 2010 5th IEEE Conference on Industrial Electronics and Applications, ICIEA 2010
Pages414-419
Number of pages6
DOIs
Publication statusPublished - 2010 Sep 1
Event5th IEEE Conference on Industrial Electronics and Applications, ICIEA 2010 - Taichung, Taiwan
Duration: 2010 Jun 152010 Jun 17

Other

Other5th IEEE Conference on Industrial Electronics and Applications, ICIEA 2010
CountryTaiwan
CityTaichung
Period10-06-1510-06-17

Fingerprint

Image processing
Needles
Microscopes
Adhesion
Wire
Semiconductor materials
Imaging techniques
Processing

All Science Journal Classification (ASJC) codes

  • Electrical and Electronic Engineering

Cite this

Wang, C-S., Yang, W-R., Chung, C. Y., & Chang, W. L. (2010). Application of image processing to wafer probe mark area calculation. In Proceedings of the 2010 5th IEEE Conference on Industrial Electronics and Applications, ICIEA 2010 (pp. 414-419). [5516928] https://doi.org/10.1109/ICIEA.2010.5516928
Wang, Chau-Shing ; Yang, Wen-Ren ; Chung, Cheng Yen ; Chang, Wen Liang. / Application of image processing to wafer probe mark area calculation. Proceedings of the 2010 5th IEEE Conference on Industrial Electronics and Applications, ICIEA 2010. 2010. pp. 414-419
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abstract = "This paper presents an image processing approach that calculates the probe mark area on semiconductor wafer pads. The electrical characteristics of the chip pad must be tested using a probing needle before wire-bonding to the wafer. However, this test leaves probe marks on the pad. A large probe mark area results in poor adhesion forces at the bond ball of the pad, thus leading to undesirable products. Traditionally, given the difficulty of calculating the area of the irregular probe mark, probe mark area calculations were substituted by calculating the area of the oval that is manually drawn to cover the probe mark area. Nevertheless, this method is inaccurate, and the results varied from person to person. In this paper, we present an imaging processing approach to calculate the probe mark area utilizing high magnification microscopes to capture probe mark images. Our approach is faster and more accurate compared to traditional methods.",
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Wang, C-S, Yang, W-R, Chung, CY & Chang, WL 2010, Application of image processing to wafer probe mark area calculation. in Proceedings of the 2010 5th IEEE Conference on Industrial Electronics and Applications, ICIEA 2010., 5516928, pp. 414-419, 5th IEEE Conference on Industrial Electronics and Applications, ICIEA 2010, Taichung, Taiwan, 10-06-15. https://doi.org/10.1109/ICIEA.2010.5516928

Application of image processing to wafer probe mark area calculation. / Wang, Chau-Shing; Yang, Wen-Ren; Chung, Cheng Yen; Chang, Wen Liang.

Proceedings of the 2010 5th IEEE Conference on Industrial Electronics and Applications, ICIEA 2010. 2010. p. 414-419 5516928.

Research output: Chapter in Book/Report/Conference proceedingConference contribution

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AB - This paper presents an image processing approach that calculates the probe mark area on semiconductor wafer pads. The electrical characteristics of the chip pad must be tested using a probing needle before wire-bonding to the wafer. However, this test leaves probe marks on the pad. A large probe mark area results in poor adhesion forces at the bond ball of the pad, thus leading to undesirable products. Traditionally, given the difficulty of calculating the area of the irregular probe mark, probe mark area calculations were substituted by calculating the area of the oval that is manually drawn to cover the probe mark area. Nevertheless, this method is inaccurate, and the results varied from person to person. In this paper, we present an imaging processing approach to calculate the probe mark area utilizing high magnification microscopes to capture probe mark images. Our approach is faster and more accurate compared to traditional methods.

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Wang C-S, Yang W-R, Chung CY, Chang WL. Application of image processing to wafer probe mark area calculation. In Proceedings of the 2010 5th IEEE Conference on Industrial Electronics and Applications, ICIEA 2010. 2010. p. 414-419. 5516928 https://doi.org/10.1109/ICIEA.2010.5516928