An adhesion strength measurement method for particle transfer and assembly in dry environment

Sho Fu Wang, Yen Ting Lin, Yan Bo Lin, Kerwin Wang

Research output: Chapter in Book/Report/Conference proceedingConference contribution

Abstract

This research presents a new and noncontact method to measure the adhesion strength between micro-particles and substrates in parallel. It is cost effective and time saving. In this study, the adhesion strength between micro solder ball and PDMS (polydimethylsiloxane) and ReproRubber® (polymethylhylhydrogen) are investigated. The setup is capable of evaluating more than 8 particles separately each run. The experiment results indicated that the adhesion strength is highly dependent on surface conditions, parts geometry and material properties. The testing results also have been applied to successive parts transferring and assembling.

Original languageEnglish
Title of host publication2012 7th IEEE International Conference on Nano/Micro Engineered and Molecular Systems, NEMS 2012
Pages355-358
Number of pages4
DOIs
Publication statusPublished - 2012 Jun 1
Event7th IEEE International Conference on Nano/Micro Engineered and Molecular Systems, NEMS 2012 - Kyoto, Japan
Duration: 2012 Mar 52012 Mar 8

Publication series

Name2012 7th IEEE International Conference on Nano/Micro Engineered and Molecular Systems, NEMS 2012

Other

Other7th IEEE International Conference on Nano/Micro Engineered and Molecular Systems, NEMS 2012
CountryJapan
CityKyoto
Period12-03-0512-03-08

All Science Journal Classification (ASJC) codes

  • Engineering (miscellaneous)

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  • Cite this

    Wang, S. F., Lin, Y. T., Lin, Y. B., & Wang, K. (2012). An adhesion strength measurement method for particle transfer and assembly in dry environment. In 2012 7th IEEE International Conference on Nano/Micro Engineered and Molecular Systems, NEMS 2012 (pp. 355-358). [6196792] (2012 7th IEEE International Conference on Nano/Micro Engineered and Molecular Systems, NEMS 2012). https://doi.org/10.1109/NEMS.2012.6196792