Abstract
This research presents a new and noncontact method to measure the adhesion strength between micro-particles and substrates in parallel. It is cost effective and time saving. In this study, the adhesion strength between micro solder ball and PDMS (polydimethylsiloxane) and ReproRubber® (polymethylhylhydrogen) are investigated. The setup is capable of evaluating more than 8 particles separately each run. The experiment results indicated that the adhesion strength is highly dependent on surface conditions, parts geometry and material properties. The testing results also have been applied to successive parts transferring and assembling.
| Original language | English |
|---|---|
| Title of host publication | 2012 7th IEEE International Conference on Nano/Micro Engineered and Molecular Systems, NEMS 2012 |
| Pages | 355-358 |
| Number of pages | 4 |
| DOIs | |
| Publication status | Published - 2012 Jun 1 |
| Event | 7th IEEE International Conference on Nano/Micro Engineered and Molecular Systems, NEMS 2012 - Kyoto, Japan Duration: 2012 Mar 5 → 2012 Mar 8 |
Publication series
| Name | 2012 7th IEEE International Conference on Nano/Micro Engineered and Molecular Systems, NEMS 2012 |
|---|
Other
| Other | 7th IEEE International Conference on Nano/Micro Engineered and Molecular Systems, NEMS 2012 |
|---|---|
| Country | Japan |
| City | Kyoto |
| Period | 12-03-05 → 12-03-08 |
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All Science Journal Classification (ASJC) codes
- Engineering (miscellaneous)
Cite this
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An adhesion strength measurement method for particle transfer and assembly in dry environment. / Wang, Sho Fu; Lin, Yen Ting; Lin, Yan Bo; Wang, Kerwin.
2012 7th IEEE International Conference on Nano/Micro Engineered and Molecular Systems, NEMS 2012. 2012. p. 355-358 6196792 (2012 7th IEEE International Conference on Nano/Micro Engineered and Molecular Systems, NEMS 2012).Research output: Chapter in Book/Report/Conference proceeding › Conference contribution
TY - GEN
T1 - An adhesion strength measurement method for particle transfer and assembly in dry environment
AU - Wang, Sho Fu
AU - Lin, Yen Ting
AU - Lin, Yan Bo
AU - Wang, Kerwin
PY - 2012/6/1
Y1 - 2012/6/1
N2 - This research presents a new and noncontact method to measure the adhesion strength between micro-particles and substrates in parallel. It is cost effective and time saving. In this study, the adhesion strength between micro solder ball and PDMS (polydimethylsiloxane) and ReproRubber® (polymethylhylhydrogen) are investigated. The setup is capable of evaluating more than 8 particles separately each run. The experiment results indicated that the adhesion strength is highly dependent on surface conditions, parts geometry and material properties. The testing results also have been applied to successive parts transferring and assembling.
AB - This research presents a new and noncontact method to measure the adhesion strength between micro-particles and substrates in parallel. It is cost effective and time saving. In this study, the adhesion strength between micro solder ball and PDMS (polydimethylsiloxane) and ReproRubber® (polymethylhylhydrogen) are investigated. The setup is capable of evaluating more than 8 particles separately each run. The experiment results indicated that the adhesion strength is highly dependent on surface conditions, parts geometry and material properties. The testing results also have been applied to successive parts transferring and assembling.
UR - http://www.scopus.com/inward/record.url?scp=84861550445&partnerID=8YFLogxK
UR - http://www.scopus.com/inward/citedby.url?scp=84861550445&partnerID=8YFLogxK
U2 - 10.1109/NEMS.2012.6196792
DO - 10.1109/NEMS.2012.6196792
M3 - Conference contribution
AN - SCOPUS:84861550445
SN - 9781467311243
T3 - 2012 7th IEEE International Conference on Nano/Micro Engineered and Molecular Systems, NEMS 2012
SP - 355
EP - 358
BT - 2012 7th IEEE International Conference on Nano/Micro Engineered and Molecular Systems, NEMS 2012
ER -