An adhesion strength measurement method for particle transfer and assembly in dry environment

Sho Fu Wang, Yen Ting Lin, Yan Bo Lin, Kerwin Wang

Research output: Chapter in Book/Report/Conference proceedingConference contribution

Abstract

This research presents a new and noncontact method to measure the adhesion strength between micro-particles and substrates in parallel. It is cost effective and time saving. In this study, the adhesion strength between micro solder ball and PDMS (polydimethylsiloxane) and ReproRubber® (polymethylhylhydrogen) are investigated. The setup is capable of evaluating more than 8 particles separately each run. The experiment results indicated that the adhesion strength is highly dependent on surface conditions, parts geometry and material properties. The testing results also have been applied to successive parts transferring and assembling.

Original languageEnglish
Title of host publication2012 7th IEEE International Conference on Nano/Micro Engineered and Molecular Systems, NEMS 2012
Pages355-358
Number of pages4
DOIs
Publication statusPublished - 2012 Jun 1
Event7th IEEE International Conference on Nano/Micro Engineered and Molecular Systems, NEMS 2012 - Kyoto, Japan
Duration: 2012 Mar 52012 Mar 8

Publication series

Name2012 7th IEEE International Conference on Nano/Micro Engineered and Molecular Systems, NEMS 2012

Other

Other7th IEEE International Conference on Nano/Micro Engineered and Molecular Systems, NEMS 2012
CountryJapan
CityKyoto
Period12-03-0512-03-08

Fingerprint

Bond strength (materials)
Polydimethylsiloxane
Soldering alloys
Materials properties
Geometry
Testing
Substrates
Costs
Experiments

All Science Journal Classification (ASJC) codes

  • Engineering (miscellaneous)

Cite this

Wang, S. F., Lin, Y. T., Lin, Y. B., & Wang, K. (2012). An adhesion strength measurement method for particle transfer and assembly in dry environment. In 2012 7th IEEE International Conference on Nano/Micro Engineered and Molecular Systems, NEMS 2012 (pp. 355-358). [6196792] (2012 7th IEEE International Conference on Nano/Micro Engineered and Molecular Systems, NEMS 2012). https://doi.org/10.1109/NEMS.2012.6196792
Wang, Sho Fu ; Lin, Yen Ting ; Lin, Yan Bo ; Wang, Kerwin. / An adhesion strength measurement method for particle transfer and assembly in dry environment. 2012 7th IEEE International Conference on Nano/Micro Engineered and Molecular Systems, NEMS 2012. 2012. pp. 355-358 (2012 7th IEEE International Conference on Nano/Micro Engineered and Molecular Systems, NEMS 2012).
@inproceedings{a1512aaa8ec34372818fdbe7366d59b4,
title = "An adhesion strength measurement method for particle transfer and assembly in dry environment",
abstract = "This research presents a new and noncontact method to measure the adhesion strength between micro-particles and substrates in parallel. It is cost effective and time saving. In this study, the adhesion strength between micro solder ball and PDMS (polydimethylsiloxane) and ReproRubber{\circledR} (polymethylhylhydrogen) are investigated. The setup is capable of evaluating more than 8 particles separately each run. The experiment results indicated that the adhesion strength is highly dependent on surface conditions, parts geometry and material properties. The testing results also have been applied to successive parts transferring and assembling.",
author = "Wang, {Sho Fu} and Lin, {Yen Ting} and Lin, {Yan Bo} and Kerwin Wang",
year = "2012",
month = "6",
day = "1",
doi = "10.1109/NEMS.2012.6196792",
language = "English",
isbn = "9781467311243",
series = "2012 7th IEEE International Conference on Nano/Micro Engineered and Molecular Systems, NEMS 2012",
pages = "355--358",
booktitle = "2012 7th IEEE International Conference on Nano/Micro Engineered and Molecular Systems, NEMS 2012",

}

Wang, SF, Lin, YT, Lin, YB & Wang, K 2012, An adhesion strength measurement method for particle transfer and assembly in dry environment. in 2012 7th IEEE International Conference on Nano/Micro Engineered and Molecular Systems, NEMS 2012., 6196792, 2012 7th IEEE International Conference on Nano/Micro Engineered and Molecular Systems, NEMS 2012, pp. 355-358, 7th IEEE International Conference on Nano/Micro Engineered and Molecular Systems, NEMS 2012, Kyoto, Japan, 12-03-05. https://doi.org/10.1109/NEMS.2012.6196792

An adhesion strength measurement method for particle transfer and assembly in dry environment. / Wang, Sho Fu; Lin, Yen Ting; Lin, Yan Bo; Wang, Kerwin.

2012 7th IEEE International Conference on Nano/Micro Engineered and Molecular Systems, NEMS 2012. 2012. p. 355-358 6196792 (2012 7th IEEE International Conference on Nano/Micro Engineered and Molecular Systems, NEMS 2012).

Research output: Chapter in Book/Report/Conference proceedingConference contribution

TY - GEN

T1 - An adhesion strength measurement method for particle transfer and assembly in dry environment

AU - Wang, Sho Fu

AU - Lin, Yen Ting

AU - Lin, Yan Bo

AU - Wang, Kerwin

PY - 2012/6/1

Y1 - 2012/6/1

N2 - This research presents a new and noncontact method to measure the adhesion strength between micro-particles and substrates in parallel. It is cost effective and time saving. In this study, the adhesion strength between micro solder ball and PDMS (polydimethylsiloxane) and ReproRubber® (polymethylhylhydrogen) are investigated. The setup is capable of evaluating more than 8 particles separately each run. The experiment results indicated that the adhesion strength is highly dependent on surface conditions, parts geometry and material properties. The testing results also have been applied to successive parts transferring and assembling.

AB - This research presents a new and noncontact method to measure the adhesion strength between micro-particles and substrates in parallel. It is cost effective and time saving. In this study, the adhesion strength between micro solder ball and PDMS (polydimethylsiloxane) and ReproRubber® (polymethylhylhydrogen) are investigated. The setup is capable of evaluating more than 8 particles separately each run. The experiment results indicated that the adhesion strength is highly dependent on surface conditions, parts geometry and material properties. The testing results also have been applied to successive parts transferring and assembling.

UR - http://www.scopus.com/inward/record.url?scp=84861550445&partnerID=8YFLogxK

UR - http://www.scopus.com/inward/citedby.url?scp=84861550445&partnerID=8YFLogxK

U2 - 10.1109/NEMS.2012.6196792

DO - 10.1109/NEMS.2012.6196792

M3 - Conference contribution

AN - SCOPUS:84861550445

SN - 9781467311243

T3 - 2012 7th IEEE International Conference on Nano/Micro Engineered and Molecular Systems, NEMS 2012

SP - 355

EP - 358

BT - 2012 7th IEEE International Conference on Nano/Micro Engineered and Molecular Systems, NEMS 2012

ER -

Wang SF, Lin YT, Lin YB, Wang K. An adhesion strength measurement method for particle transfer and assembly in dry environment. In 2012 7th IEEE International Conference on Nano/Micro Engineered and Molecular Systems, NEMS 2012. 2012. p. 355-358. 6196792. (2012 7th IEEE International Conference on Nano/Micro Engineered and Molecular Systems, NEMS 2012). https://doi.org/10.1109/NEMS.2012.6196792