An improved thermal Type microsensor with thermal Isolation microcracks

Research output: Chapter in Book/Report/Conference proceedingConference contribution

Abstract

A new idea of improving complementary metal-oxide-semiconductor (CMOS) thermopile performance is introduced to reduce the thermal conductance by leading the microcracks into structure of thermopile, which greatly increases the heat flow barrier. A highly sensitive infrared detector requires a low thermal conductance to maximize the temperature change and signal induced by incident IR radiation. Several designs of infrared microsensors are proposed to study influential parameters from microcrack for improving performance of thermopile. To that end, by using some adequate designs of polysilicon architecture, we can greatly reduce the heat flow from the main stream without introducing further electric resistance, which is related with noise. Firstly we develop such a structure of thermopile with low thermal conductance and high performance by using CMOS compatible process which can be easily and exactly fabricated. The suspended structure of infrared sensors is used in this study to provide ideal, thermally isolated, structures for support of the thin film detector. We also simulate the heat flow of the new structures. The results show good match with our original idea.

Original languageEnglish
Title of host publicationManufacturing Science and Engineering I
Pages4230-4233
Number of pages4
DOIs
Publication statusPublished - 2010 Apr 22
Event2009 International Conference on Manufacturing Science and Engineering, ICMSE 2009 - Zhuhai, China
Duration: 2009 Dec 262009 Dec 28

Publication series

NameAdvanced Materials Research
Volume97-101
ISSN (Print)1022-6680

Other

Other2009 International Conference on Manufacturing Science and Engineering, ICMSE 2009
CountryChina
CityZhuhai
Period09-12-2609-12-28

Fingerprint

Thermopiles
Microsensors
Microcracks
Heat transfer
Infrared radiation
Infrared detectors
Metals
Polysilicon
Detectors
Thin films
Hot Temperature
Sensors
Temperature
Oxide semiconductors

All Science Journal Classification (ASJC) codes

  • Engineering(all)

Cite this

Cai, Y. Z., Shen, C-H., & Chen, S. J. (2010). An improved thermal Type microsensor with thermal Isolation microcracks. In Manufacturing Science and Engineering I (pp. 4230-4233). (Advanced Materials Research; Vol. 97-101). https://doi.org/10.4028/www.scientific.net/AMR.97-101.4230
Cai, Yun Zi ; Shen, Chih-Hsiung ; Chen, Shu Jung. / An improved thermal Type microsensor with thermal Isolation microcracks. Manufacturing Science and Engineering I. 2010. pp. 4230-4233 (Advanced Materials Research).
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Cai, YZ, Shen, C-H & Chen, SJ 2010, An improved thermal Type microsensor with thermal Isolation microcracks. in Manufacturing Science and Engineering I. Advanced Materials Research, vol. 97-101, pp. 4230-4233, 2009 International Conference on Manufacturing Science and Engineering, ICMSE 2009, Zhuhai, China, 09-12-26. https://doi.org/10.4028/www.scientific.net/AMR.97-101.4230

An improved thermal Type microsensor with thermal Isolation microcracks. / Cai, Yun Zi; Shen, Chih-Hsiung; Chen, Shu Jung.

Manufacturing Science and Engineering I. 2010. p. 4230-4233 (Advanced Materials Research; Vol. 97-101).

Research output: Chapter in Book/Report/Conference proceedingConference contribution

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Cai YZ, Shen C-H, Chen SJ. An improved thermal Type microsensor with thermal Isolation microcracks. In Manufacturing Science and Engineering I. 2010. p. 4230-4233. (Advanced Materials Research). https://doi.org/10.4028/www.scientific.net/AMR.97-101.4230