Abstract
A new idea of improving complementary metal-oxide-semiconductor (CMOS) thermopile performance is introduced to reduce the thermal conductance by leading the microcracks into structure of thermopile, which greatly increases the heat flow barrier. A highly sensitive infrared detector requires a low thermal conductance to maximize the temperature change and signal induced by incident IR radiation. Several designs of infrared microsensors are proposed to study influential parameters from microcrack for improving performance of thermopile. To that end, by using some adequate designs of polysilicon architecture, we can greatly reduce the heat flow from the main stream without introducing further electric resistance, which is related with noise. Firstly we develop such a structure of thermopile with low thermal conductance and high performance by using CMOS compatible process which can be easily and exactly fabricated. The suspended structure of infrared sensors is used in this study to provide ideal, thermally isolated, structures for support of the thin film detector. We also simulate the heat flow of the new structures. The results show good match with our original idea.
| Original language | English |
|---|---|
| Title of host publication | Manufacturing Science and Engineering I |
| Pages | 4230-4233 |
| Number of pages | 4 |
| DOIs | |
| Publication status | Published - 2010 Apr 22 |
| Event | 2009 International Conference on Manufacturing Science and Engineering, ICMSE 2009 - Zhuhai, China Duration: 2009 Dec 26 → 2009 Dec 28 |
Publication series
| Name | Advanced Materials Research |
|---|---|
| Volume | 97-101 |
| ISSN (Print) | 1022-6680 |
Other
| Other | 2009 International Conference on Manufacturing Science and Engineering, ICMSE 2009 |
|---|---|
| Country | China |
| City | Zhuhai |
| Period | 09-12-26 → 09-12-28 |
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All Science Journal Classification (ASJC) codes
- Engineering(all)
Cite this
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An improved thermal Type microsensor with thermal Isolation microcracks. / Cai, Yun Zi; Shen, Chih-Hsiung; Chen, Shu Jung.
Manufacturing Science and Engineering I. 2010. p. 4230-4233 (Advanced Materials Research; Vol. 97-101).Research output: Chapter in Book/Report/Conference proceeding › Conference contribution
TY - GEN
T1 - An improved thermal Type microsensor with thermal Isolation microcracks
AU - Cai, Yun Zi
AU - Shen, Chih-Hsiung
AU - Chen, Shu Jung
PY - 2010/4/22
Y1 - 2010/4/22
N2 - A new idea of improving complementary metal-oxide-semiconductor (CMOS) thermopile performance is introduced to reduce the thermal conductance by leading the microcracks into structure of thermopile, which greatly increases the heat flow barrier. A highly sensitive infrared detector requires a low thermal conductance to maximize the temperature change and signal induced by incident IR radiation. Several designs of infrared microsensors are proposed to study influential parameters from microcrack for improving performance of thermopile. To that end, by using some adequate designs of polysilicon architecture, we can greatly reduce the heat flow from the main stream without introducing further electric resistance, which is related with noise. Firstly we develop such a structure of thermopile with low thermal conductance and high performance by using CMOS compatible process which can be easily and exactly fabricated. The suspended structure of infrared sensors is used in this study to provide ideal, thermally isolated, structures for support of the thin film detector. We also simulate the heat flow of the new structures. The results show good match with our original idea.
AB - A new idea of improving complementary metal-oxide-semiconductor (CMOS) thermopile performance is introduced to reduce the thermal conductance by leading the microcracks into structure of thermopile, which greatly increases the heat flow barrier. A highly sensitive infrared detector requires a low thermal conductance to maximize the temperature change and signal induced by incident IR radiation. Several designs of infrared microsensors are proposed to study influential parameters from microcrack for improving performance of thermopile. To that end, by using some adequate designs of polysilicon architecture, we can greatly reduce the heat flow from the main stream without introducing further electric resistance, which is related with noise. Firstly we develop such a structure of thermopile with low thermal conductance and high performance by using CMOS compatible process which can be easily and exactly fabricated. The suspended structure of infrared sensors is used in this study to provide ideal, thermally isolated, structures for support of the thin film detector. We also simulate the heat flow of the new structures. The results show good match with our original idea.
UR - http://www.scopus.com/inward/record.url?scp=77950978834&partnerID=8YFLogxK
UR - http://www.scopus.com/inward/citedby.url?scp=77950978834&partnerID=8YFLogxK
U2 - 10.4028/www.scientific.net/AMR.97-101.4230
DO - 10.4028/www.scientific.net/AMR.97-101.4230
M3 - Conference contribution
SN - 0878492801
SN - 9780878492800
T3 - Advanced Materials Research
SP - 4230
EP - 4233
BT - Manufacturing Science and Engineering I
ER -